Principles of Reliable Soldering Techniques PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download Principles of Reliable Soldering Techniques PDF full book. Access full book title Principles of Reliable Soldering Techniques by R. Sengupta. Download full books in PDF and EPUB format.
Author: R. Sengupta Publisher: New Age International ISBN: 9788122411096 Category : Languages : en Pages : 122
Book Description
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Author: R. Sengupta Publisher: New Age International ISBN: 9788122411096 Category : Languages : en Pages : 122
Book Description
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Author: Mel Schwartz Publisher: ASM International ISBN: 1627080589 Category : Technology & Engineering Languages : en Pages : 207
Book Description
Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.
Author: Ning-Cheng Lee Publisher: Newnes ISBN: 0750672188 Category : Technology & Engineering Languages : en Pages : 282
Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Author: Jasbir Bath Publisher: John Wiley & Sons ISBN: 1119482038 Category : Technology & Engineering Languages : en Pages : 512
Book Description
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Author: John H. Lau Publisher: Springer Science & Business Media ISBN: 1461539102 Category : Technology & Engineering Languages : en Pages : 649
Book Description
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Author: Lev M. Klyatis Publisher: John Wiley & Sons ISBN: 111809400X Category : Technology & Engineering Languages : en Pages : 432
Book Description
Learn how ART and ADT can reduce cost, time, product recalls, and customer complaints This book provides engineers with the techniques and tools they need to use accelerated reliability testing (ART) and accelerated durability testing (ADT) as key factors to accurately predict a product's quality, reliability, durability, and maintainability during a given time, such as service life or warranty period. It covers new ideas and offers a unique approach to accurate simulation and integration of field inputs, safety, and human factors, as well as accelerated product development, as components of interdisciplinary systems engineering. Beginning with a comprehensive introduction to the subject of ART and ADT, the book covers: ART and ADT as components of an interdisciplinary systems of systems approach Methodology of ART and ADT performance Equipment for ART and ADT technology ART and ADT as sources of initial information for accurate quality, reliability, maintainability, and durability prediction and product accelerated development The economical results of the usage of ART and ADT ART and ADT standardization The book covers the newest techniques in the field and provides many case studies that illuminate how the implementation of ART and ADT can solve previously inaccessible problems in the field of engineering, such as reducing product recalls, cost, and time during design, manufacture, and usage. Professionals will find the answers to how one can carry out ART and ADT technology in a practical manner. Accelerated Reliability and Durability Testing Technology is indispensable reading for engineers, researchers in industry, usage, and academia who are involved in the design of experiments, field simulations, maintenance, reliabilty, durabilty, accurate prediction, and product development, and graduate students in related courses.
Author: Adam P. Bahret Publisher: John Wiley & Sons ISBN: 1119612454 Category : Technology & Engineering Languages : en Pages : 192
Book Description
By outlining how reliability engineering practices fit within a product development program, the reader will have a better understanding of how roles and goals align with the program and how this applies to their specific role. Reliability Culture: How Leaders Build Organizations that Create Reliable Products, will help readers develop a deep understanding of reliability, including what it really means for organizations, how to implement it in daily operations, and, most importantly, how to build a culture that is centered around reliability and can generate impressive profits. When senior leaders work toward reliability, product details often get lost in translation. This book will enable organizations to overcome this problem by showing leaders how their actions truly affect product development. They will be introduced to new methods that will immediately enable them to have carefully crafted product specifications translated into matching, highly reliable products. This book will also be a breath of fresh air for reliability engineers and managers; they will see their daily struggle identified and will learn new methods for advancing their passionate struggle. These new methods will be clearly explained, so readers can begin the important process of incorporating and promoting reliability in their organizations. Benefits of this book include: For the organizational leader, this book provides tools for aligning reliability objectives and methods with the company's business and brand goals For the reliability engineer, this book identifies and proposes solutions for integrating their discipline within the larger program objective and activities Engineers and leaders alike will benefit from detailed discussions of product negotiation, program assessment, culture change methods, and more All readers will understand the progression of product design methods over the previous decades, including how market acceptance is changing Reliability Culture: How Leaders Build Organizations that Create Reliable Products is intended for a broad audience that includes organizational leaders, engineers of all disciplines, project managers, and business development partners. The book is aimed at outlining how reliability engineering practices fit with all program activities, so any team members will benefit.
Author: R. Sengupta
Author: R. Sengupta
Author: Giles Humpston
Author: Mel Schwartz
Author: Ning-Cheng Lee
Author: David M. Jacobson
Author: Jasbir Bath
Author: John H. Lau
Author: Rodney S. Dunaway
Author: Lev M. Klyatis
Author: Adam P. Bahret