Author: Harry Johnstone FisherPublisher:
ISBN:
Category :
Languages : en
Pages : 11
Book Description
Viscosity and Density of Liquid Lead-tin and Antimony-cadmium Alloys
Author: Harry Johnstone FisherPublisher:
ISBN:
Category :
Languages : en
Pages : 11
Book Description
Lead and Lead Alloys
Author: Wilhelm HofmannPublisher: Springer-Verlag
ISBN: 3662285088
Category : Science
Languages : de
Pages : 565
Book Description
Lead and Lead Alloys
Author: Wilhelm HofmannPublisher:
ISBN:
Category : Science
Languages : en
Pages : 572
Book Description
Tin and Solder Plating in the Semiconductor Industry
Author: A.C. TanPublisher: Springer Science & Business Media
ISBN: 9780412482403
Category : Technology & Engineering
Languages : en
Pages : 358
Book Description
The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Minerals Yearbook
Author: Modern Electroplating
Author: Mordechay SchlesingerPublisher: John Wiley & Sons
ISBN: 0470167785
Category : Science
Languages : en
Pages : 755
Book Description
The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.
Liquid-metals Handbook
Author: Reflow Soldering Processes
Author: Ning-Cheng LeePublisher: Elsevier
ISBN: 008049224X
Category : Technology & Engineering
Languages : en
Pages : 281
Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable.Provides engineers the cutting-edge technology in a rapidly changing fieldOffers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Casting Properties of Metals and Alloys
Author: Alekseĭ Mikhaĭlovich KorolʹkovPublisher:
ISBN:
Category : Alloys
Languages : en
Pages : 170
Book Description
Structure and Properties of Liquid Metals
Author: American Society for MetalsPublisher:
ISBN:
Category : Kinetic theory of liquids
Languages : en
Pages : 150
Book Description