Author: Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 178
Book Description
Microelectronics, II.
Author: Materials Science in Microelectronics II
Author: Eugene MachlinPublisher: Elsevier
ISBN: 0080460402
Category : Technology & Engineering
Languages : en
Pages : 268
Book Description
The subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: •Electrical properties•Magnetic properties•Optical properties•Mechanical properties•Mass transport properties•Interface and junction properties•Defects and properties - Captures the importance of thin films to microelectronic development - Examines the cause / effect relationship of structure on thin film properties
Microelectronics Packaging Handbook
Author: Rao TummalaPublisher: Springer Science & Business Media
ISBN: 9780412084515
Category : Computers
Languages : en
Pages : 662
Book Description
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Materials Reliability in Microelectronics II: Volume 265
Author: C. V. ThompsonPublisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 352
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Technology of Integrated Circuits
Author: D. WidmannPublisher: Springer Science & Business Media
ISBN: 366204160X
Category : Technology & Engineering
Languages : en
Pages : 355
Book Description
This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.
Microelectronic Circuit Design
Author: Richard C. JaegerPublisher: McGraw-Hill Science, Engineering & Mathematics
ISBN: 9780073309484
Category : Digital electronics
Languages : en
Pages : 0
Book Description
Microelectronic Circuit Designis known for being a technically excellent text. The new edition has been revised to make the material more motivating and accessible to students while retaining a student-friendly approach.Jaeger has added more pedagogy and an emphaisis on design through the use of design examples and design notes. Some pedagogical elements include chapter opening vignettes, chapter objectives, "Electronics in Action" boxes, a problem solving methodology, and "design note" boxes. The number of examples, including new design examples, has been increased, giving students more opportunity to see problems worked out. Additionally,some of the less fundamental mathematical material has been moved to the ARIS website. In addition this edition comes with aHomework Management System called ARIS, which includes 450 static problems.
Monthly Catalogue, United States Public Documents
Author: Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1152
Book Description
Monthly Catalog of United States Government Publications
Author: Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1094
Book Description
Consumer Electronics for Engineers
Author: Philip HoffPublisher: Cambridge University Press
ISBN: 9780521588171
Category : Technology & Engineering
Languages : en
Pages : 576
Book Description
This book explains the operating principles of 'real world' electronic devices.
Biology
Author: Michael RobertsPublisher: Nelson Thornes
ISBN: 9780748762385
Category : Juvenile Nonfiction
Languages : en
Pages : 354
Book Description
Developed by leading and highly experienced authors, this series provides complete coverage of all the major GCSE science specifications.