Author:
Publisher:
ISBN:
Category : Semiconductor industry
Languages : en
Pages : 128
Book Description
Semiconductor International
Author:
Publisher:
ISBN:
Category : Semiconductor industry
Languages : en
Pages : 128
Book Description
Publisher:
ISBN:
Category : Semiconductor industry
Languages : en
Pages : 128
Book Description
International Diffusion of Technology
Author: John E. Tilton
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 202
Book Description
Study of the international diffusion of semiconductor technology, comprising a comparison of the marketing of innovations in the electronics industry in France, Germany, Federal Republic, Japan, the UK and the USA - includes references and statistical tables.
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 202
Book Description
Study of the international diffusion of semiconductor technology, comprising a comparison of the marketing of innovations in the electronics industry in France, Germany, Federal Republic, Japan, the UK and the USA - includes references and statistical tables.
Semiconductor International
Author:
Publisher:
ISBN:
Category : Semiconductor industry
Languages : en
Pages : 490
Book Description
Publisher:
ISBN:
Category : Semiconductor industry
Languages : en
Pages : 490
Book Description
Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Publisher: CRC Press
ISBN: 1351829823
Category : Technology & Engineering
Languages : en
Pages : 3276
Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
International Trade
Author: United States. General Accounting Office
Publisher:
ISBN:
Category : Competition, Unfair
Languages : en
Pages : 18
Book Description
Publisher:
ISBN:
Category : Competition, Unfair
Languages : en
Pages : 18
Book Description
IEEE/SEMI International Semiconductor Manufacturing Science Symposium
Author: IEEE/SEMI International Semiconductor Manufacturing Science Symposium
Publisher:
ISBN:
Category : Computer integrated manufacturing systems
Languages : en
Pages : 168
Book Description
Publisher:
ISBN:
Category : Computer integrated manufacturing systems
Languages : en
Pages : 168
Book Description
Semiconductor Packaging
Author: Andrea Chen
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 216
Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Publisher: CRC Press
ISBN: 1439862079
Category : Technology & Engineering
Languages : en
Pages : 216
Book Description
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Decline of U.S. Semiconductor Infrastructure
Author: United States. Congress. House. Committee on Energy and Commerce. Subcommittee on Commerce, Consumer Protection, and Competitiveness
Publisher:
ISBN:
Category : Competition, International
Languages : en
Pages : 104
Book Description
Publisher:
ISBN:
Category : Competition, International
Languages : en
Pages : 104
Book Description
BoogarLists | Directory of Semiconductor Manufacturers
A Report on the U.S. Semiconductor Industry
Author: United States. Industry and Trade Administration. Office of Producer Goods
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 148
Book Description
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 148
Book Description