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Author: Jung H. Han Publisher: Elsevier ISBN: 0080455174 Category : Technology & Engineering Languages : en Pages : 532
Book Description
Innovations in Food Packaging addresses selective topics of functions of food packaging to modify the traditional notion of this process. This book is organized into five parts. Part I focuses on the fundamental theories covering physical chemistry background and quality preservation of foods. Parts II and III discuss active packaging research and development and modified atmosphere packaging of fresh produce, meats, and ready-to-eat products, respectively. Part IV talks about edible and biodegradable coatings and films, whereas Part V discusses commercialization aspects of packaging technologies. Each part is divided into chapters of subject review and detailed technical information. This text will benefit those who are interested in innovative technology of food packaging in general, and experienced field packaging specialists and graduate-level food scientists in particular. This book will be useful as a textbook not only for extension programs of food packaging development in food industry, but also for advanced graduate-level food packaging courses. Covers four major food packaging topics: * Theories in food packaging * Active packaging * Modified atmosphere packaging * Edible films and coatings
Author: Jung H. Han Publisher: Elsevier ISBN: 0080455174 Category : Technology & Engineering Languages : en Pages : 532
Book Description
Innovations in Food Packaging addresses selective topics of functions of food packaging to modify the traditional notion of this process. This book is organized into five parts. Part I focuses on the fundamental theories covering physical chemistry background and quality preservation of foods. Parts II and III discuss active packaging research and development and modified atmosphere packaging of fresh produce, meats, and ready-to-eat products, respectively. Part IV talks about edible and biodegradable coatings and films, whereas Part V discusses commercialization aspects of packaging technologies. Each part is divided into chapters of subject review and detailed technical information. This text will benefit those who are interested in innovative technology of food packaging in general, and experienced field packaging specialists and graduate-level food scientists in particular. This book will be useful as a textbook not only for extension programs of food packaging development in food industry, but also for advanced graduate-level food packaging courses. Covers four major food packaging topics: * Theories in food packaging * Active packaging * Modified atmosphere packaging * Edible films and coatings
Author: Catharine Fishel Publisher: Rockport Publishers ISBN: 1616736453 Category : Design Languages : en Pages : 352
Book Description
A volume "packed" with insight and ideas The packaging industry is more competitive every day so creating a new package that is innovative, adds value, and makes a connection with the consumer is a challenge often met with limited success. Dynamic and unusual package designs can really make a statement in overcrowded markets. What makes a package successful? How do designers find the inspiration and execute the designs that really work? This compendium of package design answers all that and more. The content covers inspiration, process, design research, working with clients, planning, and execution of some of the most effective packages on the market today. Insight from top packaging designers worldwide is provided on pages that are packed with images of great designs. Unlike most packaging books, this volume is stuffed with content in a compact, portable, and easy-to-use format
Author: Andrew Barnetson Publisher: iSmithers Rapra Publishing ISBN: 9781859570685 Category : Technology & Engineering Languages : en Pages : 136
Book Description
This report reviews the current use of plastics for packaging both by technology and market covering the world in consumption and growth terms as well as material and process developments.
Author: Tom Szaky Publisher: Berrett-Koehler Publishers ISBN: 1523095512 Category : Business & Economics Languages : en Pages : 321
Book Description
Only 35 percent of the 240 million metric tons of waste generated in the United States alone gets recycled, according to the Environmental Protection Agency. This extraordinary collection shows how manufacturers can move from a one-way take-make-waste economy that is burying the world in waste to a circular, make-use-recycle economy. Steered by Tom Szaky, recycling pioneer, eco-capitalist, and founder and CEO of TerraCycle, each chapter is coauthored by an expert in his or her field. From the distinct perspectives of government leaders, consumer packaged goods companies, waste management firms, and more, the book explores current issues of production and consumption, practical steps for improving packaging and reducing waste today, and big ideas and concepts that can be carried forward. Intended to help every business from a small start-up to a large established consumer product company, this book serves as a source of knowledge and inspiration. The message from these pioneers is not to scale back but to innovate upward. They offer nothing less than a guide to designing ourselves out of waste and into abundance.
Author: Publisher: ISBN: Category : Languages : en Pages : 28
Book Description
Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.
Author: John H. Lau Publisher: Springer Nature ISBN: 9811613761 Category : Technology & Engineering Languages : en Pages : 513
Book Description
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Author: Wendy Jedlicka Publisher: John Wiley & Sons ISBN: 111910386X Category : Design Languages : en Pages : 370
Book Description
Packaging Sustainability Take the lead with sustainable package design solutions The classic role of packaging is to “Protect, Inform, and Sell.” Today, packaging must do all that—but with minimal eco-impact. Packaging Sustainability: Tools, Systems, and Strategies for Innovative Package Design is a comprehensive guide to thinking outside the box to create practical, cost-effective, and eco-responsible packaging. With a broad range of contributions from pioneers of sustainability, Packaging Sustainability not only describes the concepts of sustainability but reveals the logic behind them, providing you with the tools to sift through and adapt to the ever changing barrage of materials, services, regulations, and mandates. The book: Enables the designer to make smart, informed decisions at all points throughout the packaging design process Offers a comprehensive overview of sustainable packaging design issues from leading practitioners, designers, engineers, marketers, psychologists, and ecologists Describes materials and processes in current use and helps the reader understand how they interconnect With solid information and actionable ideas, Packaging Sustainability gives you all the tools for maximizing a product’s shelf impact—while minimizing its ecological footprint.
Author: Sabaa Tahir Publisher: Penguin ISBN: 0448494558 Category : Young Adult Fiction Languages : en Pages : 504
Book Description
Prepare for the jaw-dropping finale of Sabaa Tahir's beloved New York Times bestselling An Ember in the Ashes fantasy series, and discover: Who will survive the storm? Picking up just a few months after A Reaper at the Gates left off... The long-imprisoned jinn are on the attack, wreaking bloody havoc in villages and cities alike. But for the Nightbringer, vengeance on his human foes is just the beginning. By his side, Commandant Keris Veturia declares herself Empress, and calls for the heads of any and all who defy her rule. At the top of the list? The Blood Shrike and her remaining family. Laia of Serra, now allied with the Blood Shrike, struggles to recover from the loss of the two people most important to her. Determined to stop the approaching apocalypse, she throws herself into the destruction of the Nightbringer. In the process, she awakens an ancient power that could lead her to victory—or to an unimaginable doom. And deep in the Waiting Place, the Soul Catcher seeks only to forget the life—and love—he left behind. Yet doing so means ignoring the trail of murder left by the Nightbringer and his jinn. To uphold his oath and protect the human world from the supernatural, the Soul Catcher must look beyond the borders of his own land. He must take on a mission that could save—or destroy—all that he knows.
Author: Robert Opie Publisher: Book Sales ISBN: 9781555215118 Category : Technology & Engineering Languages : en Pages : 192
Book Description
Displays thousands of objects that have been packaged, with comments on each and a brief introduction to the history of styles of wrappings
Author: Jung H. Han
Author: Jung H. Han
Author: Catharine Fishel
Author: Andrew Barnetson
Author: Josep M. Garrofé
Author: Tom Szaky
Author: 
Author: John H. Lau
Author: Wendy Jedlicka
Author: Sabaa Tahir
Author: Robert Opie