Author: Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 220
Book Description
Topics in Heat Transfer: Transport phenomena in biotechnology. Direct and indirect liquid cooling techniques in electronic packaging. Heat transfer in thermal storage systems. Multiple component convection
Author: Topics in Heat Transfer
Author: The Engineering Index Annual
Author: Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 2264
Book Description
Since its creation in 1884, Engineering Index has covered virtually every major engineering innovation from around the world. It serves as the historical record of virtually every major engineering innovation of the 20th century. Recent content is a vital resource for current awareness, new production information, technological forecasting and competitive intelligence. The world?s most comprehensive interdisciplinary engineering database, Engineering Index contains over 10.7 million records. Each year, over 500,000 new abstracts are added from over 5,000 scholarly journals, trade magazines, and conference proceedings. Coverage spans over 175 engineering disciplines from over 80 countries. Updated weekly.
Transport Phenomena in Food Processing
Author: Jorge Welti-ChanesPublisher: CRC Press
ISBN: 1420006266
Category : Science
Languages : en
Pages : 570
Book Description
Specifically developed for food engineers, this is an in-depth reference book that focuses on transport phenomena in food preservation. First it reviews the fundamental concepts regarding momentum, heat, and mass transfer. Then the book examines specific applications of these concepts into a variety of traditional and novel processes and products.
Food Processing Technology
Author: P.J. FellowsPublisher: Elsevier
ISBN: 1845696344
Category : Technology & Engineering
Languages : en
Pages : 932
Book Description
The first edition of Food processing technology was quickly adopted as the standard text by many food science and technology courses. This completely revised and updated third edition consolidates the position of this textbook as the best single-volume introduction to food manufacturing technologies available. This edition has been updated and extended to include the many developments that have taken place since the second edition was published. In particular, advances in microprocessor control of equipment, 'minimal' processing technologies, functional foods, developments in 'active' or 'intelligent' packaging, and storage and distribution logistics are described. Technologies that relate to cost savings, environmental improvement or enhanced product quality are highlighted. Additionally, sections in each chapter on the impact of processing on food-borne micro-organisms are included for the first time. - Introduces a range of processing techniques that are used in food manufacturing - Explains the key principles of each process, including the equipment used and the effects of processing on micro-organisms that contaminate foods - Describes post-processing operations, including packaging and distribution logistics
Fundamentals of Heat Exchanger Design
Author: Ramesh K. ShahPublisher: John Wiley & Sons
ISBN: 9780471321712
Category : Technology & Engineering
Languages : en
Pages : 978
Book Description
Comprehensive and unique source integrates the material usually distributed among a half a dozen sources. * Presents a unified approach to modeling of new designs and develops the skills for complex engineering analysis. * Provides industrial insight to the applications of the basic theory developed.
Heat Transfer in Medicine and Biology
Author: R.C. EberhartPublisher: Springer Science & Business Media
ISBN: 1468482858
Category : Science
Languages : en
Pages : 453
Book Description
Food Packaging Technology
Author: Richard ColesPublisher: CRC Press
ISBN: 9780849397882
Category : Technology & Engineering
Languages : en
Pages : 370
Book Description
The protection and preservation of a product, the launch of new products or re-launch of existing products, perception of added-value to products or services, and cost reduction in the supply chain are all objectives of food packaging. Taking into consideration the requirements specific to different products, how can one package successfully meet all of these goals? Food Packaging Technology provides a contemporary overview of food processing and packaging technologies. Covering the wide range of issues you face when developing innovative food packaging, the book includes: Food packaging strategy, design, and development Food biodeterioation and methods of preservation Packaged product quality and shelf life Logistical packaging for food marketing systems Packaging materials and processes The battle rages over which type of container should be used for which application. It is therefore necessary to consider which materials, or combination of materials and processes will best serve the market and enhance brand value. Food Packaging Technology gives you the tools to determine which form of packaging will meet your business goals without compromising the safety of your product.
Principles of Solar Engineering, Second Edition
Author: D. Yogi GoswamiPublisher: CRC Press
ISBN: 9781560327141
Category : Science
Languages : en
Pages : 718
Book Description
This second edition of Principles of Solar Engineering covers the latest developments in a broad range of topics of interest to students and professionals interested in solar energy applications. With the scientific fundamentals included, the book covers important areas such as heating and cooling, passive solar applications, detoxification and biomass energy conversion. This comprehensive textbook provides examples of methods of solar engineering from around the world and includes examples, solutions and data applicable to international solar energy issues. A solutions manual is available to qualified instructors.
Thermal Design of Electronic Equipment
Author: Ralph RemsburgPublisher: CRC Press
ISBN: 1351835912
Category : Technology & Engineering
Languages : en
Pages : 440
Book Description
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.