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Author: Andreas Burg Publisher: Springer ISBN: 3642450733 Category : Computers Languages : en Pages : 245
Book Description
This book contains extended and revised versions of the best papers presented at the 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, held in Santa Cruz, CA, USA, in October 2012. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
Author: Manfred Glesner Publisher: Springer ISBN: 0387334033 Category : Computers Languages : en Pages : 315
Book Description
This book contains extended and revised versions of the best papers that have been presented during the twelfth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a Global System-on-a-Chip Design & CAD Conference. The 12* edition was held at the Lufthansa Training Center in Seeheim-Jugenheim, south of Darmstadt, Germany (December 1-3, 2003). Previous conferences have taken place in Edinburgh (81), Trondheim (83), Tokyo (85), Vancouver (87), Munich (89), Edinburgh (91), Grenoble (93), Tokyo (95), Gramado (97), Lisbon (99)andMontpellier(01). The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5, is to provide a forum to exchange ideas and show research results in the field of microelectronics design. The current trend toward increasing chip integration brings about exhilarating new challenges both at the physical and system-design levels: this conference aims to address these exciting new issues. The 2003 edition of VLSI-SoC conserved the traditional structure, which has been successful in previous editions. The quality of submissions (142 papers) made the selection process difficult, but finally 57 papers and 14 posters were accepted for presentation in VLSI-SoC 2003. Submissions came from Austria, Bulgaria, Brazil, Canada, Egypt, England, Estonia, Finland, France, Germany, Greece, Hungary, India, Iran, Israel, Italy, Japan, Korea, Malaysia, Mexico, Netherlands, Poland, Portugal, Romania, Spain, Sweden, Taiwan and the United States of America. From 57 papers presented at the conference, 18 were selected to have an extended and revised version included in this book.
Author: Veena S. Chakravarthi Publisher: Springer Nature ISBN: 3031183630 Category : Technology & Engineering Languages : en Pages : 355
Book Description
Now in a thoroughly revised second edition, this practical practitioner guide provides a comprehensive overview of the SoC design process. It explains end-to-end system on chip (SoC) design processes and includes updated coverage of design methodology, the design environment, EDA tool flow, design decisions, choice of design intellectual property (IP) cores, sign-off procedures, and design infrastructure requirements. The second edition provides new information on SOC trends and updated design cases. Coverage also includes critical advanced guidance on the latest UPF-based low power design flow, challenges of deep submicron technologies, and 3D design fundamentals, which will prepare the readers for the challenges of working at the nanotechnology scale. A Practical Approach to VLSI System on Chip (SoC) Design: A Comprehensive Guide, Second Edition provides engineers who aspire to become VLSI designers with all the necessary information and details of EDA tools. It will be a valuable professional reference for those working on VLSI design and verification portfolios in complex SoC designs
Author: Michail Maniatakos Publisher: Springer ISBN: 303015663X Category : Computers Languages : en Pages : 271
Book Description
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.
Author: Andreas Burg Publisher: Springer ISBN: 3642450733 Category : Computers Languages : en Pages : 245
Book Description
This book contains extended and revised versions of the best papers presented at the 20th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2012, held in Santa Cruz, CA, USA, in October 2012. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.
Author: Michael Stefano Fritz Schaffner Publisher: BoD – Books on Demand ISBN: 3866286244 Category : Science Languages : en Pages : 294
Book Description
Multiview autostereoscopic displays (MADs) make it possible to view video content in 3D without wearing special glasses, and such displays have recently become available. The main problem of MADs is that they require several (typically 8 or 9) views, while most of the 3D video content is in stereoscopic 3D today. To bridge this content-display gap, the research community started to devise automatic multiview synthesis (MVS) methods. Common MVS methods are based on depth-image-based rendering, where a dense depth map of the scene is used to reproject the image to new viewpoints. Although physically correct, this approach requires accurate depth maps and additional inpainting steps. Our work uses an alternative conversion concept based on image domain warping (IDW) which has been successfully applied to related problems such as aspect ratio retargeting for streaming video, and dispa- rity remapping for depth adjustments in stereoscopic 3D content. IDW shows promising performance in this context as it only requires robust, sparse point- correspondences and no inpainting steps. However, MVS, using IDW as well as alternative approaches, is computationally demanding and requires realtime processing - yet such methods should be portable to end-user and even mobile devices to develop their full potential. To this end, this thesis investigates efficient algorithms and hardware architectures for a variety of subproblems arising in the MVS pipeline.
