Author: Don Millard Publisher: Institute of Electrical & Electronics Engineers(IEEE) ISBN: Category : Ball grid array technology Languages : en Pages : 504
Book Description
The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Author: Mohamed Haddar Publisher: Springer Science & Business Media ISBN: 3642371434 Category : Technology & Engineering Languages : en Pages : 653
Book Description
The 5th International Congress on Design and Modeling of Mechanical Systems (CMSM) was held in Djerba, Tunisia on March 25-27, 2013 and followed four previous successful editions, which brought together international experts in the fields of design and modeling of mechanical systems, thus contributing to the exchange of information and skills and leading to a considerable progress in research among the participating teams. The fifth edition of the congress (CMSM ́2013), organized by the Unit of Mechanics, Modeling and Manufacturing (U2MP) of the National School of Engineers of Sfax, Tunisia, the Mechanical Engineering Laboratory (MBL) of the National School of Engineers of Monastir, Tunisia and the Mechanics Laboratory of Sousse (LMS) of the National School of Engineers of Sousse, Tunisia, saw a significant increase of the international participation. This edition brought together nearly 300 attendees who exposed their work on the following topics: mechatronics and robotics, dynamics of mechanical systems, fluid structure interaction and vibroacoustics, modeling and analysis of materials and structures, design and manufacturing of mechanical systems. This book is the proceedings of CMSM ́2013 and contains a careful selection of high quality contributions, which were exposed during various sessions of the congress. The original articles presented here provide an overview of recent research advancements accomplished in the field mechanical engineering.
Author: John H. Lau Publisher: McGraw-Hill Professional Publishing ISBN: Category : Technology & Engineering Languages : en Pages : 600
Book Description
A guide to flip chip technologies, for professionals in flip chip and MCM research and development, and for engineers and technical managers choosing design and manufacturing processes for electronic packaging and interconnect systems. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications. Annotation copyright by Book News, Inc., Portland, OR
Author: Ning-Cheng Lee Publisher: Newnes ISBN: 0750672188 Category : Technology & Engineering Languages : en Pages : 282
Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author: Christopher Corti Publisher: CRC Press ISBN: 1420065262 Category : Science Languages : en Pages : 446
Book Description
Gold is used in a wide range of industrial and medical applications and accounts for over 10 percent of the annual demand for metal, worth billions of dollars annually. While much has been written about the mystique and trade of gold, very little has been written about the science and technology in which it is involved. Edited by two respected auth
Author: Don Millard![IEEE/CPMT International Electronic Manufacturing Technology Symposium : [proceedings]. PDF](https://books.google.com/books/content/images/frontcover/kAhWAAAAMAAJ?fife=w80-h100)
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Author: British Library. Document Supply Centre
Author: Mohamed Haddar
Author: John H. Lau
Author: Ning-Cheng Lee
Author: Christopher Corti