Author: Ming YangPublisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 664
Book Description
Semiconductor Technology (ISTC 2001)
Author: Ming YangPublisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 688
Book Description
Semiconductor Technology (ISTC 2001)
Author: Ming YangPublisher:
ISBN:
Category : Semiconductors
Languages : en
Pages : 664
Book Description
Advanced Metallization Conference 2002 (AMC 2002)
Author: Semiconductor Technology (ISTC 2001)
Author: Ming YangPublisher:
ISBN: 9781566773249
Category : Semiconductors
Languages : en
Pages : 0
Book Description
International Conference on Sensor Technology
Author: Yikai ZhouPublisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 514
Book Description
Directory of Published Proceedings
Author: Journal of the Electrochemical Society
Author: JJAP Letters
Author: 2002 7th International Symposium on Plasma- and Process-Induced Damage
Author: 3D IC Stacking Technology
Author: Banqiu WuPublisher: McGraw Hill Professional
ISBN: 007174195X
Category : Technology & Engineering
Languages : en
Pages : 544
Book Description
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology