Author: United States. Office of the Assistant Secretary of Defense (Supply and Logistics)Publisher:
ISBN:
Category : Quality control
Languages : en
Pages : 96
Book Description
Sampling Procedures and Tables for Life and Reliability Testing (based on Exponential Distribution).
Author: United States. Office of the Assistant Secretary of Defense (Supply and Logistics)Publisher:
ISBN:
Category : Quality control
Languages : en
Pages : 96
Book Description
Sampling Procedures and Tables for Life and Reliability Testing (based on Exponential Distribution)
Author: United States. Office of the Assistant Secretary of Defense (Supply and Logistics)Publisher:
ISBN:
Category : Quality control
Languages : en
Pages : 94
Book Description
Sampling Procedures and Tables for Life and Reliability Testing Based on the Weibull Distribution (Hazard Rate Criterion).
Author: Henry Philip GoodePublisher:
ISBN:
Category : Reliability (Engineering)
Languages : en
Pages : 104
Book Description
Sampling Procedures and Tables for Life and Reliability Testing Based on the Weibull Distribution (mean Life Criterion)
Author: Sampling Procedures and Tables for Life and Reliability Testing
Author: United States. Office of Naval ResearchPublisher:
ISBN:
Category : Sampling (Statistics)
Languages : en
Pages : 68
Book Description
Sampling Procedures and Tables for Life and Reliability Testing Based on the Weibull Distribution
Author: Henry Phillip GoodePublisher:
ISBN:
Category : Sampling (Statistics)
Languages : en
Pages : 80
Book Description
Applied Life Data Analysis
Author: Wayne B. NelsonPublisher: John Wiley & Sons
ISBN: 0471725226
Category : Technology & Engineering
Languages : en
Pages : 656
Book Description
WILEY-INTERSCIENCE PAPERBACK SERIES The Wiley-Interscience Paperback Series consists of selected books that have been made more accessible to consumers in an effort to increase global appeal and general circulation. With these new unabridged softcover volumes, Wiley hopes to extend the lives of these works by making them available to future generations of statisticians, mathematicians, and scientists. "Many examples drawn from the author’s experience of engineering applications are used to illustrate the theoretical results, which are presented in a cookbook fashion...it provides an excellent practical guide to the analysis of product-life data." –T.M.M. Farley Special Programme of Research in Human Reproduction World Health Organization Geneva, Switzerland Review in Biometrics, September 1983 Now a classic, Applied Life Data Analysis has been widely used by thousands of engineers and industrial statisticians to obtain information from life data on consumer, industrial, and military products. Organized to serve practitioners, this book starts with basic models and simple informative probability plots of life data. Then it progresses through advanced analytical methods, including maximum likelihood fitting of advanced models to life data. All data analysis methods are illustrated with numerous clients' applications from the author's consulting experience.
Technical Publications Announcements with Indexes
Author: United States. National Aeronautics and Space AdministrationPublisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 796
Book Description
Advanced Materials for Thermal Management of Electronic Packaging
Author: Xingcun Colin TongPublisher: Springer Science & Business Media
ISBN: 1441977597
Category : Technology & Engineering
Languages : en
Pages : 633
Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author: