Author: Publisher:
ISBN:
Category : Computers
Languages : en
Pages : 1074
Book Description
Electro ... Conference Record
Author: The Aging Workforce
Author: Science Abstracts
Author: Proceedings
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 684
Book Description
IEEE Proceedings of the Southeastcon
Author: Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 332
Book Description
Digital Signal Processing Applications with the TMS320 Family
Author: Kun-Shan LinPublisher: Prentice Hall
ISBN:
Category : Computers
Languages : en
Pages : 584
Book Description
The last of a three-volume set which provides a collection of application reports on the TMS320 family of DSP microprocessors. Volume III focuses on floating-point applications.
Electronic Materials Handbook
Author: Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Proceedings of COMPSTAT'2010
Author: Yves LechevallierPublisher: Springer Science & Business Media
ISBN: 3790826049
Category : Computers
Languages : en
Pages : 627
Book Description
Proceedings of the 19th international symposium on computational statistics, held in Paris august 22-27, 2010.Together with 3 keynote talks, there were 14 invited sessions and more than 100 peer-reviewed contributed communications.
1987 Proceedings
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 696
Book Description
Understanding Smart Sensors
Author: Randy FrankPublisher: Artech House
ISBN: 1608075079
Category : Technology & Engineering
Languages : en
Pages : 390
Book Description
Now in its third edition, Understanding Smart Sensors is the most complete, up-to-date, and authoritative summary of the latest applications and developments impacting smart sensors in a single volume. This thoroughly expanded and revised edition of an Artech bestseller contains a wealth of new material, including critical coverage of sensor fusion and energy harvesting, the latest details on wireless technology, the role and challenges involved with sensor apps and cloud sensing, greater emphasis on applications throughout the book, and dozens of figures and examples of current technologies from over 50 companies. This edition provides you with knowledge regarding a broad spectrum of possibilities for technology advancements based on current industry, university and national laboratories R & D efforts in smart sensors. Updated material also identifies the need for trusted sensing, the efforts of many organizations that impact smart sensing, and more. Utilizing the latest in smart sensor, microelectromechanical systems (MEMS) and microelectronic research and development, you get the technical and practical information you need keep your designs and products on the cutting edge. Plus, you see how network (wired and wireless) connectivity continues to impact smart sensor development. By combining information on micromachining and microelectronics, this is the first book that links these two important aspects of smart sensor technology so you don't have to keep multiple references on hand. This comprehensive resource also includes an extensive list of smart sensor acronyms and a glossary of key terms. With an effective blend of historical information and the latest content, the third edition of Understanding Smart Sensors provides a unique combination of foundational and future-changing information.