Author: Injoon JoPublisher:
ISBN:
Category :
Languages : en
Pages : 124
Book Description
Modeling and Analysis of Thermally-aware Substrate Noise Coupling in Nanometer-scale Mixed-signal ICs
Author: Injoon JoAnalysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs
Author: X. AragonesPublisher: Springer Science & Business Media
ISBN: 1475730136
Category : Technology & Engineering
Languages : en
Pages : 242
Book Description
Modern microelectronic design is characterized by the integration of full systems on a single die. These systems often include large high performance digital circuitry, high resolution analog parts, high driving I/O, and maybe RF sections. Designers of such systems are constantly faced with the challenge to achieve compatibility in electrical characteristics of every section: some circuitry presents fast transients and large consumption spikes, whereas others require quiet environments to achieve resolutions well beyond millivolts. Coupling between those sections is usually unavoidable, since the entire system shares the same silicon substrate bulk and the same package. Understanding the way coupling is produced, and knowing methods to isolate coupled circuitry, and how to apply every method, is then mandatory knowledge for every IC designer. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an in-depth look at coupling through the common silicon substrate, and noise at the power supply lines. It explains the elementary knowledge needed to understand these phenomena and presents a review of previous works and new research results. The aim is to provide an understanding of the reasons for these particular ways of coupling, review and suggest solutions to noise coupling, and provide criteria to apply noise reduction. Analysis and Solutions for Switching Noise Coupling in Mixed-Signal ICs is an ideal book, both as introductory material to noise-coupling problems in mixed-signal ICs, and for more advanced designers facing this problem.
Substrate Noise Coupling in Mixed-Signal ASICs
Author: Stéphane DonnayPublisher: Springer Science & Business Media
ISBN: 9781402073816
Category : Computers
Languages : en
Pages : 332
Book Description
Driven by applications such as telecommunications, computing and consumer/multimedia and facilitated by the progress in CMOS ULSI technology, the microelectronics IC market is characterized by an ever-increasing level of integration complexity. Today complete systems, that previously occupied one or more boards, are integrated on a few chips or even on one single multi-million transistor chip - a so called System-on-Chip (SoC). Although most functions in such integrated systems are implemented with digital or digital signal processing circuitry, the analog circuits needed at the interface between the electronic system and the continuous-valued outside world are also being integrated on the same die for reasons of cost and performance. Unfortunately, the integration of both analog & RF circuits and digital circuits on the same die not only offers many benefits, but also creates some technical difficulties. Since the analog circuits exploit the low-level physics of the fabrication process, they remain difficult and costly to design, but they are also vulnerable to any kind of noise or crosstalk signals. The higher levels of integration (moving towards 100 million transistors per chip clocked at ever higher frequencies) make the mixed-signal signal integrity problem increasingly challenging. One of the most important problems is the parasitic supply and substrate noise coupling, caused by the fast switching of the digital circuitry that then propagates to the sensitive analog circuitry via the common substrate. It is therefore important to be able to predict the impact of digital switching noise on the analog circuit performance at the design stage of the integrated system, before the chip is taped out for fabrication, and to understand how this problem can be reduced. The purpose of Substrate Noise Coupling in Mixed-Signal ASICs is to provide an overview of very recent research results in the field of substrate noise analysis and reduction techniques. Much of the reported work has been established as part of the Mixed-Signal Initiative of the European Union. It is a representative sampling of the current state of the art in this area. All the different aspects of the substrate noise coupling problem are covered. Some chapters describe techniques to model and reduce the digital switching noise injected in the substrate. Other chapters describe methods to analyse the propagation of the noise from the source (the digital circuitry) to the reception point (the embedded analog circuitry) through the substrate considered as a resistive/capacitive mesh. Finally, the remaining chapters describe techniques to model and especially to reduce the impact of substrate noise on the analog side. This is illustrated with several practical design examples and measurement results.
Synthesized Compact Models for Substrate Noise Coupling in Mixed-signal ICS
Author: Hai LanModeling of Substrate Noise Coupling in Mixed-signal Integrated Circuits
Author: Nawej MwezPublisher:
ISBN:
Category : Electronic noise
Languages : en
Pages : 234
Book Description
Analysis of Substrate Noise Coupling in Mixed Signal Integrated Circuits
Author: Cole Erwin ZemkeSubstrate Noise Modeling and Suppression in RF/mixed Signal IC Technology
Author: Haitao DaiThermally-Aware Design
Author: Yong ZhanPublisher: Now Publishers Inc
ISBN: 1601981708
Category : Integrated circuits
Languages : en
Pages : 131
Book Description
Provides an overview of analysis and optimization techniques for thermally-aware chip design.
Physical Design for 3D Integrated Circuits
Author: Aida Todri-SanialPublisher: CRC Press
ISBN: 1351830198
Category : Technology & Engineering
Languages : en
Pages : 409
Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Dissertation Abstracts International
Author: Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 776
Book Description