Author: United States. Office of Saline WaterPublisher:
ISBN:
Category : Saline water conversion
Languages : en
Pages : 918
Book Description
Research and Development Progress Report
Author: United States. Office of Saline WaterPublisher:
ISBN:
Category : Saline water conversion
Languages : en
Pages : 918
Book Description
Micropolar Fluids
Author: Grzegorz LukaszewiczPublisher: Springer Science & Business Media
ISBN: 1461206413
Category : Technology & Engineering
Languages : en
Pages : 262
Book Description
Micropolar fluids are fluids with microstructure. They belong to a class of fluids with nonsymmetric stress tensor that we shall call polar fluids, and include, as a special case, the well-established Navier-Stokes model of classical fluids that we shall call ordinary fluids. Physically, micropolar fluids may represent fluids consisting of rigid, randomly oriented (or spherical) particles suspended in a viscous medium, where the deformation of fluid particles is ignored. The model of micropolar fluids introduced in [65] by C. A. Eringen is worth studying as a very well balanced one. First, it is a well-founded and significant generalization of the classical Navier-Stokes model, covering, both in theory and applications, many more phenomena than the classical one. Moreover, it is elegant and not too complicated, in other words, man ageable to both mathematicians who study its theory and physicists and engineers who apply it. The main aim of this book is to present the theory of micropolar fluids, in particular its mathematical theory, to a wide range of readers. The book also presents two applications of micropolar fluids, one in the theory of lubrication and the other in the theory of porous media, as well as several exact solutions of particular problems and a numerical method. We took pains to make the presentation both clear and uniform.
Scientific and Technical Aerospace Reports
Author: Heat Transfer and Fluid Flow in Minichannels and Microchannels
Author: Satish KandlikarPublisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Nonlinear Flow Phenomena and Homotopy Analysis
Author: Kuppalapalle VajraveluPublisher: Springer Science & Business Media
ISBN: 364232102X
Category : Mathematics
Languages : en
Pages : 197
Book Description
Since most of the problems arising in science and engineering are nonlinear, they are inherently difficult to solve. Traditional analytical approximations are valid only for weakly nonlinear problems and often fail when used for problems with strong nonlinearity. “Nonlinear Flow Phenomena and Homotopy Analysis: Fluid Flow and Heat Transfer” presents the current theoretical developments of the analytical method of homotopy analysis. This book not only addresses the theoretical framework for the method, but also gives a number of examples of nonlinear problems that have been solved by means of the homotopy analysis method. The particular focus lies on fluid flow problems governed by nonlinear differential equations. This book is intended for researchers in applied mathematics, physics, mechanics and engineering. Both Kuppalapalle Vajravelu and Robert A. Van Gorder work at the University of Central Florida, USA.
Applied Mechanics Reviews
Author: Energy Research Abstracts
Author: Encyclopedia Of Thermal Packaging - Set 1: Thermal Packaging Techniques (A 6-volume Set)
Author: Publisher: World Scientific
ISBN: 9814452599
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
remove This Encyclopedia comes in 3 sets. To check out Set 2 and Set 3, please visit Set 2: Thermal Packaging Tools and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 1: Thermal Packaging TechniquesThe first set of the Encyclopedia, Thermal Packaging Techniques, focuses on the technology “building blocks” used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual “building blocks” and their insertion in the overall thermal solution. Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, thermoelectric microcoolers, and cooling devices for solid state lighting systems, as well as techniques and procedures for the experimental characterization of thermal management components. These “building blocks” are the essential elements in the creation of a complete, cost-effective thermal management system.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
SIPRE Report
Author: Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques (a 6-Volume Set)
Author: Avram Bar-CohenPublisher: World Scientific
ISBN: 9814313785
Category : Technology & Engineering
Languages : en
Pages : 1582
Book Description
Packaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications.The Encyclopedia of Thermal Packaging, compiled into four 5-volume sets (Thermal Packaging Techniques, Thermal Packaging Configurations, Thermal Packaging Tools and Thermal Packaging Applications), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250–350 pages and is written by world experts in thermal management of electronics.