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Author: Babu Suryadevara Publisher: Woodhead Publishing ISBN: 0081002181 Category : Technology & Engineering Languages : en Pages : 538
Book Description
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. - Considers techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for particular materials - Addresses consumables and process control for improved CMP
Author: Babu Suryadevara Publisher: Woodhead Publishing ISBN: 0081002181 Category : Technology & Engineering Languages : en Pages : 538
Book Description
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. - Considers techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for particular materials - Addresses consumables and process control for improved CMP
Author: Materials Research Society. Meeting Publisher: ISBN: Category : Science Languages : en Pages : 318
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
Author: Publisher: ScholarlyEditions ISBN: 1464964033 Category : Technology & Engineering Languages : en Pages : 1862
Book Description
Issues in Technology Theory, Research, and Application: 2011 Edition is a ScholarlyEditions™ eBook that delivers timely, authoritative, and comprehensive information about Technology Theory, Research, and Application. The editors have built Issues in Technology Theory, Research, and Application: 2011 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Technology Theory, Research, and Application in this eBook to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Issues in Technology Theory, Research, and Application: 2011 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.
Author: Toshiro Doi Publisher: William Andrew ISBN: 1437778593 Category : Science Languages : en Pages : 330
Book Description
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Author: Babu Suryadevara Publisher: Woodhead Publishing ISBN: 0128218193 Category : Technology & Engineering Languages : en Pages : 650
Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Author: James Moyne Publisher: CRC Press ISBN: 1420040669 Category : Technology & Engineering Languages : en Pages : 367
Book Description
Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control.
Author: W. Brian Rowe Publisher: William Andrew ISBN: 0323297986 Category : Technology & Engineering Languages : en Pages : 476
Book Description
Principles of Modern Grinding Technology, Second Edition, provides insights into modern grinding technology based on the author's 40 years of research and experience in the field. It provides a concise treatment of the principles involved and shows how grinding precision and quality of results can be improved and costs reduced. Every aspect of the grinding process--techniques, machines and machine design, process control, and productivity optimization aspects--come under the searchlight. The new edition is an extensive revision and expansion of the first edition covering all the latest developments, including center-less grinding and ultra-precision grinding. Analyses of factors that influence grinding behavior are provided and applications are presented assisted by numerical examples for illustration. The new edition of this well-proven reference is an indispensible source for technicians, engineers, researchers, teachers, and students who are involved with grinding processes. - Well-proven source revised and expanded by undisputed authority in the field of grinding processes - Coverage of the latest developments, such as ultra-precision grinding machine developments and trends in high-speed grinding - Numerically worked examples give scale to essential process parameters - The book as a whole and in particular the treatment of center-less grinding is considered to be unchallenged by other books
Author: Bo Zhao Publisher: Trans Tech Publications Ltd ISBN: 3038266337 Category : Technology & Engineering Languages : en Pages : 361
Book Description
Selected, peer reviewed papers from the 10th CHINA-JAPAN International Conference on Ultra-Precision Machining Process (10th CJUMP) and 2014 International Conference on Surface Finishing Technology (ICSFT 2014), October 17-19, 2014, Jiaozuo, China
Author: Ioan D. Marinescu Publisher: William Andrew ISBN: 1437734677 Category : Technology & Engineering Languages : en Pages : 602
Book Description
This book draws upon the science of tribology to understand, predict and improve abrasive machining processes. Pulling together information on how abrasives work, the authors, who are renowned experts in abrasive technology, demonstrate how tribology can be applied as a tool to improve abrasive machining processes. Each of the main elements of the abrasive machining system are looked at, and the tribological factors that control the efficiency and quality of the processes are described. Since grinding is by far the most commonly employed abrasive machining process, it is dealt with in particular detail. Solutions are posed to many of the most commonly experienced industrial problems, such as poor accuracy, poor surface quality, rapid wheel wear, vibrations, work-piece burn and high process costs. This practical approach makes this book an essential tool for practicing engineers. Uses the science of tribology to improve understanding and of abrasive machining processes in order to increase performance, productivity and surface quality of final products A comprehensive reference on how abrasives work, covering kinematics, heat transfer, thermal stresses, molecular dynamics, fluids and the tribology of lubricants Authoritative and ground-breaking in its first edition, the 2nd edition includes 30% new and updated material, including new topics such as CMP (Chemical Mechanical Polishing) and precision machining for micro-and nano-scale applications
Author: Babu Suryadevara
Author: Babu Suryadevara
Author: Materials Research Society. Meeting
Author: 
Author: Toshiro Doi
Author: Babu Suryadevara
Author: James Moyne
Author: W. Brian Rowe
Author: Bo Zhao
Author: 
Author: Ioan D. Marinescu