Author: T. Ashworth Publisher: Springer Science & Business Media ISBN: 1468449168 Category : Technology & Engineering Languages : en Pages : 734
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated. These Conferences on thermal conductivity grew out of the needs of researchers in the field. The Conferences were held annu ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conduc tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub licity and continuing funding support, when they see something worthwhile going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for research ers in other fields on how to jointly attack their own problem areas.
Author: T. Ashworth Publisher: Springer ISBN: 9781468449181 Category : Technology & Engineering Languages : en Pages : 764
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated. These Conferences on thermal conductivity grew out of the needs of researchers in the field. The Conferences were held annu ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conduc tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub licity and continuing funding support, when they see something worthwhile going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for research ers in other fields on how to jointly attack their own problem areas.
Author: C.J. Cremers Publisher: Springer Science & Business Media ISBN: 9780306436727 Category : Science Languages : en Pages : 740
Book Description
Fifty-one papers (and three keynote addresses) on contemporary theoretical issues and experimental techniques pertaining to the underlying factors that control heat-conduction behavior of materials. The latest findings on insulation, fluids, and low-dimensional solids and composites are reviewed as
Author: David C. Larsen Publisher: Springer Science & Business Media ISBN: 1468442651 Category : Technology & Engineering Languages : en Pages : 606
Book Description
The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. C. F. Lucks and grew out of the needs of researchers in the field. From 1961 to 1973 the Confer ences were held annually, and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the permanent Spon sor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conductivity and closely related properties to convene on a regular basis to ex change their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather togeth er in increasing numbers without the need of national publicity and continuing funding support, when they see something worthwi1e going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for researchers in other fields on how to jointly attack their own problem areas.
Author: T. Ashworth
Author: T. Ashworth
Author: Daniela S. Gaal
Author: T. Ashworth
Author: 
Author: T. Ashworth
Author: International Conference on Thermal Conductivity
Author: C.J. Cremers
Author: Clifford J. Cremers
Author: David C. Larsen