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Author: Peter Beard Publisher: University of Pennsylvania Press ISBN: 9780812216110 Category : Art Languages : en Pages : 132
Book Description
A well illustrated, clearly explained guide to using a wide variety of materials as masks and resists to achieve unusual finishes on clay.
Author: Peter Beard Publisher: University of Pennsylvania Press ISBN: 9780812216110 Category : Art Languages : en Pages : 132
Book Description
A well illustrated, clearly explained guide to using a wide variety of materials as masks and resists to achieve unusual finishes on clay.
Author: NIIR Board Publisher: ASIA PACIFIC BUSINESS PRESS Inc. ISBN: 8178330555 Category : Electroplating Languages : en Pages : 334
Book Description
Electroplating and Metal Finishing concerns itself with the development and applications of composites and non metallic coatings. These coatings are used for decorative, protective and functional application. Some of the other common metal surface finishing technologies are phosphating, pickling, electroforming, powder coating etc. Electroplating is the process of applying a metallic coating to an article by passing an electric current through an electrolyte in contact with the article, thereby forming a surface having properties or dimensions different from those of the article. Metal finishing has now come to be known as surface engineering. Surface engineering techniques are generally used to develop a wide range of functional properties. In addition to the decorative aspects, metal finishing aids the protection of metals and alloys from corrosion and rusting. A great potential exists for development of new materials involving, for example, coatings of metals composites particle incorporated anodic coatings and even films of sapphire like materials, porous files of niobium etc. and coating of refractory metals like molybdenum and tungsten. Phosphate coatings have a wide field of application in manufacturing industry, both as an aid to mechanical production operations and in surface finishing. The major applications for phosphate treatments fall into four areas; pre treatment prior to organic coatings, protection against corrosion, anti wear coatings and phosphating as a production aid. Powder coating of aluminium, extrusions in particular, has become an important feature in the finishing of aluminium. There are several advantages of powder; powder coating overspray can be recycled and thus it is possible to achieve nearly 100% use of the coating, powder coating production lines produce less hazardous waste than conventional liquid coatings, capital equipment and operating costs for a powder line are generally less than for conventional liquid lines. Surface finishing is a broad range of industrial processes that alter the surface of a manufactured item to achieve a certain property. Currently, the trend is towards surface treatments. Industries in developing countries like India have to be increasingly aware of the need not only for up gradation of existing technologies but also for indigenization of new technologies on a time bound basis. The content of the book includes information about technology involved in surface engineering of metals; some of them are electroplating plant, barrel planting plant, electroplating equipment, cleaning, pickling and dipping, equipment for hot alkaline cleaners, electrolytic and chemical processes for the polishing of metals, canning stainless steel electro-polishing solution, electroforming in gramophone record production, silver plating, fluoborate plating, gold plating (gilding), cadmium plating, zinc plating, chemical finishing of aluminium, powder coating of aluminium, bright nickel electro plating, copper plating, etc. This book covers an intensive study of technology of electroplating, phosphating, powder coating and metal finishing. The first hand information on these technologies is dealt in the book and can be very useful for those looking for entrepreneurship opportunity in the said industry. TAGS Electroplating Plant, Automatic Equipment, Surface Coatings and Treatments, Electroplating and Coating Plants, Electroplating Plant Equipment, Powder Coating Plants, Powder Coating Equipments, How to Start Powder Coating Business, Powder Coating Business Plan, Business Plan on Powder Coating, Start Powder Coating Business, Start High Profit Powder Coating Business, Starting Metal Polishing