Recommended Procedures for Handling of Moisture Sensitive Plastic IC Packages PDF Download

Author: American National Standards Institute
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages :

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Book Description

Author: X.J. Fan
Publisher: Springer Science & Business Media
ISBN: 1441957197
Category : Technology & Engineering
Languages : en
Pages : 573

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Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Author: Thomas Moore
Publisher: Elsevier
ISBN: 1483292347
Category : Technology & Engineering
Languages : en
Pages : 293

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Book Description
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

Author: R.R. Tummala
Publisher: Springer Science & Business Media
ISBN: 1461560373
Category : Computers
Languages : en
Pages : 1060

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Book Description
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Author: Xuejun Fan
Publisher: Springer
ISBN: 9781441957207
Category : Technology & Engineering
Languages : en
Pages : 558

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Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Author: P. Singh
Publisher: Springer Science & Business Media
ISBN: 1461560292
Category : Technology & Engineering
Languages : en
Pages : 391

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Book Description
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Author: E. Ajith Amerasekera
Publisher: John Wiley & Sons
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 368

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Book Description
Failure Mechanisms in Semiconductor Devices Second Edition E. Ajith Amerasekera Texas Instruments Inc., Dallas, USA Farid N. Najm University of Illinois at Urbana-Champaign, USA Since the successful first edition of Failure Mechanisms in Semiconductor Devices, semiconductor technology has become increasingly important. The high complexity of today's integrated circuits has engendered a demand for greater component reliability. Reflecting the need for guaranteed performance in consumer applications, this thoroughly updated edition includes more detailed material on reliability modelling and prediction. The book analyses the main failure mechanisms in terms of cause, effects and prevention and explains the mathematics behind reliability analysis. The authors detail methodologies for the identification of failures and describe the approaches for building reliability into semiconductor devices. Their thorough yet accessible text covers the physics of failure mechanisms from the semiconductor die itself to the packaging and interconnections. Incorporating recent advances, this comprehensive survey of semiconductor reliability will be an asset to both engineers and graduate students in the field.

Author:
Publisher:
ISBN:
Category : Measurement
Languages : en
Pages : 536

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Book Description

Author: Ray Prasad
Publisher: Springer Science & Business Media
ISBN: 1461540844
Category : Technology & Engineering
Languages : en
Pages : 791

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Book Description
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Author: Wallace R. Blischke
Publisher: John Wiley & Sons
ISBN: 0471458732
Category : Mathematics
Languages : en
Pages : 691

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Book Description
Introducing a groundbreaking companion book to a bestselling reliability text Reliability is one of the most important characteristics defining the quality of a product or system, both for the manufacturer and the purchaser. One achieves high reliability through careful monitoring of design, materials and other input, production, quality assurance efforts, ongoing maintenance, and a variety of related decisions and activities. All of these factors must be considered in determining the costs of production, purchase, and ownership of a product. Case Studies in Reliability and Maintenance serves as a valuable addition to the current literature on the subject of reliability by bridging the gap between theory and application. Conceived during the preparation of the editors' earlier work, Reliability: Modeling, Prediction, and Optimization (Wiley, 2000), this new volume features twenty-six actual case studies written by top experts in their fields, each illustrating exactly how reliability models are applied. A valuable companion book to Reliability: Modeling, Prediction, and Optimization, or any other textbook on the subject, the book features: * Case studies from fields such as aerospace, automotive, mining, electronics, power plants, dikes, computer software, weapons, photocopiers, industrial furnaces, granite building cladding, chemistry, and aircraft engines * A logical organization according to the life cycle of a product or system * A unified format of discussion enhanced by tools, techniques, and models for drawing one's own conclusions * Pertinent exercises for reinforcement of ideas Of equal value to both students of reliability theory as well as professionals in industry, Case Studies in Reliability and Maintenance should be required reading for anyone seeking to understand how reliability and maintenance issues can be addressed and resolved in the real world.