Assembly and Reliability of Lead-Free Solder Joints PDF Download
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Author: John H. Lau Publisher: Springer Nature ISBN: 9811539200 Category : Technology & Engineering Languages : en Pages : 545
Book Description
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Author: John H. Lau Publisher: Springer Nature ISBN: 9811539200 Category : Technology & Engineering Languages : en Pages : 545
Book Description
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Author: Hoang Pham Publisher: World Scientific ISBN: 9814479993 Category : Technology & Engineering Languages : en Pages : 506
Book Description
As our modern information-age society grows in complexity both in terms of embedded systems and applications, the problems and challenges in reliability become ever more complex. Bringing together many of the leading experts in the field, this volume presents a broad picture of current research on system modeling and optimization in reliability and its applications.The book comprises twenty-three chapters organized into four parts: Reliability Modeling, Software Quality Engineering, Software Reliability, and Maintenance and Inspection Policies. These sections cover a wide range of important topics, including system reliability modeling, optimization, software reliability and quality, maintenance theory and inspection, reliability failure analysis, sampling plans and schemes, software development processes and improvement, stochastic process modeling, statistical distributions and analysis, fault-tolerant performance, software measurements and cost effectiveness, queueing theory and applications, system availability, reliability of repairable systems, testing sampling inspection, software capability maturity model, accelerated life modeling, statistical control, and HALT testing.
Author: John H. Lau Publisher: Springer Science & Business Media ISBN: 9780442002602 Category : Computers Languages : en Pages : 504
Book Description
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Author: John H. Lau Publisher: Springer Science & Business Media ISBN: 1461539102 Category : Technology & Engineering Languages : en Pages : 649
Book Description
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Author: Elsayed A. Elsayed Publisher: John Wiley & Sons ISBN: 1118309545 Category : Technology & Engineering Languages : en Pages : 800
Book Description
A newly revised and updated edition that details both the theoretical foundations and practical applications of reliability engineering Reliability is one of the most important quality characteristics of components, products, and large and complex systems—but it takes a significant amount of time and resources to bring reliability to fruition. Thoroughly classroom- and industry-tested, this book helps ensure that engineers see reliability success with every product they design, test, and manufacture. Divided into three parts, Reliability Engineering, Second Edition handily describes the theories and their practical uses while presenting readers with real-world examples and problems to solve. Part I focuses on system reliability estimation for time independent and failure dependent models, helping engineers create a reliable design. Part II aids the reader in assembling necessary components and configuring them to achieve desired reliability objectives, conducting reliability tests on components, and using field data from similar components. Part III follows what happens once a product is produced and sold, how the manufacturer must ensure its reliability objectives by providing preventive and scheduled maintenance and warranty policies. This Second Edition includes in-depth and enhanced chapter coverage of: Reliability and Hazard Functions System Reliability Evaluation Time- and Failure-Dependent Reliability Estimation Methods of the Parameters of Failure-Time Distributions Parametric Reliability Models Models for Accelerated Life Testing Renewal Processes and Expected Number of Failures Preventive Maintenance and Inspection Warranty Models Case Studies A comprehensive reference for practitioners and professionals in quality and reliability engineering, Reliability Engineering can also be used for senior undergraduate or graduate courses in industrial and systems, mechanical, and electrical engineering programs.
Author: Lloyd Condra Publisher: CRC Press ISBN: 1351990918 Category : Technology & Engineering Languages : en Pages : 418
Book Description
A guide to implementing and operating a practical reliability program using carefully designed experiments to provide information quickly, efficiently and cost effectively. It emphasizes real world solutions to daily problems. The second edition contains a special expanded section demonstrating how to combine accelerated testing with design of experiments for immediate improvement.
Author: John H. Lau
Author: John H. Lau
Author: Hoang Pham
Author: John H. Lau
Author: John H. Lau
Author: Elsayed A. Elsayed
Author: 
Author: Lloyd Condra
Author: 
Author: Dongkai Shangguan
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