Author: Electronic Components and Technology ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 68
Book Description
Special Section on 50th Electronic Components and Technology Conference
Author: Electronic Components and Technology ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 68
Book Description
50th Electronic Components and Technology Conference
Author: Michael F. Caggiano50th ECTC
Author: Robert BoudreauSpecial Section from the 48th Electronic Components and Technology Conference
Author: Peter J. Krusius2000 50th Electronic Components and Technology Conference
Author: IEEE Components, Packaging and Manufacturing Technology Society StaffPublisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
2000 Proceedings
Author: Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780359086
Category : Technology & Engineering
Languages : en
Pages : 1756
Book Description
This work on electronic components and technology covers topics such as advanced packaging, connectors and contacts, interconnections, manufacturing technology, materials and processing, modeling and simulation, and optoelectronics.
Contributions from the 51st Electronic Components and Technology Conference
Author: Electronic Components and Technology ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 117
Book Description
2000 Proceedings
Author: Publisher: IEEE Standards Office
ISBN: 9780780359093
Category : Technology & Engineering
Languages : en
Pages : 1756
Book Description
This work on electronic components and technology covers topics such as advanced packaging, connectors and contacts, interconnections, manufacturing technology, materials and processing, modeling and simulation, and optoelectronics.
IC Component Sockets
Author: Weifeng LiuPublisher: John Wiley & Sons
ISBN: 9780471460503
Category : Technology & Engineering
Languages : en
Pages : 242
Book Description
A broad and practical reference to IC socket technology The first and only comprehensive resource on IC (Integrated Circuit) socket technology, IC Component Sockets offers a complete overview of socket technology and design in order to provide engineers and their managers with a good understanding of these specialized technologies and the processes for evaluating them. The authors, both acknowledged experts in the field, address all relevant aspects of the subject-including materials, design, performance characteristics, failure modes and mechanisms, and qualification and reliability assessment-with emphasis on the technology's inherent advantages and challenges. Topics of interest include: * Socket design and contact technologies * Performance characteristics and material properties * Contact failure modes and mechanisms * Qualification testing conditions * Qualification sequences and setup * IEEE prediction methodology * Theoretical calculation of contact reliability Including a list of standards and specifications, this book is an important and timely resource for today's electronics engineers concerned with evaluating and perfecting socket design, manufacture, and use.
Moisture Sensitivity of Plastic Packages of IC Devices
Author: X.J. FanPublisher: Springer Science & Business Media
ISBN: 1441957197
Category : Technology & Engineering
Languages : en
Pages : 573
Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.