Modular Package on Gender, Poverty and Employment PDF Download

Author: International Labour Office
Publisher: International Labour Organization
ISBN: 9789221108382
Category : Business & Economics
Languages : en
Pages : 500

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Author: Yong Liu
Publisher: Springer Science & Business Media
ISBN: 1461410533
Category : Technology & Engineering
Languages : en
Pages : 606

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Book Description
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Author: Peter A. Sandborn
Publisher: Springer Science & Business Media
ISBN: 1475748418
Category : Technology & Engineering
Languages : en
Pages : 270

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Book Description
Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.

Author: Mysore Sriram
Publisher: Springer Science & Business Media
ISBN: 1461526825
Category : Technology & Engineering
Languages : en
Pages : 205

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Book Description
Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

Author: Kamran Sharifabadi
Publisher: John Wiley & Sons
ISBN: 1118851560
Category : Science
Languages : en
Pages : 414

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Book Description
Design, Control and Application of Modular Multilevel Converters for HVDC Transmission Systems is a comprehensive guide to semiconductor technologies applicable for MMC design, component sizing control, modulation, and application of the MMC technology for HVDC transmission. Separated into three distinct parts, the first offers an overview of MMC technology, including information on converter component sizing, Control and Communication, Protection and Fault Management, and Generic Modelling and Simulation. The second covers the applications of MMC in offshore WPP, including planning, technical and economic requirements and optimization options, fault management, dynamic and transient stability. Finally, the third chapter explores the applications of MMC in HVDC transmission and Multi Terminal configurations, including Supergrids. Key features: Unique coverage of the offshore application and optimization of MMC-HVDC schemes for the export of offshore wind energy to the mainland. Comprehensive explanation of MMC application in HVDC and MTDC transmission technology. Detailed description of MMC components, control and modulation, different modeling approaches, converter dynamics under steady-state and fault contingencies including application and housing of MMC in HVDC schemes for onshore and offshore. Analysis of DC fault detection and protection technologies, system studies required for the integration of HVDC terminals to offshore wind power plants, and commissioning procedures for onshore and offshore HVDC terminals. A set of self-explanatory simulation models for HVDC test cases is available to download from the companion website. This book provides essential reading for graduate students and researchers, as well as field engineers and professionals who require an in-depth understanding of MMC technology.

Author: Jun Dong Cho
Publisher: World Scientific
ISBN: 9814500267
Category : Technology & Engineering
Languages : en
Pages : 266

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Book Description
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

Author: Ernest Kuh
Publisher: World Scientific
ISBN: 9814505722
Category : Technology & Engineering
Languages : en
Pages : 158

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Book Description
Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.

Author: Rob Cowell
Publisher: Packt Publishing Ltd
ISBN: 1837634238
Category : Computers
Languages : en
Pages : 260

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Book Description
Master Salesforce DevOps while exploring deployment, packages, Git workflows, and organizational monitoring using third-party tools such as Salesforce DX, GitHub, Jenkins, Gearset, and Copado Key Features Learn how to build a DevOps culture to mitigate project risks and boost return on investment (ROI) Delve into the principles of DevOps and how to apply them in Salesforce for maximum efficiency Explore Salesforce DevOps tools, with examples and strategies for building a robust DevOps stack Purchase of the print or Kindle book includes a free PDF eBook Book DescriptionRob Cowell is a Salesforce DevOps Advocate with extensive experience as a Salesforce Developer and Architect, guiding best practices for Salesforce DevOps. Lars Malmqvist, a 32x certified Salesforce CTA, has 15 years of experience building advanced Salesforce solutions and is the author of two books, Architecting AI Solutions on Salesforce and Salesforce Anti-Patterns. As the Salesforce Platform evolves, architects face increasing demand for advanced solutions. This book serves as your definitive guide to mastering effective DevOps practices crucial for successful Salesforce projects. Beginning with cultivating a DevOps mindset focused on collaboration and communication, it emphasizes governance, visibility, and accountability. You'll delve into tools and techniques, leveraging the robust capabilities of SFDX to craft your strategy efficiently. This book stands out for its practical approach to Salesforce packaging and CI/CD stack creation, guiding you to build a seamless automated change delivery system with freely available software. It addresses critical operational concerns such as ticket management, backups, change monitoring, and data seeding. In the final chapters, you'll discover third-party solutions to expedite your Salesforce DevOps journey, empowering you to deliver sophisticated and efficient projects.What you will learn Grasp the fundamentals of integrating a DevOps process into Salesforce project delivery Master the skill of communicating the benefits of Salesforce DevOps to stakeholders Recognize the significance of fostering a DevOps culture and its impact on Salesforce projects Understand the role of metrics in DevOps architecture within Salesforce environments Gain insights into the components comprising a Salesforce DevOps toolchain Discover strategies for maintaining a healthy Salesforce org with a variety of supporting DevOps tools Who this book is for If you are a Salesforce architect or senior developer looking to bring DevOps best practices to your projects, this book is for you. To learn from this book, you should have a strong familiarity with Salesforce platform development both in code and low-code, understand concepts such as metadata, JSON, and XML, and feel at ease with command-line operations.

Author: United States. National Aeronautics and Space Administration. Scientific and Technical Information Division
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 2088

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Book Description

Author: Lawrence L. Rosine
Publisher: Springer
ISBN: 1489973079
Category : Technology & Engineering
Languages : en
Pages : 303

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Book Description