Microelectronics and Microsystems PDF Download

Author: Luigi Fortuna
Publisher: Springer Science & Business Media
ISBN: 1447106717
Category : Technology & Engineering
Languages : en
Pages : 216

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Book Description
The book presents the best contributions, extracted from the theses written by the students who have attended the second edition of the Master in Microelectronics and Systems that has been organized by the Universita degli Studi di Catania and that has been held at the STMicroelectronics Company (Catania Site) from May 2000 to January 2001. In particular, the mentioned Master has been organized among the various ac tivities of the "Istituto Superiore di Catania per la Formazione di Eccellenza". The Institute is one of the Italian network of universities selected by MURST (Ministry University Research Scientific Technology). The first aim of tl;te Master in Microelectronics and Systems is to increase the skills of the students with the Laurea Degree in Physics or Electrical Engineering in the more advanced areas as VLSI system design, high-speed low-voltage low-power circuitS and RF systems. The second aim has been to involve in the educational program companies like STMicroelectronics, ACCENT and ITEL, interested in emergent microelectronics topics, to cooperate with the University in developing high-level research projects. Besides the tutorial activity during the teaching hours, provided by national and international researchers, a significant part of the School has been dedicated to the presentation of specific CAD tools and experiments in order to prepare the students to solve specific problems during the stage period and in the thesis work.

Author: Suzanne Costello
Publisher: Artech House
ISBN: 1608075273
Category : Technology & Engineering
Languages : en
Pages : 197

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Book Description
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.

Author: Krzysztof Iniewski
Publisher: CRC Press
ISBN: 1439836205
Category : Medical
Languages : en
Pages : 762

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Book Description
As rapid technological developments occur in electronics, photonics, mechanics, chemistry, and biology, the demand for portable, lightweight integrated microsystems is relentless. These devices are getting exponentially smaller, increasingly used in everything from video games, hearing aids, and pacemakers to more intricate biomedical engineering and military applications. Edited by Kris Iniewski, a revolutionary in the field of advanced semiconductor materials, Integrated Microsystems: Electronics, Photonics, and Biotechnology focuses on techniques for optimized design and fabrication of these intelligent miniaturized devices and systems. Composed of contributions from experts in academia and industry around the world, this reference covers processes compatible with CMOS integrated circuits, which combine computation, communications, sensing, and actuation capabilities. Light on math and physics, with a greater emphasis on microsystem design and configuration and electrical engineering, this book is organized in three sections—Microelectronics and Biosystems, Photonics and Imaging, and Biotechnology and MEMs. It addresses key topics, including physical and chemical sensing, imaging, smart actuation, and data fusion and management. Using tables, figures, and equations to help illustrate concepts, contributors examine and explain the potential of emerging applications for areas including biology, nanotechnology, micro-electromechanical systems (MEMS), microfluidics, and photonics.

Author: Androula G. Nassiopoulou
Publisher: World Scientific
ISBN: 9789812810861
Category : Technology & Engineering
Languages : en
Pages : 198

