Proceedings of the ... National Heat Transfer Conference PDF Download

Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 232

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Author: Jr., Charles E. Baukal
Publisher: CRC Press
ISBN: 142003975X
Category : Science
Languages : en
Pages : 568

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Industry relies heavily on the combustion process. The already high demand for energy, primarily from combustion, is expected to continue to rapidly increase. Yet, the information is scattered and incomplete, with very little attention paid to the overall combustion system. Designed for practicing engineers, Heat Transfer in Industrial Combustion e

Author: Igorʹ Leonardovich Pioro
Publisher: American Society of Mechanical Engineers
ISBN:
Category : Science
Languages : en
Pages : 368

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This monograph summarizes the findings from 650 references devoted to heat transfer and hydraulic resistance of fluids flowing inside channels of various geometries at critical and supercritical pressures. The objectives are to assess the work that was done for the last fifty years in these areas, to understand the specifics of heat transfer and hydraulic resistance, and to propose the most reliable correlations to calculate the heat transfer coefficient and total pressure drop at these conditions.

Author:
Publisher: World Scientific
ISBN: 9814520241
Category : Technology & Engineering
Languages : en
Pages : 1397

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remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Author: Yassin A. Hassan
Publisher: EOLSS Publications
ISBN: 1848263120
Category :
Languages : en
Pages : 380

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Nuclear Energy Materials and Reactors is a component of Encyclopedia of Energy Sciences, Engineering and Technology Resources in the global Encyclopedia of Life Support Systems (EOLSS), which is an integrated compendium of twenty one Encyclopedias. Nuclear energy is a type of technology involving the controlled use of nuclear fission to release energy for work including propulsion, heat, and the generation of electricity. The theme on Nuclear Energy Materials and Reactors discusses: Fundamentals of Nuclear Energy; Nuclear Physics; Nuclear Interactions; Nuclear Reactor Theory; Nuclear Reactor Design; Nuclear Reactor Kinetics; Reactivity Changes; Nuclear Power Plants; Pressurized Water Reactors; Boiling Water Reactors; Pressurized Heavy Water Reactors; Heavy Water Light Water Reactors; Advanced Gas Cooled Reactors; Light Water Graphite Reactors; High Temperature Gas Cooled Reactors; Pebble Bed Modular Reactor; Radioactive Wastes, Origins, Classification and Management; Nuclear Reactor Overview and Reactor Cycles; The Nuclear Reactor Closed Cycle; Safety of Boiling Water Reactors; Supercritical Water-Cooled Nuclear Reactors: Review and Status; The Gas-Turbine Modular Helium Reactor; Application of Risk Assessment to Nuclear Power Plants; Production and Recycling Resources for Nuclear Fission. These two volumes are aimed at the following five major target audiences: University and College students Educators, Professional practitioners, Research personnel and Policy analysts, managers, and decision makers.

Author: Madhusudan Iyengar
Publisher: World Scientific
ISBN: 9814579807
Category : Technology & Engineering
Languages : en
Pages : 471

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Book Description
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 890

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Author: Chan L. Tien
Publisher: CRC Press
ISBN: 9781560324591
Category : Science
Languages : en
Pages : 418

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This text explores the field of microscale heat transfer in mechanical engineering. Experts from a wide range of science and engineering disciplines present topics that are built from simple macroscopic concepts and gradually lead into microscopic concepts. The book begins with an introductory chapter which discusses the history and the future directions of microscale heat transfer. It is then divided into two sections: the Fundamentals and the Applications.

Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 372

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Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 566

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