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Proposed Solid State Diffusion Bonding (SSDB) Process

Proposed Solid State Diffusion Bonding (SSDB) Process PDF Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 0

Book Description


Proposed Solid State Diffusion Bonding (SSDB) Process

Proposed Solid State Diffusion Bonding (SSDB) Process PDF Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 0

Book Description


Energy Research Abstracts

Energy Research Abstracts PDF Author:
Publisher:
ISBN:
Category : Power resources
Languages : en
Pages : 782

Book Description


Provisional Specifications for the Hot Die Sizing Process

Provisional Specifications for the Hot Die Sizing Process PDF Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 59

Book Description
Hot die sizing is one of three solid state diffusion bonding (SSDB) processes that has been proposed as an alternate manufacturing process for fabricating HAPO metallic uranium, aluminum-clad fuel elements. This document establishes the provisional process specifications for the assembly of fuel elements by the hot die sizing process. These specifications were developed for the CDB2N model fuel element (CSN equivalent AlSi model) and do not necessarily apply to any other model.

Electrical & Electronics Abstracts

Electrical & Electronics Abstracts PDF Author:
Publisher:
ISBN:
Category : Electrical engineering
Languages : en
Pages : 1440

Book Description


Physics Briefs

Physics Briefs PDF Author:
Publisher:
ISBN:
Category : Physics
Languages : en
Pages : 816

Book Description


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Ceramic Abstracts PDF Author:
Publisher:
ISBN:
Category : Ceramics
Languages : en
Pages : 500

Book Description


Proceedings of the National Science Council, Republic of China

Proceedings of the National Science Council, Republic of China PDF Author:
Publisher:
ISBN:
Category : Earth sciences
Languages : en
Pages : 908

Book Description


Metals Abstracts

Metals Abstracts PDF Author:
Publisher:
ISBN:
Category : Metallurgy
Languages : en
Pages : 1014

Book Description


Technology and Application of Aligned Wafer Bonding for Three Dimensional Microstructures and Microdevices

Technology and Application of Aligned Wafer Bonding for Three Dimensional Microstructures and Microdevices PDF Author: Ismail Mohd. Salleh
Publisher:
ISBN:
Category :
Languages : en
Pages : 342

Book Description


Loads and Aeroelasticity Division Research and Technology Accomplishments for FY 1986 and Plans for FY 1987

Loads and Aeroelasticity Division Research and Technology Accomplishments for FY 1986 and Plans for FY 1987 PDF Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 136

Book Description