Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding PDF Download

Author: U. Gösele
Publisher: The Electrochemical Society
ISBN: 9781566771894
Category : Technology & Engineering
Languages : en
Pages : 636

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Author:
Publisher:
ISBN:
Category : Semiconductor wafers
Languages : en
Pages : 524

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Author: Charles E. Hunt
Publisher: The Electrochemical Society
ISBN: 9781566772587
Category : Technology & Engineering
Languages : en
Pages : 498

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Author: Peter L. F. Hemment
Publisher: The Electrochemical Society
ISBN: 9781566771535
Category : Science
Languages : en
Pages : 458

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Author:
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 264

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Author: Peter Ramm
Publisher: John Wiley & Sons
ISBN: 3527326464
Category : Technology & Engineering
Languages : en
Pages : 435

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Book Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Author: Takeshi Hattori
Publisher: Springer Science & Business Media
ISBN: 3662035359
Category : Technology & Engineering
Languages : en
Pages : 634

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A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

Author: Michael Jetter
Publisher: John Wiley & Sons
ISBN: 3527807977
Category : Technology & Engineering
Languages : en
Pages : 584

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Vertical External Cavity Surface Emitting Lasers Provides comprehensive coverage of the advancement of vertical-external-cavity surface-emitting lasers Vertical-external-cavity surface-emitting lasers (VECSELs) emit coherent light from the infrared to the visible spectral range with high power output. Recent years have seen new device developments – such as the mode-locked integrated (MIXSEL) and the membrane external-cavity surface emitting laser (MECSEL) – expand the application of VECSELs to include laser cooling, spectroscopy, telecommunications, biophotonics, and laser-based displays and projectors. In Vertical External Cavity Surface Emitting Lasers: VECSEL Technology and Applications, leading international research groups provide a comprehensive, fully up-to-date account of all fundamental and technological aspects of vertical external cavity surface emitting lasers. This unique book reviews the physics and technology of optically-pumped disk lasers and discusses the latest developments of VECSEL devices in different wavelength ranges. Topics include OP-VECSEL physics, continuous wave (CW) lasers, frequency doubling, carrier dynamics in SESAMs, and characterization of nonlinear lensing in VECSEL gain samples. This authoritative volume: Summarizes new concepts of DBR-free and MECSEL lasers for the first time Covers the mode-locking concept and its application Provides an overview of the emerging concept of self-mode locking Describes the development of next-generation OPS laser products Vertical External Cavity Surface Emitting Lasers: VECSEL Technology and Applications is an invaluable resource for laser specialists, semiconductor physicists, optical industry professionals, spectroscopists, telecommunications engineers and industrial physicists.

Author:
Publisher: ScholarlyEditions
ISBN: 1481673424
Category : Medical
Languages : en
Pages : 888

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Book Description
Beta-Globulins—Advances in Research and Application: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Transferrin. The editors have built Beta-Globulins—Advances in Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Transferrin in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Beta-Globulins—Advances in Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

Author: Shumin Wang
Publisher: CRC Press
ISBN: 9814316296
Category : Science
Languages : en
Pages : 414

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Book Description
This book contains comprehensive reviews of different technologies to harness lattice mismatch in semiconductor heterostructures and their applications in electronic and optoelectronic devices. While the book is a bit focused on metamorphic epitaxial growth, it also includes other methods like compliant substrate, selective area growth, wafer bonding, heterostructure nanowires, and more. Basic knowledge on dislocations in semiconductors and innovative methods to eliminate threading dislocations are provided, and successful device applications are reviewed. It covers a variety of important semiconductor materials like SiGe, III-V including GaN and nano-wires; epitaxial methods like molecular beam epitaxy and metal organic vapor phase epitaxy; and devices like transistors and lasers etc.