Author: Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Wafer scale integration ; 2
Author: Wafer Scale Integration, II
Author: R. M. LeaPublisher: North Holland
ISBN:
Category : Computers
Languages : en
Pages : 268
Book Description
Wafer Scale Integration
Author: Earl E. Swartzlander Jr.Publisher: Springer Science & Business Media
ISBN: 1461316219
Category : Technology & Engineering
Languages : en
Pages : 515
Book Description
Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
International Conference on Wafer Scale Integration. Proceedings ; 2
Author: Wafer scale integration ; 3
Author: Wafer Scale Integration,
Author: C. R. JesshopePublisher: CRC Press
ISBN:
Category : Integrated circuits
Languages : en
Pages : 296
Book Description
This book, the first to deal wholly with the topic of wafer scale integration, is the edited proceedings of a workshop held at the University of Southampton in July 1985. As the first international meeting held on this subject it attracted many participants from Europe and the United States. The meeting was particularly timely as there has recently been a renewed interest in research and commercial exploitation of wafer scale integration. The papers presented in the book cover the whole range of topics important in wafer scale integration, beginning with a critical review of fault-tolerant chips and wafer scale integration. Sections on general problems and interconnection strategies follow. There are then six papaers on architectures and four on restructurable very large scale integration. The book concludes with three reviews of different aspects of testability.
Wafer scale integration ; 1
Author: Wafer Scale Integration
Author: Michael J. LittleWafer-Scale Integration
Author: A Standard Test Interface for Wafer Scale Integration
Author: Padmaraj SinghPublisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 162
Book Description