Author: Kurt Hoffmann Publisher: John Wiley & Sons ISBN: 0470020695 Category : Technology & Engineering Languages : en Pages : 510
Book Description
The development of large-scale integrated systems on a chip has had a dramatic effect on circuit design methodology. Recent years have seen an escalation of interest in systems level integration (system-on-a-chip) and the development of low power, high chip density circuits and systems. Kurt Hoffmann sets out to address a wide range of issues relating to the design and integration of integrated circuit components and provides readers with the methodology by which simple equations for the estimation of transistor geometries and circuit behaviour can be deduced. The broad coverage of this unique book ranges from field effect transistor design, MOS transistor modelling and the fundamentals of digital CMOS circuit design through to MOS memory architecture and design. Highlights the increasing requirement for information on system-on-a-chip design and integration. Combines coverage of semiconductor physics, digital VLSI design and analog integrated circuits in one volume for the first time. Written with the aim of bridging the gap between semiconductor device physics and practical circuit design. Introduces the basic behaviour of semiconductor components for ICs and covers the design of both digital and analog circuits in CMOS and BiCMOS technologies. Broad coverage will appeal to both students and practising engineers alike. Written by a respected expert in the field with a proven track record of publications in this field. Drawing upon considerable experience within both industry and academia, Hoffmann’s outstanding text, will prove an invaluable resource for designers, practising engineers in the semiconductor device field and electronics systems industry as well as Postgraduate students of microelectronics, electrical and computer engineering.
Author: Ming-Bo Lin Publisher: CRC Press ISBN: 1439897328 Category : Technology & Engineering Languages : en Pages : 890
Book Description
With the advance of semiconductors and ubiquitous computing, the use of system-on-a-chip (SoC) has become an essential technique to reduce product cost. With this progress and continuous reduction of feature sizes, and the development of very large-scale integration (VLSI) circuits, addressing the harder problems requires fundamental understanding
Author: Hubert Kaeslin Publisher: Cambridge University Press ISBN: 0521882672 Category : Technology & Engineering Languages : en Pages : 878
Book Description
This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.
Author: Veena S. Chakravarthi Publisher: Springer Nature ISBN: 303023049X Category : Technology & Engineering Languages : en Pages : 335
Book Description
This book provides a comprehensive overview of the VLSI design process. It covers end-to-end system on chip (SoC) design, including design methodology, the design environment, tools, choice of design components, handoff procedures, and design infrastructure needs. The book also offers critical guidance on the latest UPF-based low power design flow issues for deep submicron SOC designs, which will prepare readers for the challenges of working at the nanotechnology scale. This practical guide will provide engineers who aspire to be VLSI designers with the techniques and tools of the trade, and will also be a valuable professional reference for those already working in VLSI design and verification with a focus on complex SoC designs. A comprehensive practical guide for VLSI designers; Covers end-to-end VLSI SoC design flow; Includes source code, case studies, and application examples.
Author: Andreas Burg
Author: Manfred Glesner
Author: Veena S. Chakravarthi
Author: Michail Maniatakos
Author: Andreas Burg
Author: Michael Stefano Fritz Schaffner
Author: Andreas Burg
Author: Kurt Hoffmann
Author: Ming-Bo Lin
Author: Hubert Kaeslin
Author: Veena S. Chakravarthi