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Author: Scott T. Dunham Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 296
Book Description
Highlights recent advances in technology computer-aided design (TCAD) and identifies critical areas for future emphasis. The 39 contributions from the December 1997 symposium cover four main topics--bulk process modeling, equipment modeling, topography modeling, and characterization and device modeling. Paper topics include arsenic deactivation in silicon; defect reactions induced by reactive ion etching; optimization of AMT barrel reactors for silicon epitaxy; grain structure evolution and the reliability of Al(Cu) thin film interconnects; and improved quantitative mobility spectrum analysis. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Scott T. Dunham Publisher: ISBN: Category : Technology & Engineering Languages : en Pages : 296
Book Description
Highlights recent advances in technology computer-aided design (TCAD) and identifies critical areas for future emphasis. The 39 contributions from the December 1997 symposium cover four main topics--bulk process modeling, equipment modeling, topography modeling, and characterization and device modeling. Paper topics include arsenic deactivation in silicon; defect reactions induced by reactive ion etching; optimization of AMT barrel reactors for silicon epitaxy; grain structure evolution and the reliability of Al(Cu) thin film interconnects; and improved quantitative mobility spectrum analysis. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Siegfried Selberherr Publisher: Springer Science & Business Media ISBN: 3709166578 Category : Computers Languages : en Pages : 525
Book Description
The "Fifth International Conference on Simulation of Semiconductor Devices and Processes" (SISDEP 93) continues a series of conferences which was initiated in 1984 by K. Board and D. R. J. Owen at the University College of Wales, Swansea, where it took place a second time in 1986. Its organization was succeeded by G. Baccarani and M. Rudan at the University of Bologna in 1988, and W. Fichtner and D. Aemmer at the Federal Institute of Technology in Zurich in 1991. This year the conference is held at the Technical University of Vienna, Austria, September 7 - 9, 1993. This conference shall provide an international forum for the presentation of out standing research and development results in the area of numerical process and de vice simulation. The miniaturization of today's semiconductor devices, the usage of new materials and advanced process steps in the development of new semiconduc tor technologies suggests the design of new computer programs. This trend towards more complex structures and increasingly sophisticated processes demands advanced simulators, such as fully three-dimensional tools for almost arbitrarily complicated geometries. With the increasing need for better models and improved understand ing of physical effects, the Conference on Simulation of Semiconductor Devices and Processes brings together the simulation community and the process- and device en gineers who need reliable numerical simulation tools for characterization, prediction, and development.
Author: Gerhard Wachutka Publisher: Springer Science & Business Media ISBN: 3709106249 Category : Technology & Engineering Languages : en Pages : 387
Book Description
This volume contains the proceedings of the 10th edition of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2004), held in Munich, Germany, on September 2-4, 2004. The conference program included 7 invited plenary lectures and 82 contributed papers for oral or poster presentation, which were carefully selected out of a total of 151 abstracts submitted from 14 countries around the world. Like the previous meetings, SISPAD 2004 provided a world-wide forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. The variety of topics covered by the conference contributions reflects the physical effects and technological problems encountered in consequence of the progressively shrinking device dimensions and the ever-growing complexity in device technology.
Author: Dimitris Tsoukalas Publisher: Springer Science & Business Media ISBN: 3709162440 Category : Technology & Engineering Languages : en Pages : 463
Book Description
This volume contains the Proceedings of the International Conference on Simulation of Semiconductor Devices and Processes, SISPAD 01, held on September 5–7, 2001, in Athens. The conference provided an open forum for the presentation of the latest results and trends in process and device simulation. The trend towards shrinking device dimensions and increasing complexity in process technology demands the continuous development of advanced models describing basic physical phenomena involved. New simulation tools are developed to complete the hierarchy in the Technology Computer Aided Design simulation chain between microscopic and macroscopic approaches. The conference program featured 8 invited papers, 60 papers for oral presentation and 34 papers for poster presentation, selected from a total of 165 abstracts from 30 countries around the world. These papers disclose new and interesting concepts for simulating processes and devices.
