Author: Publisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 1178
Book Description
Defect and Impurity Engineered Semiconductors and Devices
Author: American Book Publishing Record
Author: Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 1044
Book Description
Mechanical Behavior of Diamond and Other Forms of Carbon
Author: Electrical & Electronics Abstracts
Author: Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 2304
Book Description
Compound Semiconductor
Author: Publisher:
ISBN:
Category : Compound semiconductors
Languages : en
Pages : 342
Book Description
Government Reports Announcements & Index
Author: Government Reports Annual Index
Author: Publisher:
ISBN:
Category : Government reports announcements & index
Languages : en
Pages : 1368
Book Description
Silicon Device Processing
Author: Charles P. MarsdenPublisher:
ISBN:
Category : Electronics
Languages : en
Pages : 472
Book Description
The objective of the Symposium was to provide an opportunity for engineers and applied scientists actively engaged in the silicon device technology field to discuss the most advanced measurement methods for process control and materials characterization.The basic theme of the meeting was to stress the interdependence of measurements techniques, facilities, and materials as they relate to the overall problems of improving and advancing silicon device sciences and technologies.(Author).
Semiconductor Packaging
Author: Andrea ChenPublisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 208
Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Power Electronics Device Applications of Diamond Semiconductors
Author: Satoshi KoizumiPublisher: Woodhead Publishing
ISBN: 0081021844
Category : Technology & Engineering
Languages : en
Pages : 468
Book Description
Power Electronics Device Applications of Diamond Semiconductors presents state-of-the-art research on diamond growth, doping, device processing, theoretical modeling and device performance. The book begins with a comprehensive and close examination of diamond crystal growth from the vapor phase for epitaxial diamond and wafer preparation. It looks at single crystal vapor deposition (CVD) growth sectors and defect control, ultra high purity SC-CVD, SC diamond wafer CVD, heteroepitaxy on Ir/MqO and needle-induced large area growth, also discussing the latest doping and semiconductor characterization methods, fundamental material properties and device physics. The book concludes with a discussion of circuits and applications, featuring the switching behavior of diamond devices and applications, high frequency and high temperature operation, and potential applications of diamond semiconductors for high voltage devices. - Includes contributions from today's most respected researchers who present the latest results for diamond growth, doping, device fabrication, theoretical modeling and device performance - Examines why diamond semiconductors could lead to superior power electronics - Discusses the main challenges to device realization and the best opportunities for the next generation of power electronics