Author: Davis H. HartmanPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 196
Book Description
Integration and Packaging of Optoelectronic Devices
Author: Davis H. HartmanPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 196
Book Description
Optoelectronic Interconnects and Packaging ...
Author: Publisher:
ISBN:
Category : Microelectronic packaging
Languages : en
Pages : 382
Book Description
Optoelectronic Interconnects
Author: Publisher:
ISBN:
Category : Optical communications
Languages : en
Pages : 382
Book Description
Optoelectronic Interconnects and Packaging IV
Author: Ray T. ChenPublisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 378
Book Description
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author: Ephraim SuhirPublisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Integrated Optoelectronics
Author: M. Jamal DeenPublisher: The Electrochemical Society
ISBN: 9781566773706
Category : Technology & Engineering
Languages : en
Pages : 452
Book Description
Optoelectronic Packaging
Author: Alan R. MickelsonPublisher: Wiley-Interscience
ISBN: 9780471111887
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
The missing link in a dynamically growing field--a state-of-the-artreference on optoelectronic packaging The rapidly expanding field of packaging for optoelectronic deviceschallenges electrical engineers with a host of complex and dauntingproblems. The increasing intricacy of assemblage compounds thethorny interconnection issues associated with electronicpackaging-how to assemble an array with many elements efficientlywhile maintaining thermal tolerance and simultaneously overcomingthe ensuing modulation problems that generate electrical noise.Adding to these problems has been the absence, until now, of asingle authoritative reference on the subject. Optoelectronic Packaging is the first and only comprehensivesourcebook on optoelectronic assembly techniques. Foroptoelectronic packaging experts and professionals in adjuncttechnologies, it provides an overview of today's state-of-the-arttechnologies, packages now on the drawing board, and the futuredirection of packaging types. For the novice, it lays down thefundamentals of optics and packaging. This incomparable textfeatures contributions from hands-on practitioners and,supplemented with extensive illustrations, it * Covers detector, semiconductor laser, and optical amplifierpackaging * Discusses waveguide technologies, free-space interconnects, andhybrid technologies * Examines communication system interconnection structure andfiber-optic networks in telecommunications * Explores array device packaging and flip-chip assembly for smartpixel arrays * Includes case studies of packaged subassemblies
Integrated Silicon Optoelectronics
Author: Horst ZimmermannPublisher: Springer Science & Business Media
ISBN: 3662040182
Category : Science
Languages : en
Pages : 338
Book Description
The book covers the entire topic from the basics of optoelectronics, device physics of photodetectors and light emitters, simulation of photodetectors, and technological aspects of optoelectronic integration in microelectronics to circuit aspects and practical applications. It summarizes the state of the art in integrated silicon optoelectronics and reviews recent publications on this topic. Results of basic research on silicon light emitters are included as well, while published results are compared with each other and with the work of the author.
Microelectronic Interconnects and Packages
Author: Publisher:
ISBN:
Category : Optoelectronic devices
Languages : en
Pages : 694
Book Description
Microelectronics Packaging Handbook
Author: Rao TummalaPublisher: Springer Science & Business Media
ISBN: 9780412084515
Category : Computers
Languages : en
Pages : 662
Book Description
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.