Author:
Publisher:
ISBN:
Category : Textile fibers
Languages : en
Pages : 20
Book Description
Methods of Determining Thermal Conductivity of Fibrous Masses
Thermal Conductivity 30
Author: Daniela S. Gaal
Publisher: DEStech Publications, Inc
ISBN: 1605950157
Category : Technology & Engineering
Languages : en
Pages : 1018
Book Description
Publisher: DEStech Publications, Inc
ISBN: 1605950157
Category : Technology & Engineering
Languages : en
Pages : 1018
Book Description
Thermal Conductivity 18
Author: T. Ashworth
Publisher: Springer Science & Business Media
ISBN: 1468449168
Category : Technology & Engineering
Languages : en
Pages : 734
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated. These Conferences on thermal conductivity grew out of the needs of researchers in the field. The Conferences were held annu ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conduc tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub licity and continuing funding support, when they see something worthwhile going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for research ers in other fields on how to jointly attack their own problem areas.
Publisher: Springer Science & Business Media
ISBN: 1468449168
Category : Technology & Engineering
Languages : en
Pages : 734
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated. These Conferences on thermal conductivity grew out of the needs of researchers in the field. The Conferences were held annu ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conduc tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub licity and continuing funding support, when they see something worthwhile going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for research ers in other fields on how to jointly attack their own problem areas.
Thermal Conductivity 31/Thermal Expansion 19
Author: Laszlo Kiss
Publisher: DEStech Publications, Inc
ISBN: 1605950556
Category : Science
Languages : en
Pages : 343
Book Description
New volume in the ITCC/ITES book series on thermal conductivity. Papers include applications related to thermophysical properties measurement methods, equipment, processes, theory, and new developments.
Publisher: DEStech Publications, Inc
ISBN: 1605950556
Category : Science
Languages : en
Pages : 343
Book Description
New volume in the ITCC/ITES book series on thermal conductivity. Papers include applications related to thermophysical properties measurement methods, equipment, processes, theory, and new developments.
Thermal Conductivity 24/Thermal Expansion 12
Author: Peter S. Gaal
Publisher: CRC Press
ISBN: 9781566767118
Category : Technology & Engineering
Languages : en
Pages : 874
Book Description
Publisher: CRC Press
ISBN: 9781566767118
Category : Technology & Engineering
Languages : en
Pages : 874
Book Description
Thermal Conductivity 29
Author: John R. Koenig
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 632
Book Description
"This is the 2008 volume in the ITCC/ITES book series on thermal conductivity, devoted to thermal conductivity performance in many types of engineered materials. The book comprises 52 original papers specially selected and edited from the ITCC 29/ITES17 conference, held in June 2007 at the University of Alabama, with support from the Southern Research Institute. New areas covered in this book include thermoelectrics, nuclear and aerospace materials, including the James Webb Space Telescope."--DEStech Publications web-site, viewed 15 January 2009
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 632
Book Description
"This is the 2008 volume in the ITCC/ITES book series on thermal conductivity, devoted to thermal conductivity performance in many types of engineered materials. The book comprises 52 original papers specially selected and edited from the ITCC 29/ITES17 conference, held in June 2007 at the University of Alabama, with support from the Southern Research Institute. New areas covered in this book include thermoelectrics, nuclear and aerospace materials, including the James Webb Space Telescope."--DEStech Publications web-site, viewed 15 January 2009
Thermal Conductivity 25/Thermal Expansion 13
Author: C Uher
Publisher: CRC Press
ISBN: 9781566768061
Category : Technology & Engineering
Languages : en
Pages : 418
Book Description
Proceedings of the joint conferences of the Twenty-Fifth International ThermalConductivity Conference and the Proceedings of the Thirteenth International Thermal Expansion Symposium, on June 13-16, 1999 in Ann Arbor, Michigan USA.
Publisher: CRC Press
ISBN: 9781566768061
Category : Technology & Engineering
Languages : en
Pages : 418
Book Description
Proceedings of the joint conferences of the Twenty-Fifth International ThermalConductivity Conference and the Proceedings of the Thirteenth International Thermal Expansion Symposium, on June 13-16, 1999 in Ann Arbor, Michigan USA.
Thermal Conductivity 23
Author: Kenneth E. Wilkes
Publisher: CRC Press
ISBN: 1000448479
Category : Technology & Engineering
Languages : en
Pages : 760
Book Description
This book contains keynote lectures and 54 technical papers, presented at the 23rd International Thermal Conductivity Conference, on various topics, including techniques, coatings and films, theory, composites, fluids, metals, ceramics, and organics, related to thermal conductivity.
Publisher: CRC Press
ISBN: 1000448479
Category : Technology & Engineering
Languages : en
Pages : 760
Book Description
This book contains keynote lectures and 54 technical papers, presented at the 23rd International Thermal Conductivity Conference, on various topics, including techniques, coatings and films, theory, composites, fluids, metals, ceramics, and organics, related to thermal conductivity.
Thermal Conductivity 22
Author: Timothy W. Tong
Publisher: CRC Press
ISBN: 9781566761727
Category : Technology & Engineering
Languages : en
Pages : 1022
Book Description
Publisher: CRC Press
ISBN: 9781566761727
Category : Technology & Engineering
Languages : en
Pages : 1022
Book Description
Thermal Insulation Performance
Author: D. L. McElroy
Publisher: ASTM International
ISBN: 9780803107946
Category : Technology & Engineering
Languages : en
Pages : 584
Book Description
Publisher: ASTM International
ISBN: 9780803107946
Category : Technology & Engineering
Languages : en
Pages : 584
Book Description