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Author: Ohmi Publisher: Routledge ISBN: 1351406426 Category : Science Languages : en Pages : 948
Book Description
Evaluating the effectiveness of conventional wet processes for cleaning silicon wafers in semiconductor production, this reference reveals concrete measures to improve ultrapure water quality reviewing the structure and physical characteristics of ultrapure water molecules. The volume is divided int
Author: Ohmi Publisher: Routledge ISBN: 1351406426 Category : Science Languages : en Pages : 948
Book Description
Evaluating the effectiveness of conventional wet processes for cleaning silicon wafers in semiconductor production, this reference reveals concrete measures to improve ultrapure water quality reviewing the structure and physical characteristics of ultrapure water molecules. The volume is divided int
Author: Ohmi Publisher: CRC Press ISBN: 9780367402341 Category : Languages : en Pages : 944
Book Description
Evaluating the effectiveness of conventional wet processes for cleaning silicon wafers in semiconductor production, this reference reveals concrete measures to improve ultrapure water quality reviewing the structure and physical characteristics of ultrapure water molecules. The volume is divided int
Author: Karen Reinhardt Publisher: William Andrew ISBN: 0815517734 Category : Technology & Engineering Languages : en Pages : 749
Book Description
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. - Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits - As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries - Covers processes and equipment, as well as new materials and changes required for the surface conditioning process - Editors are two of the top names in the field and are both extensively published - Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol
Author: Karen A. Reinhardt Publisher: John Wiley & Sons ISBN: 1118099516 Category : Technology & Engineering Languages : en Pages : 596
Book Description
Provides an In-depth discussion of surface conditioning for semiconductor applications The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications provides an in-depth discussion of surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet processing is reviewed as well as surface and colloidal aspects of cleaning and etching. Topics covered in this new reference include: Front end line (FEOL) and back end of line (BEOL) cleaning applications such as high-k/metal gate post-etch cleaning and pore sealing, high-dose implant stripping and cleaning, and germanium, and silicon passivation Formulation development practices, methodology and a new directions are presented including chemicals used for preventing corrosion of copper lines, cleaning aluminium lines, reclaiming wafers, and water bonding, as well as the filtering and recirculating of chemicals including reuse and recycling Wetting, cleaning, and drying of features, such as high aspect ratio features and hydrophilic surface states, especially how to dry without watermarks, the abilities to wet hydrophobic surfaces and to remove liquid from deep features The chemical reactions and mechanisms of silicon dioxide etching with hydrofluoric acid, particle removal with ammonium hydroxide/hydrogen peroxide mixture, and metal removal with hydrochloric acid The Handbook of Cleaning for Semiconductor Manufacturing: Fundamentals and Applications is a valuable resource for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. Engineers working for semiconductor manufacturing, capital equipment, chemicals, or other industries that assures cleanliness of chemicals, material, and equipment in the manufacturing area will also find this handbook an indispensible reference.
Author: Takeshi Hattori Publisher: Springer Science & Business Media ISBN: 3662035359 Category : Technology & Engineering Languages : en Pages : 634
Book Description
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.
Author: Zeman Publisher: Routledge ISBN: 135143151X Category : Medical Languages : en Pages : 642
Book Description
Integrates knowledge on microfiltration and ultrification, membrane chemistry, and characterization methods with the engineering and economic aspects of device performance, device and module design, processes, and applications. The text provides a discussion of membrane fundamentals and an analytical framework for designing and developing new filtrations systems for a broad range of technologically important functions. It offers information on membrane liquid precursors, fractal and stochastic pore space analysis, novel and advanced module designs, and original process design calculations.
Author: Chue San Yoo Publisher: World Scientific Publishing Company ISBN: 9813106719 Category : Technology & Engineering Languages : en Pages : 483
Book Description
This textbook contains all the materials that an engineer needs to know to start a career in the semiconductor industry. It also provides readers with essential background information for semiconductor research. It is written by a professional who has been working in the field for over two decades and teaching the material to university students for the past 15 years. It includes process knowledge from raw material preparation to the passivation of chips in a modular format.
Author: Paul W. Mertens Publisher: Trans Tech Publications Ltd ISBN: 3035730849 Category : Technology & Engineering Languages : en Pages : 395
Book Description
Selected, peer reviewed papers from the 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 12-14, 2016, Knokke, Belgium
Author: Ohmi
Author: Ohmi
Author: Tadahiro Ōmi
Author: Ohmi
Author: Karen Reinhardt
Author: Karen A. Reinhardt
Author: Takeshi Hattori
Author: Zeman
Author: 
Author: Chue San Yoo
Author: Paul W. Mertens