Business, Electroplating Business, Gold Plating Business, How to Start Metal Plating Business, Starting Zinc Plating Business, How to Start Electroplating Business, How to Start Metal Finishing Business, Starting Metal Polishing Business, Metal Finishing Industry, Business Plans for Metal Finishing, Zinc Plating Process, Zinc Plating Plant, Electroplating Plant for Acid Zinc, Electroplating Plant Equipment, Fixed Sequence Automatic Plating Plant, Trojan and Gem Type Automatic Plant, Vulcan Lattice Arm Type Automatic Plant, Titan Type Automatic Plant, Digit Pivoted Arm Type Automatic Plant, Straight-Through Type Automatic Plant, Methods of Transporter Control, Microprocessor and Computer Control, Semi-Automatic Plating Plant, Barrel Planting Plant, Suitability of Articles for Barrel Plating, Glydo/Glydette Barrel Plating Equipment, Calculation of Work Loads, Manual Planting Plant, Single Station Barrel Plating Units, Modular Plant and Specialised Equipment for Electronics Industry, Electroplating Equipment, Welded Steel Tanks, Plastic Tanks Reinforced with Glass Fibre, Tank Lining Materials, Glass Fibre (GRP) Tanks, Treatment of Rubber Linings, Ilex Grade Plastic Lined Tanks, Galvanised Steel Coils, Lead and Lead Alloy Coils, Titanium Coils, Metal Cased Heaters, Teflon Immersion Heaters, Silica Cased Heaters, Earthing of Electrically Heated Tanks, Electric Heating of Plastic or Plastic Lined Tanks, Lagging and Heat Conservation, Thermostatic Control Equipment, Jigs & Racks For Electroplating, Anodising and Other Surface Coatings, Removal of Insulated Coatings, Rectifier Installation and Maintenance, Single Phase Rectifier Units, Constant Voltage and Constant Current Control Controllers for Anodic Oxidation Processes, Current Interrupters and Periodic Reverse Units, Pre-Setting Ampere-Time Meters and Panels, Connecting Up Plating Equipment, Cleaning, Pickling and Dipping, Equipment for Hot Alkaline Cleaners, Cleaning of Zinc Base Alloy Die Castings, Cleaning of Zinc Base Alloy Die Casting, Anozyn, Equipment, Solution Composition, Solution Preparation, Operating Conditions, Plating on High Carbon Steel, Plating on Cast Iron and Malleable Castings, Plating on Stainless Steel, Nickel Chloride Strike for Stainless Steel, Nickel Sulphate Strike for Stainless Steel, Copper and Nickel Plating on Zinc Base Alloy Die-Castings, Standard Process Sequence for Electro-Plating on Aluminium and its Alloys, Electrolytic and Chemical Processes for Polishing of Metals, Aluminium Electro-Polishing Solution, Canning Non-Ferrous Electro-Polishing Solution, Copper Plating, Cyanide Copper Plating Processes, Zonax Copper Solution, Acid Copper Plating Processes, Gold Plating, Copper Fluoborate Bath, Standard Acid Copper Plating, Copper Pyrophosphate Plating Baths, Functional Chromium Plating, Decorative Black Chromium, Decorative Chromium Plating, Production Plating Conditions, Preparation of Plating Bath, Electroplating Solutions, Cadmium Electro-Plating, Adhesion and Surface Preparation, Bright Nickel Electro-Plating, Powder Coating of Aluminium, Chemical Colouring of Aluminium, Electroplating on Aluminium, Chemical Finishing of Aluminium, Aluminium Pre-Treatment, Calcium Modified Zinc Phosphate Processes, Heavy Zinc Phosphate Processes, Equipment for Phosphating, Immersion Phosphating Plant, Spray Phosphating Equipment, Treatment of High Tensile Steels, Phosphating Processes, Pre-Treatment Prior to Organic Coatings, Plating for Electronics, Plating of Plastics and Other Non-Metallic Materials, Production of Blue Chromate Coating, Passivation Processes for Zinc and Cadmium Electrodeposits, Treatment of Work After Plating, Cadmium Plating, Gold Plating (Gilding), Tin-Nickel Alloy Plating, Silver Plating, Brass Plating, Electroforming
Author: Manijeh Razeghi Publisher: Springer Science & Business Media ISBN: 1441910565 Category : Technology & Engineering Languages : en Pages : 570
Book Description
Technology of Quantum Devices offers a multi-disciplinary overview of solid state physics, photonics and semiconductor growth and fabrication. Readers will find up-to-date coverage of compound semiconductors, crystal growth techniques, silicon and compound semiconductor device technology, in addition to intersubband and semiconductor lasers. Recent findings in quantum tunneling transport, quantum well intersubband photodetectors (QWIP) and quantum dot photodetectors (QWDIP) are described, along with a thorough set of sample problems.
Author: R.R. Tummala Publisher: Springer Science & Business Media ISBN: 1461560373 Category : Computers Languages : en Pages : 1060
Book Description
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author: Karl W. Böer Publisher: Springer Science & Business Media ISBN: 9401129126 Category : Technology & Engineering Languages : en Pages : 1477
Book Description
Any book that covers a large variety of subjects and is written by one author lacks by necessity the depth provided by an expert in his or her own field of specialization. This book is no exception. It has been written with the encouragement of my students and colleagues, who felt that an extensive card file I had accumulated over the years of teaching solid state and semiconductor physics would be helpful to more than just a few of us. This file, updated from time to time, contained lecture notes and other entries that were useful in my research and permitted me to give to my students a broader spectrum of information than is available in typical textbooks. When assembling this material into a book, I divided the top ics into material dealing with the homogeneous semiconductor, the subject of the previously published Volume 1, and the inhomoge neous semiconductor, the subject of this Volume 2. In order to keep the book to a manageable size, sections of tutorial character which can be used as text for a graduate level class had to be interwoven with others written in shorter, reference style. The pointers at the right-hand page header will assist in distinguishing the more diffi cult reference parts of the book (with the pointer to the right) from the more easy-to-read basic educational sections (with the pointer tending to the left).
Author: Marc J. Madou Publisher: CRC Press ISBN: 1420055194 Category : Technology & Engineering Languages : en Pages : 672
Book Description
Designed for science and engineering students, this text focuses on emerging trends in processes for fabricating MEMS and NEMS devices. The book reviews different forms of lithography, subtractive material removal processes, and additive technologies. Both top-down and bottom-up fabrication processes are exhaustively covered and the merits of the different approaches are compared. Students can use this color volume as a guide to help establish the appropriate fabrication technique for any type of micro- or nano-machine.
Author: Oppi Untracht Publisher: Doubleday ISBN: 0307784118 Category : Crafts & Hobbies Languages : en Pages : 2225
Book Description
The definitive reference for jewelry makers of all levels of ability--a complete, profusely illustrated guide to design, materials, and techniques, as well as a fascinating exploration of jewelry-making throughout history.
Author: H. Ryssel Publisher: Springer Science & Business Media ISBN: 3642691560 Category : Science Languages : en Pages : 564
Book Description
The Fourth International Conference on Ion Implantation: Equipment and Tech niques was held at the Convention Center in Berchtesgaden, Bavaria, Germany, from September 13 to 17, 1982. It was attended by more than 200 participants from over 20 different countries. Severa1 series of conferences have dealt with the app1ication of ion implantation to semiconductors and other materials (Thousand Oaks, 1970; Garmisch-Partenkirchen, 1971; Osaka, 1974; Warwick, 1975; Bou1der, 1975; Budapest, 1978; and Albany, 1980). Another series of conferences has been devoted to implantation equipment and techniques (S- ford, 1977; Trento, 1978; and Kingston, 1980). This conference was the fourth in the 1atter series. Twe1ve invited papers and 55 contributed papers covered the areas of ion implantation equipment, measuring techniques, and app1ica tions of implantation to metals and semiconductors. A schoo1 on ion implantation was held in connection with the conference, and the 1ectures presented at this schoo1 were pub1ished as Vo1. 10 of the Springer Series in E1ectrophysics under the tit1e Ion Implantation Techniques (edited by H. Rysse1 and H. G1awischnig). During the conference, space was also provided for presentations and demonstrations by manufacturers of ion implantation equipment. Once again, this conference provided a forum for free discussion among implantation specia1ists in industry as we11 as research institutions. Espe cially effective in stimulating a free exchange of information was the daily get-together over free beer at the "Bier Adam". Many people contributed to the success of this conference.
Author: Markku Tilli Publisher: Elsevier ISBN: 0815519885 Category : Technology & Engineering Languages : en Pages : 670
Book Description
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Author: Peter Beard
Author: Peter Beard
Author: NIIR Board
Author: Manijeh Razeghi
Author: 
Author: R.R. Tummala
Author: Karl W. Böer
Author: Marc J. Madou
Author: Oppi Untracht
Author: H. Ryssel
Author: Markku Tilli