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Author: T. E. Simos Publisher: World Scientific ISBN: 9812385959 Category : Science Languages : en Pages : 719
Book Description
In the past few decades, many significant insights have been gained into several areas of computational methods in sciences and engineering. New problems and methodologies have appeared in some areas of sciences and engineering. There is always a need in these fields for the advancement of information exchange.The aim of this book is to facilitate the sharing of ideas, problems and methodologies between computational scientists and engineers in several disciplines. Extended abstracts of papers on the recent advances regarding computational methods in sciences and engineering are provided. The book briefly describes new methods in numerical analysis, computational mathematics, computational and theoretical physics, computational and theoretical chemistry, computational biology, computational mechanics, computational engineering, computational medicine, high performance computing, etc.
Author: T. E. Simos Publisher: World Scientific ISBN: 9812385959 Category : Science Languages : en Pages : 719
Book Description
In the past few decades, many significant insights have been gained into several areas of computational methods in sciences and engineering. New problems and methodologies have appeared in some areas of sciences and engineering. There is always a need in these fields for the advancement of information exchange.The aim of this book is to facilitate the sharing of ideas, problems and methodologies between computational scientists and engineers in several disciplines. Extended abstracts of papers on the recent advances regarding computational methods in sciences and engineering are provided. The book briefly describes new methods in numerical analysis, computational mathematics, computational and theoretical physics, computational and theoretical chemistry, computational biology, computational mechanics, computational engineering, computational medicine, high performance computing, etc.
Author: Alexis Lagarde Publisher: Springer Science & Business Media ISBN: 0306469480 Category : Science Languages : en Pages : 673
Book Description
The request to organize under its patronage at Poitiers in 1998 a Symposium entitled “Advanced Optical Methods and Applications in Solid Mechanics” by the International Union of Theoretical and Applied Mechanics (I.U.T.A.M.) was well received for the following two reasons. First, for nearly 20 years no Symposium devoted to optical methods in solids had been organized. Second, recent advances in digital image processing provided many new applications which are described in the following. We have the honour to present here the proceedings of this Symposium. st th The Symposium took place from august 31 to September 4 at the Institut International de la Prospective in Futuroscope near Poitiers. A significant number of internationally renowned specialists had expressed their wish to participate in this meeting. The Scientific Committee proposed 16 general conferences and selected 33 regular lectures and 17 poster presentations. Papers corresponding to posters are not differentiated in the proceedings from those that were presented orally. It is worth noting that a total of 80 participants, representing 16 countries, registered for this symposium.. The Scientific Committee deserves praise for attracting a significant number of young scientists, both as authors and as participants. Let us add our warm acknowledgements to Professor J.W. Dally and to Professor A.S. Kobayashi who, throughout the symposium preparation time, brought us valuable help.
Author: Shen Liu Publisher: John Wiley & Sons ISBN: 0470828412 Category : Technology & Engineering Languages : en Pages : 586
Book Description
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Author: Jeffrey C. Suhling Publisher: ISBN: Category : Electronic packaging Languages : en Pages : 150
Book Description
Proceedings of the November 1997 symposium, a forum for presentation of research in all aspects of experimental mechanics as applied to electronic packaging. Session topics included test chips, sensors, optical methods, micromechanical testing, and mechanics of thin film debonding.
Author: Hua-Tay Lin Publisher: John Wiley & Sons ISBN: 0470295198 Category : Technology & Engineering Languages : en Pages : 872
Book Description
This volume is part of the Ceramic Engineering and Science Proceeding (CESP) series. This series contains a collection of papers dealing with issues in both traditional ceramics (i.e., glass, whitewares, refractories, and porcelain enamel) and advanced ceramics. Topics covered in the area of advanced ceramic include bioceramics, nanomaterials, composites, solid oxide fuel cells, mechanical properties and structural design, advanced ceramic coatings, ceramic armor, porous ceramics, and more.
Author: Tom Proulx Publisher: Springer Science & Business Media ISBN: 144199792X Category : Technology & Engineering Languages : en Pages : 859
Book Description
This the sixth volume of six from the Annual Conference of the Society for Experimental Mechanics, 2010, brings together 128 chapters on Experimental and Applied Mechanics. It presents early findings from experimental and computational investigations including High Accuracy Optical Measurements of Surface Topography, Elastic Properties of Living Cells, Standards for Validating Stress Analyses by Integrating Simulation and Experimentation, Efficiency Enhancement of Dye-sensitized Solar Cell, and Blast Performance of Sandwich Composites With Functionally Graded Core.
Author: Tom Proulx Publisher: Springer Science & Business Media ISBN: 1441997989 Category : Technology & Engineering Languages : en Pages : 211
Book Description
This the fifth volume of six from the Annual Conference of the Society for Experimental Mechanics, 2010, brings together 25 chapters on Emerging Energy Systems. It presents early findings from experimental and computational investigations including Material State Changes in Heterogeneous Materials for Energy Systems, Characterization of Carbon Nanotube Foam for Improved Gas Storage Capability, Thermoresponsive Microcapsules for Autonomic Lithium-ion Battery Shutdown, Service Life Prediction of Seal in PEM Fuel Cells, and Assessing Durability of Elastomeric Seals for Fuel Cell Applications.
Author: T. E. Simos
Author: T. E. Simos
Author: I. M. Allison
Author: Alexis Lagarde
Author: Shen Liu
Author: Jeffrey C. Suhling
Author: Hua-Tay Lin
Author: Murray L. Scott
Author: Tom Proulx
Author: Tom Proulx
Author: Fu-Kuo Chang