Surface Reactions During Plasma Enhanced Chemical Vapor Deposition of Silicon and Silicon Based Dielectrics PDF Download

Author: Atul Gupta
Publisher:
ISBN:
Category :
Languages : en
Pages : 163

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Book Description
Keywords: Plasma deposition, Surface chemistry, Ab-initio calculations, Reaction mechanisms, Kinetics, Amorphous silicon, Silicon dioxide.

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :

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Book Description
Theoretical ab-initio calculations (including both the Configuration Interaction and Density Functional approaches) are used to describe some of the critical surface reactions during plasma enhanced chemical vapor deposition of amorphous and micro-crystalline silicon films. The energetics as well as the reaction mechanism are calculated for the abstraction of surface hydrogen by incident silyl and hydrogen radicals. Another important reaction involving the insertion of these radicals (silyl and hydrogen) into strained Si-Si bonds on the surface is also evaluated. Experiments involve surface topology evolution studies of plasma deposited a-Si:H films using atomic force microscopy (AFM) as well as structural and electrical characterization of silicon dioxide films using several techniques including infrared spectroscopy, ellipsometry, and current-voltage measurements. A predictive kinetic model to describe the growth of silicon films from a predominantly silyl radical flux is developed to explain experimental observations regarding the properties of plasma deposited amorphous silicon films. The model explains diffusion length enhancements under certain processing conditions as well as lays a foundation for understanding the Si-Si network formation during the deposition of a-Si films.

Author: Aditi Banerjee
Publisher:
ISBN:
Category :
Languages : en
Pages : 344

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Author: Daniel J. Carbaugh
Publisher:
ISBN:
Category : Dielectric films
Languages : en
Pages :

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Author: Patrick R. McCurdy
Publisher:
ISBN:
Category : Plasma-enhanced chemical vapor deposition
Languages : en
Pages : 384

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Author: David Vincent Tsu
Publisher:
ISBN:
Category :
Languages : en
Pages : 500

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Author: Arthur Sherman
Publisher: William Andrew
ISBN:
Category : Computers
Languages : en
Pages : 240

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Book Description
Presents an extensive, comprehensive study of chemical vapor deposition (CVD). Understanding CVD requires knowledge of fluid mechanics, plasma physics, chemical thermodynamics, and kinetics as well as homogenous and heterogeneous chemical reactions. This text presents these aspects of CVD in an integrated fashion, and also reviews films for use in integrated circuit technology.

Author: Pio Capezzuto
Publisher: Elsevier
ISBN: 0080539106
Category : Science
Languages : en
Pages : 339

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Book Description
Semiconductors made from amorphous silicon have recently become important for their commercial applications in optical and electronic devices including FAX machines, solar cells, and liquid crystal displays. Plasma Deposition of Amorphous Silicon-Based Materials is a timely, comprehensive reference book written by leading authorities in the field. This volume links the fundamental growth kinetics involving complex plasma chemistry with the resulting semiconductor film properties and the subsequent effect on the performance of the electronic devices produced. Focuses on the plasma chemistry of amorphous silicon-based materials Links fundamental growth kinetics with the resulting semiconductor film properties and performance of electronic devices produced Features an international group of contributors Provides the first comprehensive coverage of the subject, from deposition technology to materials characterization to applications and implementation in state-of-the-art devices

Author: Electrochemical Society. High Temperature Materials Division
Publisher: The Electrochemical Society
ISBN: 9781566773195
Category : Science
Languages : en
Pages : 526

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Book Description

Author: Srinivasan Sivaram
Publisher: Springer Science & Business Media
ISBN: 1475747519
Category : Technology & Engineering
Languages : en
Pages : 302

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Book Description
In early 1987 I was attempting to develop a CVD-based tungsten process for Intel. At every step ofthe development, information that we were collecting had to be analyzed in light of theories and hypotheses from books and papers in many unrelated subjects. Thesesources were so widely different that I came to realize there was no unifying treatment of CVD and its subprocesses. More interestingly, my colleagues in the industry were from many disciplines (a surface chemist, a mechanical engineer, a geologist, and an electrical engineer werein my group). To help us understand the field of CVD and its players, some of us organized the CVD user's group of Northern California in 1988. The idea for writing a book on the subject occurred to me during that time. I had already organized my thoughts for a course I taught at San Jose State University. Later Van Nostrand agreed to publish my book as a text intended for students at the senior/first year graduate level and for process engineers in the microelectronics industry, This book is not intended to be bibliographical, and it does not cover every new material being studied for chemical vapor deposition. On the other hand, it does present the principles of CVD at a fundamental level while uniting them with the needs of the microelectronics industry.