Advances in VLSI, Communication, and Signal Processing PDF Download

Author: Debashis Dutta
Publisher: Springer Nature
ISBN: 9813297751
Category : Technology & Engineering
Languages : en
Pages : 1004

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Book Description
This book comprises select proceedings of the International Conference on VLSI, Communication and Signal processing (VCAS 2018). It looks at latest research findings in VLSI design and applications. The book covers a wide range of topics in electronics and communication engineering, especially in the area of microelectronics and VLSI design, communication systems and networks, and image and signal processing. The contents of this book will be useful to researchers and professionals alike.

Author: Wladyslaw Grabinski
Publisher: Springer Science & Business Media
ISBN: 1402045565
Category : Technology & Engineering
Languages : en
Pages : 298

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Book Description
The editors and authors present a wealth of knowledge regarding the most relevant aspects in the field of MOS transistor modeling. The variety of subjects and the high quality of content of this volume make it a reference document for researchers and users of MOSFET devices and models. The book can be recommended to everyone who is involved in compact model developments, numerical TCAD modeling, parameter extraction, space-level simulation or model standardization. The book will appeal equally to PhD students who want to understand the ins and outs of MOSFETs as well as to modeling designers working in the analog and high-frequency areas.

Author: Mourad Elsobky
Publisher: Cambridge University Press
ISBN: 1108983383
Category : Technology & Engineering
Languages : en
Pages : 92

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Book Description
Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.

Author: Gennady Gildenblat
Publisher: Springer Science & Business Media
ISBN: 9048186145
Category : Technology & Engineering
Languages : en
Pages : 531

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Book Description
Most of the recent texts on compact modeling are limited to a particular class of semiconductor devices and do not provide comprehensive coverage of the field. Having a single comprehensive reference for the compact models of most commonly used semiconductor devices (both active and passive) represents a significant advantage for the reader. Indeed, several kinds of semiconductor devices are routinely encountered in a single IC design or in a single modeling support group. Compact Modeling includes mostly the material that after several years of IC design applications has been found both theoretically sound and practically significant. Assigning the individual chapters to the groups responsible for the definitive work on the subject assures the highest possible degree of expertise on each of the covered models.

Author: Michael Riordan
Publisher: W. W. Norton & Company
ISBN: 9780393041248
Category : Computers
Languages : en
Pages : 384

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Book Description
It's hard to imagine any device more crucial to modern life than the microchip and the transistor from which it sprang. Every waking hour of every day people benefit from its use in cellular phones, computers, radios, TVs, and ATMs. This eloquent retelling of the story behind the invention of the transistor recounts how pride and jealousy coupled with scientific aspirations ignited the greatest technological explosion in history. Photos & drawings.

Author: Yeong-Bin Yang
Publisher: John Wiley & Sons
ISBN: 1119539587
Category : Technology & Engineering
Languages : en
Pages : 282

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Book Description
Presents the first ever guide for vehicle scanning of the dynamic properties of bridges Written by the leading author on the subject of vehicle scanning method (VSM) for bridges, this book allows engineers to monitor every bridge of concern on a regular and routine basis, for the purpose of maintenance and damage detection. It includes a review of the existing literature on the topic and presents the basic concept of extracting bridge frequencies from a moving test vehicle fitted with vibration sensors. How road surface roughness affects the vehicle scanning method is considered and a finite element simulation is conducted to demonstrate how surface roughness affects the vehicle response. Case studies and experimental results are also included. Vehicle Scanning Method for Bridges covers an enhanced technique for extracting higher bridge frequencies. It examines the effect of road roughness on extraction of bridge frequencies, and looks at a dual vehicle technique for suppressing the effect of road roughness. A filtering technique for eliminating the effect of road roughness is also presented. In addition, the book covers the identification of bridge mode shapes, contact-point response for modal identification of bridges, and damage detection of bridges—all through the use of a moving test vehicle. The first book on vehicle scanning of the dynamic properties of bridges Written by the leading author on the subject Includes a state-of-the-art review of the existing works on the vehicle scanning method (VSM) Presents the basic concepts for extracting bridge frequencies from a moving test vehicle fitted with vibration sensors Includes case studies and experimental results The first book to fully cover scanning the dynamic properties of bridges with a vehicle, Vehicle Scanning Method for Bridges is an excellent resource for researchers and engineers working in civil engineering, including bridge engineering and structural health monitoring.

Author: Rino Micheloni
Publisher: Springer
ISBN: 9401775125
Category : Computers
Languages : en
Pages : 391

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Book Description
This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.

Author: H. W. Belmore
Publisher:
ISBN:
Category : Literary Criticism
Languages : en
Pages : 256

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Book Description

Author: Joel S. Miller
Publisher: John Wiley & Sons
ISBN: 3527604502
Category : Science
Languages : en
Pages : 395

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Book Description
Combining the contemporary knowledge from widely scattered sources, this is a much-needed and comprehensive overview of the field. In maintaining a balance between theory and experiment, the book guides both advanced students and specialists to this research area. Topical reviews written by the foremost scientists explain recent trends and advances, focusing on the correlations between electronic structure and magnetic properties. The book spans recent trends in magnetism for molecules -- as well as inorganic-based materials, with an emphasis on new phenomena being explored from both experimental and theoretical viewpoints with the aim of understanding magnetism on the atomic scale. The volume helps readers evaluate their own experimental observations and serves as a basis for the design of new magnetic materials. Topics covered include: * Metallocenium Salts of Radical Anion Bis-(dichalcogenate) metalates * Chiral Molecule-Based Magnets * Cooperative Magnetic Behavior in Metal-Dicyanamide Complexes * Lanthanide Ions in Molecular Exchange Coupled Systems * Monte Carlo Simulation * Metallocene-Based Magnets * Magnetic Nanoporous Molecular Materials A unique reference work, indispensable for everyone concerned with the phenomena of magnetism.

Author: Antoni Planes
Publisher: Springer Science & Business Media
ISBN: 3540316310
Category : Science
Languages : en
Pages : 261

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Book Description
Magnetism and Structure in Functional Materials addresses three distinct but related topics: (i) magnetoelastic materials such as magnetic martensites and magnetic shape memory alloys, (ii) the magnetocaloric effect related to magnetostructural transitions, and (iii) colossal magnetoresistance (CMR) and related manganites. The goal is to identify common underlying principles in these classes of materials that are relevant for optimizing various functionalities. The emergence of apparently different magnetic/structural phenomena in disparate classes of materials clearly points to a need for common concepts in order to achieve a broader understanding of the interplay between magnetism and structure in this general class of new functional materials exhibiting ever more complex microstructure and function. The topic is interdisciplinary in nature and the contributors correspondingly include physicists, materials scientists and engineers. Likewise the book will appeal to scientists from all these areas.