Author: Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 344
Book Description
Proceedings of the 1980 International Microelectronics Symposium
Author: Proceedings of the ... International Microelectronics Symposium
Author: Proceedings of the ... International Symposium on Microelectronics
Author: Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 592
Book Description
Proceedings
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 562
Book Description
National Union Catalog
Author: Publisher:
ISBN:
Category : Catalogs, Union
Languages : en
Pages : 1032
Book Description
Includes entries for maps and atlases.
1995 International Symposium on Microelectronics
Author: International Symposium on MicroelectronicsPublisher:
ISBN: 9780930815448
Category : Microelectronics
Languages : en
Pages : 584
Book Description
Electronic Materials Handbook
Author: Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Proceedings of the 3rd International Microelectronics Conference
Author: Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 524
Book Description
RF and Microwave Microelectronics Packaging
Author: Ken KuangPublisher: Springer Science & Business Media
ISBN: 1441909842
Category : Technology & Engineering
Languages : en
Pages : 295
Book Description
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
国立国会図書館所蔵科学技術関係欧文会議錄目錄
Author: 国立国会図書館 (Japan)Publisher:
ISBN:
Category : Science
Languages : en
Pages : 672
Book Description