Author: Electronic Components ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 684
Book Description
Proceedings of the Electronic Components Conference
Author: Electronic Components ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 684
Book Description
Proceedings of the Electronic Components Conference
Author: Electronic Components ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 516
Book Description
Proceedings - Electronic Components Conference
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 416
Book Description
Electronic Components Conference (proceedings 1968) Washington, May 8-10, 1968
Author: EiaProceedings of the Electronic Components Conference
Author: Electronic Components ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 664
Book Description
Proceedings of the 1958 Electronic Components Conference. Reliable Application of Component Parts. Los Angeles ... April 22, 23, 24, 1958, Etc
Author: Electronic Components Conference (LOS ANGELES)Publisher:
ISBN:
Category :
Languages : en
Pages : 222
Book Description
Proceedings of the Electronic Components Conference
Author: Electronic Components ConferencePublisher:
ISBN:
Category :
Languages : en
Pages : 537
Book Description
IEEE Electronic Components Conference, Proceedings
Author: IEEE Components, Hybrids, and Manufacturing Technology SocietyPublisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages :
Book Description
ECTC 2016
Author: Electronic Materials Handbook
Author: Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.