Author: D. Harame
Publisher: The Electrochemical Society
ISBN: 1566778255
Category : Science
Languages : en
Pages : 1066
Book Description
Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices
Author: D. Harame
Publisher: The Electrochemical Society
ISBN: 1566778255
Category : Science
Languages : en
Pages : 1066
Book Description
Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
Publisher: The Electrochemical Society
ISBN: 1566778255
Category : Science
Languages : en
Pages : 1066
Book Description
Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices
Author: David Harame
Publisher: The Electrochemical Society
ISBN: 1566776562
Category : Electronic apparatus and appliances
Languages : en
Pages : 1136
Book Description
Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds have become a key component of the arsenal in improving semiconductor performance. This issue of ECS Transactions discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
Publisher: The Electrochemical Society
ISBN: 1566776562
Category : Electronic apparatus and appliances
Languages : en
Pages : 1136
Book Description
Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds have become a key component of the arsenal in improving semiconductor performance. This issue of ECS Transactions discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.
SiGe, Ge, and Related Compounds 6: Materials, Processing, and Devices
Author: D. Harame
Publisher: The Electrochemical Society
ISBN: 1607685434
Category :
Languages : en
Pages : 1042
Book Description
Publisher: The Electrochemical Society
ISBN: 1607685434
Category :
Languages : en
Pages : 1042
Book Description
Journal of the Electrochemical Society
SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8
Author: Q. Liu
Publisher: The Electrochemical Society
ISBN: 1607688530
Category : Science
Languages : en
Pages : 450
Book Description
Publisher: The Electrochemical Society
ISBN: 1607688530
Category : Science
Languages : en
Pages : 450
Book Description
Advances in Chemical Mechanical Planarization (CMP)
Author: Babu Suryadevara
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Publisher: Woodhead Publishing
ISBN: 0128218193
Category : Technology & Engineering
Languages : en
Pages : 650
Book Description
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Processing and Properties of Compound Semiconductors
Author:
Publisher: Elsevier
ISBN: 0080541011
Category : Science
Languages : en
Pages : 333
Book Description
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded.
Publisher: Elsevier
ISBN: 0080541011
Category : Science
Languages : en
Pages : 333
Book Description
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded.
ULSI Process Integration 6
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1566777445
Category : Integrated circuits
Languages : en
Pages : 547
Book Description
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Publisher: The Electrochemical Society
ISBN: 1566777445
Category : Integrated circuits
Languages : en
Pages : 547
Book Description
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
ULSI Process Integration 9
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1607686759
Category :
Languages : en
Pages : 335
Book Description
Publisher: The Electrochemical Society
ISBN: 1607686759
Category :
Languages : en
Pages : 335
Book Description
Green Photonics and Smart Photonics
Author: Shien-Kuei Liaw
Publisher: River Publishers
ISBN: 8793379277
Category : Technology & Engineering
Languages : en
Pages : 260
Book Description
In recent years, many efforts have been devoted in the study, development and application of Green Photonics and Smart Photonics. This book presents recent advances, both theoretical and applications, reflecting the cutting-edge technologies and research achievements within these research fields. Green Photonics intend to develop photonics technologies that can conserve energy, reduce pollution and create renewable energy. Light emitting diodes (LEDs) and solar cells with the characteristics of sustainable and low energy consumption are addressed in this book. The term of Smart Photonics reflect intelligence of optical and optoelectronic components with high sensitivity, fast response time and/or compact size. The book explores various aspects of smart photonics including fiber sensors, optoelectronic devices and waveguide devices. The chapters in this edited book are written by researchers who presented quality papers at the 2015 International Symposium of Next-Generation Electronics (ISNE 2015), which was held in Taipei, Taiwan. The ISNE 2015 provided a common forum in the areas of opto-electron devices, photonics, integrated circuits, and microelectronic systems and technologies. The technical program consisted of 5 plenary talks, 23 invited talks and more than 250 contributed oral and poster presentations. After a rigorous review process, the ISNE 2015 technical program committee has selected 10 outstanding presentations and invited the authors to prepare extended chapters for inclusion in this book. Of the 10 chapters, five focus on the subject of green photonics, and the others cover smart photonics.
Publisher: River Publishers
ISBN: 8793379277
Category : Technology & Engineering
Languages : en
Pages : 260
Book Description
In recent years, many efforts have been devoted in the study, development and application of Green Photonics and Smart Photonics. This book presents recent advances, both theoretical and applications, reflecting the cutting-edge technologies and research achievements within these research fields. Green Photonics intend to develop photonics technologies that can conserve energy, reduce pollution and create renewable energy. Light emitting diodes (LEDs) and solar cells with the characteristics of sustainable and low energy consumption are addressed in this book. The term of Smart Photonics reflect intelligence of optical and optoelectronic components with high sensitivity, fast response time and/or compact size. The book explores various aspects of smart photonics including fiber sensors, optoelectronic devices and waveguide devices. The chapters in this edited book are written by researchers who presented quality papers at the 2015 International Symposium of Next-Generation Electronics (ISNE 2015), which was held in Taipei, Taiwan. The ISNE 2015 provided a common forum in the areas of opto-electron devices, photonics, integrated circuits, and microelectronic systems and technologies. The technical program consisted of 5 plenary talks, 23 invited talks and more than 250 contributed oral and poster presentations. After a rigorous review process, the ISNE 2015 technical program committee has selected 10 outstanding presentations and invited the authors to prepare extended chapters for inclusion in this book. Of the 10 chapters, five focus on the subject of green photonics, and the others cover smart photonics.