Author: J. M. BlocherPublisher:
ISBN:
Category : Chemical vapor deposition
Languages : en
Pages : 844
Book Description
Proceedings of the Eighth International Conference on Chemical Vapor Deposition
Author: J. M. BlocherPublisher:
ISBN:
Category : Chemical vapor deposition
Languages : en
Pages : 844
Book Description
Proceedings of the Ninth International Conference on Chemical Vapor Deposition, 1984
Author: McD. RobinsonPublisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 828
Book Description
Proceedings of the Tenth International Conference on Chemical Vapor Deposition, 1987
Author: Electrochemical Society. High Temperature Materials DivisionPublisher:
ISBN:
Category : Vapor-plating
Languages : en
Pages : 1296
Book Description
Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies
Author: Y. PauleauPublisher: Springer Science & Business Media
ISBN: 9781402005244
Category : Science
Languages : en
Pages : 392
Book Description
Proceedings of the NATO Advanced Study Institute, held in Kaunas, Lithuania, from 3-14 September 2001
Proceedings of the Third Symposium on Materials and New Processing Technologies for Photovoltaics
Author: Microelectronic Materials and Processes
Author: R.A. LevyPublisher: Springer Science & Business Media
ISBN: 9400909179
Category : Technology & Engineering
Languages : en
Pages : 992
Book Description
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Chemical Vapour Deposition
Author: Xiu-Tian YanPublisher: Springer Science & Business Media
ISBN: 1848828942
Category : Technology & Engineering
Languages : en
Pages : 352
Book Description
"Chemical Vapour Deposition: An Integrated Engineering Design for Advanced Materials" focuses on the application of this technology to engineering coatings and, in particular, to the manufacture of high performance materials, such as fibre reinforced ceramic composite materials, for structural applications at high temperatures. This book aims to provide a thorough exploration of the design and applications of advanced materials, and their manufacture in engineering. From physical fundamentals and principles, to optimization of processing parameters and other current practices, this book is designed to guide readers through the development of both high performance materials and the design of CVD systems to manufacture such materials. "Chemical Vapour Deposition: An Integrated Engineering Design for Advanced Materials" introduces integrated design and manufacture of advanced materials to researchers, industrial practitioners, postgraduates and senior undergraduate students.
Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies
Author: L. B. RothmanPublisher:
ISBN:
Category : Electronics
Languages : en
Pages : 288
Book Description
Subject Catalog
Author: Library of CongressPublisher:
ISBN:
Category : Subject catalogs
Languages : en
Pages : 978
Book Description
Author: Library of Congress