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Author: David J. Fisher Publisher: Materials Research Forum LLC ISBN: 1644900041 Category : Technology & Engineering Languages : en Pages : 166
Book Description
The book presents a complete overview on the topic of Transient Liquid Phase Bonding (TLPB) which has many high-tech applications, ranging from the production and repair of turbine engines in the aerospace industry, to nuclear power plants and the connection of circuit lines in the microelectronics industry. The TLPB process and its specific applications are presented in great detail: Self-Bonding of Pure Materials; Bonding Different Pure Materials; Self-Bonding of Composites; Self-Bonding of Simple Alloys; Self-Bonding of Complex Alloys; Bonding Same-Base Alloys; Bonding Different-Base Alloys; Bonding Ceramics to Ceramics; Bonding Ceramics to Metals. The book references 483 original resources and includes their direct web link for in-depth reading.
Author: David J. Fisher Publisher: Materials Research Forum LLC ISBN: 1644900041 Category : Technology & Engineering Languages : en Pages : 166
Book Description
The book presents a complete overview on the topic of Transient Liquid Phase Bonding (TLPB) which has many high-tech applications, ranging from the production and repair of turbine engines in the aerospace industry, to nuclear power plants and the connection of circuit lines in the microelectronics industry. The TLPB process and its specific applications are presented in great detail: Self-Bonding of Pure Materials; Bonding Different Pure Materials; Self-Bonding of Composites; Self-Bonding of Simple Alloys; Self-Bonding of Complex Alloys; Bonding Same-Base Alloys; Bonding Different-Base Alloys; Bonding Ceramics to Ceramics; Bonding Ceramics to Metals. The book references 483 original resources and includes their direct web link for in-depth reading.
Author: Robert Edward Monroe Publisher: ISBN: Category : Adhesives Languages : en Pages : 86
Book Description
This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).
Author: D.J. Stephenson Publisher: Springer Science & Business Media ISBN: 9401136742 Category : Technology & Engineering Languages : en Pages : 326
Book Description
There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .
Author: David J. Fisher Publisher: Materials Research Forum LLC ISBN: 164490005X Category : Technology & Engineering Languages : en Pages : 166
Book Description
The book presents a complete overview on the topic of Transient Liquid Phase Bonding (TLPB) which has many high-tech applications, ranging from the production and repair of turbine engines in the aerospace industry, to nuclear power plants and the connection of circuit lines in the microelectronics industry. The TLPB process and its specific applications are presented in great detail: Self-Bonding of Pure Materials; Bonding Different Pure Materials; Self-Bonding of Composites; Self-Bonding of Simple Alloys; Self-Bonding of Complex Alloys; Bonding Same-Base Alloys; Bonding Different-Base Alloys; Bonding Ceramics to Ceramics; Bonding Ceramics to Metals. The book references 483 original resources and includes their direct web link for in-depth reading.
Author: Kim S. Siow Publisher: Springer ISBN: 3319992562 Category : Technology & Engineering Languages : en Pages : 279
Book Description
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Author: David J. Fisher
Author: David J. Fisher
Author: Robert Edward Monroe
Author: William Douglas MacDonald
Author: Billy Mak
Author: Nicholas Seth Bosco
Author: D.J. Stephenson
Author: David J. Fisher
Author: Subhadravalli Venkata Chitti
Author: Kim S. Siow
Author: Annamalai Viswanathan