Annual IEEE Semiconductor Thermal Measurement and Management Symposium PDF Download

Author:
Publisher:
ISBN:
Category : Amorphous semiconductors
Languages : en
Pages : 392

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Author:
Publisher: Academic Press
ISBN: 0128028661
Category : Science
Languages : en
Pages : 462

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Book Description
Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts. The articles, which serve as a broad review for experts in the field are also of great interest to non-specialists who need to keep up-to-date with the results of the latest research. This serial is essential reading for all mechanical, chemical, and industrial engineers working in the field of heat transfer, or in graduate schools or industry. - Compiles the expert opinions of leaders in the industry - Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts - Essential reading for all mechanical, chemical, and industrial engineers working in the field of heat transfer, or in graduate schools or industry

Author: Rakesh K. Gupta
Publisher: CRC Press
ISBN: 142000980X
Category : Technology & Engineering
Languages : en
Pages : 566

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Reflecting the exceptional growth in the use of nanostructured materials for an increasing range of industrial applications, Polymer Nanocomposites Handbook comprehensively covers the synthesis of nanomaterials that act as the building blocks of polymer nanocomposites and polymers that act as matrix materials. From early history to new technologies

Author: Arman Vassighi
Publisher: Springer Science & Business Media
ISBN: 0387297499
Category : Technology & Engineering
Languages : en
Pages : 188

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In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Author: Amjad Anvari-Moghaddam
Publisher: Springer Nature
ISBN: 3030597504
Category : Technology & Engineering
Languages : en
Pages : 643

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This book provides a comprehensive overview on the latest developments in the control, operation, and protection of microgrids. It provides readers with a solid approach to analyzing and understanding the salient features of modern control and operation management techniques applied to these systems, and presents practical methods with examples and case studies from actual and modeled microgrids. The book also discusses emerging concepts, key drivers and new players in microgrids, and local energy markets while addressing various aspects from day-ahead scheduling to real-time testing of microgrids. The book will be a valuable resource for researchers who are focused on control concepts, AC, DC, and AC/DC microgrids, as well as those working in the related areas of energy engineering, operations research and its applications to energy systems. Presents modern operation, control and protection techniques with applications to real world and emulated microgrids; Discusses emerging concepts, key drivers and new players in microgrids and local energy markets; Addresses various aspects from day-ahead scheduling to real-time testing of microgrids.

Author: Frank Suli
Publisher: Woodhead Publishing
ISBN: 008102391X
Category : Technology & Engineering
Languages : en
Pages : 490

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Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.

Author: Akhyar
Publisher: Springer Nature
ISBN: 9811936293
Category : Technology & Engineering
Languages : en
Pages : 382

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This book gathers a selection of peer-reviewed papers presented at the 3rd International Conference on Experimental and Computational Mechanics in Engineering (ICECME 2021), held as a virtual conference and organized by Universitas Syiah Kuala, Banda Aceh, Indonesia, on October 11–12, 2021. This book, prepared by international scientists and engineers, covers the latest advances in computational mechanics, metallurgy and material science, energy systems, manufacturing processing systems, industrial and system engineering, biomechanics, artificial intelligence, micro-/nano-engineering, micro-electro-mechanical system, machine learning, mechatronics, and engineering design. This book is intended for academics, including graduate students and researchers, as well as industrial practitioners working in the areas of experimental and computational mechanics.

Author: J. Richard Culham
Publisher:
ISBN:
Category : Ball grid array technology
Languages : en
Pages : 422

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Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 160

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Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 870

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