Author: Katherine Juliet HerrickPublisher:
ISBN:
Category :
Languages : en
Pages : 530
Book Description
W-band Three-dimensional Integrated Circuits Utilizing Silicon Micromachining
Author: Katherine Juliet HerrickPublisher:
ISBN:
Category :
Languages : en
Pages : 530
Book Description
Three Dimensional Integration and Packaging Using Silicon Micromachining
Author: Alexandros D. MargomenosPublisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 394
Book Description
Chemical Abstracts
Author: Introduction To Modern Planar Transmission Lines
Author: Anand K. VermaPublisher: John Wiley & Sons
ISBN: 1119632471
Category : Technology & Engineering
Languages : en
Pages : 946
Book Description
Provides a comprehensive discussion of planar transmission lines and their applications, focusing on physical understanding, analytical approach, and circuit models Planar transmission lines form the core of the modern high-frequency communication, computer, and other related technology. This advanced text gives a complete overview of the technology and acts as a comprehensive tool for radio frequency (RF) engineers that reflects a linear discussion of the subject from fundamentals to more complex arguments. Introduction to Modern Planar Transmission Lines: Physical, Analytical, and Circuit Models Approach begins with a discussion of waves on transmission lines and waves in material medium, including a large number of illustrative examples from published results. After explaining the electrical properties of dielectric media, the book moves on to the details of various transmission lines including waveguide, microstrip line, co-planar waveguide, strip line, slot line, and coupled transmission lines. A number of special and advanced topics are discussed in later chapters, such as fabrication of planar transmission lines, static variational methods for planar transmission lines, multilayer planar transmission lines, spectral domain analysis, resonators, periodic lines and surfaces, and metamaterial realization and circuit models. Emphasizes modeling using physical concepts, circuit-models, closed-form expressions, and full derivation of a large number of expressions Explains advanced mathematical treatment, such as the variation method, conformal mapping method, and SDA Connects each section of the text with forward and backward cross-referencing to aid in personalized self-study Introduction to Modern Planar Transmission Lines is an ideal book for senior undergraduate and graduate students of the subject. It will also appeal to new researchers with the inter-disciplinary background, as well as to engineers and professionals in industries utilizing RF/microwave technologies.
Microwave Micromachined Cavity Filters
Author: Lee HarleRFIC and MMIC Design and Technology
Author: I.D. RobertsonPublisher: IET
ISBN: 0852967861
Category : Technology & Engineering
Languages : en
Pages : 583
Book Description
This book gives an in-depth account of GaAs, InP and SiGe, technologies and describes all the key techniques for the design of amplifiers, ranging from filters and data converters to image oscillators, mixers, switches, variable attenuators, phase shifters, integrated antennas and complete monolithic transceivers.
Multifunctional Adaptive Microwave Circuits and Systems
Author: Michael Bernard SteerPublisher: SciTech Publishing
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 484
Book Description
"This book is an introduction to Multi-functional, Adaptive Radio Radar and Sensor systems. The book presents the findings of the five year project entitled "MARRS: Multifunctional Adaptive Radio and Sensors" that ran from 2001 to 2008. It presents a systematic approach to the system level design required to develop MARRS technology."--BOOK JACKET.
Circuits and Applications Using Silicon Heterostructure Devices
Author: John D. CresslerPublisher: CRC Press
ISBN: 1420066951
Category : Technology & Engineering
Languages : en
Pages : 360
Book Description
No matter how you slice it, semiconductor devices power the communications revolution. Skeptical? Imagine for a moment that you could flip a switch and instantly remove all the integrated circuits from planet Earth. A moment’s reflection would convince you that there is not a single field of human endeavor that would not come to a grinding halt, be it commerce, agriculture, education, medicine, or entertainment. Life, as we have come to expect it, would simply cease to exist. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume covers SiGe circuit applications in the real world. Edited by John D. Cressler, with contributions from leading experts in the field, this book presents a broad overview of the merits of SiGe for emerging communications systems. Coverage spans new techniques for improved LNA design, RF to millimeter-wave IC design, SiGe MMICs, SiGe Millimeter-Wave ICs, and wireless building blocks using SiGe HBTs. The book provides a glimpse into the future, as envisioned by industry leaders.
Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications
Author: Swagata Riki BanerjeePublisher:
ISBN:
Category :
Languages : en
Pages : 382
Book Description
Author: