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Author: Mohsen Raji Publisher: Springer Nature ISBN: 3031153456 Category : Technology & Engineering Languages : en Pages : 113
Book Description
This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.
Author: Mohsen Raji Publisher: Springer Nature ISBN: 3031153456 Category : Technology & Engineering Languages : en Pages : 113
Book Description
This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.
Author: D.F. Barbe Publisher: Springer Science & Business Media ISBN: 3662010038 Category : Technology & Engineering Languages : en Pages : 291
Book Description
Even elementary school students of today know that electronics can do fan tastic things. Electronic calculators make arithmetic easy. An electronic box connected to your TV set provides a wonderful array of games. Electron ic boxes can translate languages! Electronics has even changed watches from a pair of hands to a set of digits. Integrated circuit (IC) chips which use transistors to store information in binary form and perform bin ary arithmetic make all of this possible. In just a short twenty years the field of integrated circuits has progressed from a few transistors per chip to thousands of transistors per chip. Since the early 1960's, the field has progressed from chips containing several transistors performing simple functions such as OR and AND functions to chips presently available which contain thousands of transistors performing a wide range of memory, control and arithmetic functions. The number of special journal issues, conferences, workshops, seminars, etc. related to the field of IC's is large. l~hile no single volume could adequately summarize the field, this volume attempts to provide a summary of some of the important issues and factors for Very Large Scale Integra tion (VLSI) from the perspective of several authors deeply involved in the field. In the field of VLSI, composed of many facets and disciplines, the de mand for engineers, physicists and chemists trained in IC skills exceeds supply.
Author: A.P. Dorey Publisher: Springer Science & Business Media ISBN: 146130587X Category : Technology & Engineering Languages : en Pages : 209
Book Description
The increasing application of integrated circuits in situations where high reliability is needed places a requirement on the manufacturer to use methods of testing to eliminate devices that may fail on service. One possible approach that is described in this book is to make precise electrical measurements that may reveal those devices more likely to fail. The measurements assessed are of analog circuit parameters which, based on a knowledge of failure mechanisms, may indicate a future failure. . To incorporate these tests into the functional listing of very large scale integrated circuits consideration has to be given to the sensitivity of the tests where small numbers of devices may be defective in a complex circuit. In addition the tests ideally should require minimal extra test time. A range of tests has been evaluated and compared with simulation used to assess the sensitivity of the measurements. Other work in the field is fully referenced at the end of each chapter. The team at Lancaster responsible for this book wish to thank the Alvey directorate and SERe for the necessary support and encouragement to publish our results. We would also like to thank John Henderson, recently retired from the British Telecom Research Laboratories, for his cheerful and enthusiastic encouragement. Trevor Ingham, now in New Zealand, is thanked for his early work on the project.
Author: Milton Ohring Publisher: Academic Press ISBN: 0080575528 Category : Technology & Engineering Languages : en Pages : 759
Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Ricardo Reis Publisher: Springer ISBN: 1461440785 Category : Technology & Engineering Languages : en Pages : 271
Book Description
This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management.
Author: Library of Congress. Cataloging Policy and Support Office Publisher: ISBN: Category : Subject headings, Library of Congress Languages : en Pages : 1512
Author: Mohsen Raji
Author: Mohsen Raji
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Author: D.F. Barbe
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Author: A.P. Dorey
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Author: Library of Congress
Author: Milton Ohring
Author: Ricardo Reis
Author: Library of Congress. Cataloging Policy and Support Office