Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 818
Book Description
Scientific and Technical Aerospace Reports
Energy Research Abstracts
Author:
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 806
Book Description
Semiannual, with semiannual and annual indexes. References to all scientific and technical literature coming from DOE, its laboratories, energy centers, and contractors. Includes all works deriving from DOE, other related government-sponsored information, and foreign nonnuclear information. Arranged under 39 categories, e.g., Biomedical sciences, basic studies; Biomedical sciences, applied studies; Health and safety; and Fusion energy. Entry gives bibliographical information and abstract. Corporate, author, subject, report number indexes.
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 806
Book Description
Semiannual, with semiannual and annual indexes. References to all scientific and technical literature coming from DOE, its laboratories, energy centers, and contractors. Includes all works deriving from DOE, other related government-sponsored information, and foreign nonnuclear information. Arranged under 39 categories, e.g., Biomedical sciences, basic studies; Biomedical sciences, applied studies; Health and safety; and Fusion energy. Entry gives bibliographical information and abstract. Corporate, author, subject, report number indexes.
High Heat Flux Engineering
Cooling and Thermal Design of Electronic Systems
Author: Cristina H. Amon
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 246
Book Description
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 246
Book Description
Shape and Structure, from Engineering to Nature
Author: Adrian Bejan
Publisher: Cambridge University Press
ISBN: 9780521793889
Category : Science
Languages : en
Pages : 370
Book Description
Seemingly universal geometric forms unite the flow systems of engineering and nature. For example, tree-shaped flows can be seen in computers, lungs, dendritic crystals, urban street patterns, and communication links. In this groundbreaking book, Adrian Bejan considers the design and optimization of engineered systems and discovers a deterministic principle of the generation of geometric form in natural systems. Shape and structure spring from the struggle for better performance in both engineering and nature. This idea is the basis of the new constructal theory: the objective and constraints principle used in engineering is the same mechanism from which the geometry in natural flow systems emerges. From heat exchangers to river channels, the book draws many parallels between the engineered and the natural world. Among the topics covered are mechanical structure, thermal structure, heat trees, ducts and rivers, turbulent structure, and structure in transportation and economics. The numerous illustrations, examples, and homework problems in every chapter make this an ideal text for engineering design courses. Its provocative ideas will also appeal to a broad range of readers in engineering, natural sciences, economics, and business.
Publisher: Cambridge University Press
ISBN: 9780521793889
Category : Science
Languages : en
Pages : 370
Book Description
Seemingly universal geometric forms unite the flow systems of engineering and nature. For example, tree-shaped flows can be seen in computers, lungs, dendritic crystals, urban street patterns, and communication links. In this groundbreaking book, Adrian Bejan considers the design and optimization of engineered systems and discovers a deterministic principle of the generation of geometric form in natural systems. Shape and structure spring from the struggle for better performance in both engineering and nature. This idea is the basis of the new constructal theory: the objective and constraints principle used in engineering is the same mechanism from which the geometry in natural flow systems emerges. From heat exchangers to river channels, the book draws many parallels between the engineered and the natural world. Among the topics covered are mechanical structure, thermal structure, heat trees, ducts and rivers, turbulent structure, and structure in transportation and economics. The numerous illustrations, examples, and homework problems in every chapter make this an ideal text for engineering design courses. Its provocative ideas will also appeal to a broad range of readers in engineering, natural sciences, economics, and business.
Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 324
Book Description
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 324
Book Description
Thermal Performance of Nanofluids in Miniature Heat Sinks with Conduits
Author: S. Harikrishnan
Publisher: Springer Nature
ISBN: 9811678456
Category : Science
Languages : en
Pages : 105
Book Description
This comprehensive book focuses on the basic physical features and purpose of nanofluids and miniature heat sinks. The contents demonstrate the design modification, fabrication, experimental investigation, and various applications of miniature heat sinks. The book provides context for thermal performance of miniature heat sinks as well as summaries of experimental results correlations that reflect the current technical innovations are included. This book is a useful reference for both academia and industry alike.
Publisher: Springer Nature
ISBN: 9811678456
Category : Science
Languages : en
Pages : 105
Book Description
This comprehensive book focuses on the basic physical features and purpose of nanofluids and miniature heat sinks. The contents demonstrate the design modification, fabrication, experimental investigation, and various applications of miniature heat sinks. The book provides context for thermal performance of miniature heat sinks as well as summaries of experimental results correlations that reflect the current technical innovations are included. This book is a useful reference for both academia and industry alike.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Author: Ephraim Suhir
Publisher: CRC Press
ISBN: 0429863829
Category : Technology & Engineering
Languages : en
Pages : 344
Book Description
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Publisher: CRC Press
ISBN: 0429863829
Category : Technology & Engineering
Languages : en
Pages : 344
Book Description
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Microscale and Nanoscale Heat Transfer
Author: C.B. Sobhan
Publisher: CRC Press
ISBN: 1000654214
Category : Science
Languages : en
Pages : 327
Book Description
Through analyses, experimental results, and worked-out numerical examples, Microscale and Nanoscale Heat Transfer: Fundamentals and Engineering Applications explores the methods and observations of thermophysical phenomena in size-affected domains. Compiling the most relevant findings from the literature, along with results from their own re
Publisher: CRC Press
ISBN: 1000654214
Category : Science
Languages : en
Pages : 327
Book Description
Through analyses, experimental results, and worked-out numerical examples, Microscale and Nanoscale Heat Transfer: Fundamentals and Engineering Applications explores the methods and observations of thermophysical phenomena in size-affected domains. Compiling the most relevant findings from the literature, along with results from their own re
Fluid Mechanics and Fluid Power (Vol. 2)
Author: Suvanjan Bhattacharyya
Publisher: Springer Nature
ISBN: 9811969701
Category : Technology & Engineering
Languages : en
Pages : 541
Book Description
This book presents the select proceedings of the 48th National Conference on Fluid Mechanics and Fluid Power (FMFP 2021) held at BITS Pilani in December 2021. It covers the topics such as fluid mechanics, measurement techniques in fluid flows, computational fluid dynamics, instability, transition and turbulence, fluidâstructure interaction, multiphase flows, micro- and nanoscale transport, bio-fluid mechanics, aerodynamics, turbomachinery, propulsion and power. The book will be useful for researchers and professionals interested in the broad field of mechanics.
Publisher: Springer Nature
ISBN: 9811969701
Category : Technology & Engineering
Languages : en
Pages : 541
Book Description
This book presents the select proceedings of the 48th National Conference on Fluid Mechanics and Fluid Power (FMFP 2021) held at BITS Pilani in December 2021. It covers the topics such as fluid mechanics, measurement techniques in fluid flows, computational fluid dynamics, instability, transition and turbulence, fluidâstructure interaction, multiphase flows, micro- and nanoscale transport, bio-fluid mechanics, aerodynamics, turbomachinery, propulsion and power. The book will be useful for researchers and professionals interested in the broad field of mechanics.