Author: J.S. Yuan Publisher: Springer Science & Business Media ISBN: 9780306457241 Category : Technology & Engineering Languages : en Pages : 352
Book Description
The advent of the microelectronics technology has made ever-increasing numbers of small devices on a same chip. The rapid emergence of ultra-large-scaled-integrated (ULSI) technology has moved device dimension into the sub-quarter-micron regime and put more than 10 million transistors on a single chip. While traditional closed-form analytical models furnish useful intuition into how semiconductor devices behave, they no longer provide consistently accurate results for all modes of operation of these very small devices. The reason is that, in such devices, various physical mechanisms affect the device performance in a complex manner, and the conventional assumptions (i. e. , one-dimensional treatment, low-level injection, quasi-static approximation, etc. ) em ployed in developing analytical models become questionable. Thus, the use of numerical device simulation becomes important in device modeling. Researchers and engineers will rely even more on device simulation for device design and analysis in the future. This book provides comprehensive coverage of device simulation and analysis for various modem semiconductor devices. It will serve as a reference for researchers, engineers, and students who require in-depth, up-to-date information and understanding of semiconductor device physics and characteristics. The materials of the book are limited to conventional and mainstream semiconductor devices; photonic devices such as light emitting and laser diodes are not included, nor does the book cover device modeling, device fabrication, and circuit applications.
Author: Tibor Grasser Publisher: Springer Science & Business Media ISBN: 3211728619 Category : Technology & Engineering Languages : en Pages : 472
Book Description
This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance.
Author: Heiner Ryssel Publisher: Springer Science & Business Media ISBN: 3709166195 Category : Computers Languages : en Pages : 515
Book Description
SISDEP ’95 provides an international forum for the presentation of state-of-the-art research and development results in the area of numerical process and device simulation. Continuously shrinking device dimensions, the use of new materials, and advanced processing steps in the manufacturing of semiconductor devices require new and improved software. The trend towards increasing complexity in structures and process technology demands advanced models describing all basic effects and sophisticated two and three dimensional tools for almost arbitrarily designed geometries. The book contains the latest results obtained by scientists from more than 20 countries on process simulation and modeling, simulation of process equipment, device modeling and simulation of novel devices, power semiconductors, and sensors, on device simulation and parameter extraction for circuit models, practical application of simulation, numerical methods, and software.
Book Description
"The last couple of years have been very busy for the semiconductor industry and researchers. The rapid speed of production channel length reduction has brought lithographic challenges to semiconductor modeling. These include stress optimization, transisto"
Author: Kristin De Meyer Publisher: Springer Science & Business Media ISBN: 3709168279 Category : Technology & Engineering Languages : en Pages : 423
Book Description
This volume contains the proceedings of the 1998 International Conference on Simulation of Semiconductor Processes and Devices and provides an open forum for the presentation of the latest results and trends in modeling and simulation of semiconductor equipment, processes and devices. Topics include: • semiconductor equipment simulation • process modeling and simulation • device modeling and simulation of complex structures • interconnect modeling • integrated systems for process, device, circuit simulation and optimisation • numerical methods and algorithms • compact modeling and parameter extraction • modeling for RF applications • simulation and modeling of new devices (heterojunction based, SET’s, quantum effect devices, laser based ...)
Author: Jarek Dabrowski Publisher: Springer Science & Business Media ISBN: 3662094320 Category : Technology & Engineering Languages : en Pages : 505
Book Description
Predictive Simulation of Semiconductor Processing enables researchers and developers to extend the scaling range of semiconductor devices beyond the parameter range of empirical research. It requires a thorough understanding of the basic mechanisms employed in device fabrication, such as diffusion, ion implantation, epitaxy, defect formation and annealing, and contamination. This book presents an in-depth discussion of our current understanding of key processes and identifies areas that require further work in order to achieve the goal of a comprehensive, predictive process simulation tool.
Author: Scott T. Dunham
Author: Scott T. Dunham
Author: Siegfried Selberherr
Author: Gerhard Wachutka
Author: Dimitris Tsoukalas
Author: J.S. Yuan
Author: Tibor Grasser
Author: Heiner Ryssel
Author: Rasit Onur Topaloglu
Author: Kristin De Meyer
Author: Jarek Dabrowski