Structural Integrity and Reliability in Electronics PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Structural Integrity and Reliability in Electronics PDF full book. Access full book title Structural Integrity and Reliability in Electronics by W.J. Plumbridge. Download full books in PDF and EPUB format.
Author: W.J. Plumbridge Publisher: Springer Science & Business Media ISBN: 1402026110 Category : Technology & Engineering Languages : en Pages : 341
Book Description
Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
Author: W.J. Plumbridge Publisher: Springer Science & Business Media ISBN: 1402026110 Category : Technology & Engineering Languages : en Pages : 341
Book Description
Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.
Author: Ephraim Suhir Publisher: Springer Science & Business Media ISBN: 0387329897 Category : Technology & Engineering Languages : en Pages : 1471
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: Panel on Reliability Growth Methods for Defense Systems Publisher: National Academy Press ISBN: 9780309314749 Category : Technology & Engineering Languages : en Pages : 235
Book Description
A high percentage of defense systems fail to meet their reliability requirements. This is a serious problem for the U.S. Department of Defense (DOD), as well as the nation. Those systems are not only less likely to successfully carry out their intended missions, but they also could endanger the lives of the operators. Furthermore, reliability failures discovered after deployment can result in costly and strategic delays and the need for expensive redesign, which often limits the tactical situations in which the system can be used. Finally, systems that fail to meet their reliability requirements are much more likely to need additional scheduled and unscheduled maintenance and to need more spare parts and possibly replacement systems, all of which can substantially increase the life-cycle costs of a system. Beginning in 2008, DOD undertook a concerted effort to raise the priority of reliability through greater use of design for reliability techniques, reliability growth testing, and formal reliability growth modeling, by both the contractors and DOD units. To this end, handbooks, guidances, and formal memoranda were revised or newly issued to reduce the frequency of reliability deficiencies for defense systems in operational testing and the effects of those deficiencies. "Reliability Growth" evaluates these recent changes and, more generally, assesses how current DOD principles and practices could be modified to increase the likelihood that defense systems will satisfy their reliability requirements. This report examines changes to the reliability requirements for proposed systems; defines modern design and testing for reliability; discusses the contractor's role in reliability testing; and summarizes the current state of formal reliability growth modeling. The recommendations of "Reliability Growth" will improve the reliability of defense systems and protect the health of the valuable personnel who operate them.
Author: Ephraim Suhir Publisher: John Wiley & Sons ISBN: 047088679X Category : Technology & Engineering Languages : en Pages : 610
Book Description
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.
Author: Zhenhan Yao Publisher: Springer Science & Business Media ISBN: 3540482601 Category : Technology & Engineering Languages : en Pages : 354
Book Description
Here are the printed proceedings of EPMESC X, held on August 21-23, 2006 in Sanya, Hainan Island of China. It includes 14 full papers of plenary and semi-plenary lectures and approximately 166 one-page summaries. The accompanying CD-ROM includes all 180 full papers presented at the conference.
Author: KV Subramanian Publisher: Springer Science & Business Media ISBN: 0387484337 Category : Technology & Engineering Languages : en Pages : 370
Book Description
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Author: Abdel Salam Hamdy Makhlouf Publisher: Butterworth-Heinemann ISBN: 0128113960 Category : Technology & Engineering Languages : en Pages : 388
Book Description
Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts
Author: Publisher: EOLSS Publications ISBN: 1848264356 Category : Languages : en Pages : 604
Book Description
Ancillary Equipment and Electrical Equipment is a component of Encyclopedia of Water Sciences, Engineering and Technology Resources in the global Encyclopedia of Life Support Systems (EOLSS), which is an integrated compendium of twenty one Encyclopedias. The volume presents state-of-the art subject matter of various aspects of Ancillary Equipment And Electrical Equipment such as: Seawater Supply Pump; Cooling Water Recirculation Pump; Brine Recirculation Pump; Brine Blowdown Pump; Brine Heater Condensate Pump; Minor Pumps For Desalination Plants; The Installation Criteria And The Layout; Hydraulic Aspects In Design And Operation Of Axial-Flow Pumps; Description Of Surface Vortices With Regard To Common Design Criteria Of Intake Chambers; Vacuum Creating Equipment; Filtering Equipment; Chemical Dosing Stations; On-Load Sponge Ball Cleaning System; Power Supply Systems And Electrical Equipment For Desalination Plants; Composite Materials For Pressure Vessels And Pipes; Thermal Stresses In Vessels, Piping, And Components; Pressure Vessels And Piping Systems: Reliability, Risk And Safety Assessment; Pressure Vessels And Shell Structures; Pipeline Operations; Steel And Pipe Mill Techology; Pipeline Structural Integrity; Pipeline System Automation And Control; Pump And Compressor Operation; Environmental Conservation Practices For Pipelines. This volume is aimed at the following five major target audiences: University and College Students Educators, Professional Practitioners, Research Personnel and Policy and Decision Makers
Author: W.J. Plumbridge
Author: W.J. Plumbridge
Author: Ephraim Suhir
Author: Panel on Reliability Growth Methods for Defense Systems
Author: Ephraim Suhir
Author: Zhenhan Yao
Author: KV Subramanian
Author: Abdel Salam Hamdy Makhlouf
Author: 
Author: James J. Niehaus
Author: