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Author: Sadik Kakaç Publisher: Springer Science & Business Media ISBN: 9401110905 Category : Technology & Engineering Languages : en Pages : 953
Book Description
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author: Satish Kandlikar Publisher: Elsevier ISBN: 9780080445274 Category : Science Languages : en Pages : 492
Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Author: Publisher: ISBN: Category : Heat Languages : en Pages : 60
Book Description
Jet impingement has been an attractive cooling option in a number of industries over the past few decades. Over the past 15 years, jet impingement has been explored as a cooling option in microelectronics. Recently, interest has been expressed by the automotive industry in exploring jet impingement for cooling power electronics components. This technical report explores, from a modeling perspective, both single-phase and boiling jet impingement cooling in power electronics, primarily from a heat transfer viewpoint. The discussion is from the viewpoint of the cooling of IGBTs (insulated-gate bipolar transistors), which are found in hybrid automobile inverters.
Author: Ho-Ming Tong Publisher: Springer Science & Business Media ISBN: 1441957685 Category : Technology & Engineering Languages : en Pages : 562
Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author: Guan Heng Yeoh Publisher: Elsevier ISBN: 0080914896 Category : Computers Languages : en Pages : 658
Book Description
Mixed or multiphase flows of solid/liquid or solid/gas are commonly found in many industrial fields, and their behavior is complex and difficult to predict in many cases. The use of computational fluid dynamics (CFD) has emerged as a powerful tool for the understanding of fluid mechanics in multiphase reactors, which are widely used in the chemical, petroleum, mining, food, beverage and pharmaceutical industries. Computational Techniques for Multiphase Flows enables scientists and engineers to the undertand the basis and application of CFD in muliphase flow, explains how to use the technique, when to use it and how to interpret the results and apply them to improving aplications in process enginering and other multiphase application areas including the pumping, automotive and energy sectors. - Understandable guide to a complex subject - Important in many industries - Ideal for potential users of CFD
Author: Dan M. Goebel Publisher: John Wiley & Sons ISBN: 0470436263 Category : Technology & Engineering Languages : en Pages : 528
Book Description
Throughout most of the twentieth century, electric propulsion was considered the technology of the future. Now, the future has arrived. This important new book explains the fundamentals of electric propulsion for spacecraft and describes in detail the physics and characteristics of the two major electric thrusters in use today, ion and Hall thrusters. The authors provide an introduction to plasma physics in order to allow readers to understand the models and derivations used in determining electric thruster performance. They then go on to present detailed explanations of: Thruster principles Ion thruster plasma generators and accelerator grids Hollow cathodes Hall thrusters Ion and Hall thruster plumes Flight ion and Hall thrusters Based largely on research and development performed at the Jet Propulsion Laboratory (JPL) and complemented with scores of tables, figures, homework problems, and references, Fundamentals of Electric Propulsion: Ion and Hall Thrusters is an indispensable textbook for advanced undergraduate and graduate students who are preparing to enter the aerospace industry. It also serves as an equally valuable resource for professional engineers already at work in the field.
Author: Alexander Louis London Publisher: CRC Press ISBN: 9781560320128 Category : Heat exchangers Languages : en Pages : 798
Book Description
Heat exchangers are a crucial part of aerospace, marine, cryogenic and refrigeration technology. These essays cover such topics as complicated flow arrangements, complex extended surfaces, two-phase flow and irreversibility in heat exchangers, and single-phase heat transfer.
Author: S. M. Sohel Murshed Publisher: BoD – Books on Demand ISBN: 9535124056 Category : Computers Languages : en Pages : 184
Book Description
Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.
Author: Richard J. Goldstein Publisher: ISBN: 9781573313285 Category : Calorimetry Languages : en Pages : 0
Book Description
Explores recent developments in heat transfer and thermal control applied to modern high-temperature gas turbine systems. It examines experimental results and techniques computational studies and methods and design recommendations. Aspects of heat transfer in rotating machinery are studied as well as thermal aspects of other sections of the turbine (e.g. the compressor). Proceedings of an August 2000 conference.
Author: Xingcun Colin Tong Publisher: Springer Science & Business Media ISBN: 1441977597 Category : Technology & Engineering Languages : en Pages : 633
Book Description
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Author: Sadik Kakaç
Author: Satish Kandlikar
Author: 
Author: Ho-Ming Tong
Author: Guan Heng Yeoh
Author: 
Author: Dan M. Goebel
Author: Alexander Louis London
Author: S. M. Sohel Murshed
Author: Richard J. Goldstein
Author: Xingcun Colin Tong