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Book Description
This volume contains papers on the following: CMOS devices and devices based on compound semiconductors; processing; silicon integrated technology and integrated circuit design; quantum physics; nanotechnology; nanodevices, sensors and microsystems. The latest news and future challenges in these fields are presented in invited papers. Contents: Nanotechnology and Quantum Devices: A New Strategy for In Situ Synthesis of Oligonucleotides Arrays for DNA Chip Technology (F Vinet et al.); Magnetotransport Properties of La-Ca-Mn-O Multilayers (C Christides); Charge Effects and Related Transport Phenomena in Nanosize Silicon/Insulator Structures (J A Berashevich et al.); Thermoelectric Properties of Composite Fermions (M Tsaousidou & G P Triberis); Design and Fabrication of Supported-Metal Catalysts Through Nanotechnology (I Zuburtikudis); Ground State Electronic Structure of Small Si Quantum Dots (C S Garoufalis et al.); Processing: Solid Interface Studies with Applications in Microelectronics (S Kennou et al.); Rapid Thermal Annealing of Arsenic Implanted Silicon for the Formation of Ultra Shallow n+p Junctions (N Georgoulas et al.); Simulation of the Formation and Characterization of Roughness in Photoresists (G P Patsis et al.); Development of a New Low Energy Electron Beam Lithography Simulation Tool (D Velessiotis et al.); CMOS Devices and Devices Based on Compound Semiconductors: Microhardness Characterization of Epitaxially Grown GaN Films. Effect of Light Ion Implantation (P Kavouras et al.); Multiple Quantum Well Solar Cells Under AM1 and Concentrated Sunlight (E Aperathitis et al.); The Influence of Silicon Interstitial Clustering on the Reverse Short Channel Effect (C Tsamis & D Tsoukalas); Noise Modeling of Interdigitated Gate CMOS Devices (E F Tsakas & A N Birbas); High Precision CMOS Euclidean Distance Computing Circuit (G Fikos & S Siskos); Microsystems: Alternative Signal Extraction Technique for Miniature Fluxgates (P D Dimitropoulos & J N Avaritsiotis); Silicon Capacitive Pressure Sensors and Pressure Switches Fabricated Using Silicon Fusion Bonding (S Koliopoulou et al.); Microsystems for Acoustical Signal Detection Applications (D K Fragoulis & J N Avaritsiotis); Capillary Format Bioanalytical Microsystems (K Misiakos et al.); Effectiveness of Local Thermal Isolation by Porous Silicon in a Silicon Thermal Sensor (D Pagonis et al.); Silicon Integrated Technology and Integrated Circuit Design: MOSFET Model Benchmarking Using a Novel CAD Tool (N A Nastos & Y Papananos); Power Amplifier Linearisation Techniques: An Overview (N Naskas & Y Papananos); The Design of a Ripple Carry Adiabatic Adder (V Pavlidis et al.); Maximum Power Estimation in CMOS VLSI Circuits (N E Evmorfopoulos et al.); Power Dissipation Considerations in Low-Voltage CMOS Circuits (A A Hatzopoulos); Microelectronics Networks/Technology Transfer and Exploitation: EURACCESS: A European Platform for Access to CMOS Processing (C L Claeys); MMN: Greek Network on Microelectronics, Microsystems and Nanotechnology (A G Nassiopoulou); Simulations of Molecular Electronics (S T Pantelides et al.); and other papers. Readership: Researchers, academics, industrialists and undergraduates in microelectronics, nanoscience, materials science, applied physics and condensed matter physics.

Author: G.Q. Zhang
Publisher: Springer Science & Business Media
ISBN: 1402049358
Category : Technology & Engineering
Languages : en
Pages : 580

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Book Description
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

Author: Wolfgang Menz
Publisher: John Wiley & Sons
ISBN: 3527613013
Category : Technology & Engineering
Languages : de
Pages : 512

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Book Description
This completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating.

Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979

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Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing

Author: Ton J. Mouthaan
Publisher: Springer Science & Business Media
ISBN: 9401151105
Category : Technology & Engineering
Languages : en
Pages : 299

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Book Description
Dear participant in the second European Workshop on Microelectronics Education, It is a pleasure to present you the Proceedings of the Second European Workshop on Microelectronics Education and to welcome you at the Workshop. The Organising Committee is very pleased that it has found several key persons, with highly appreciated levels of knowledge and expertise, willing to present Invited Contributions to this Workshop. We have striven for an interesting spread over important areas like the expected demands for educated engineers in the wide field of Microelectronics, and Microsystems, in European industry (and beyond!) and innovations in method and focus of our educational programmes. This is the second European Workshop in this area; the first one was held in Grenoble in France in the spring of 1996. It was the initiative of Georges Kamarinos, Nadine Guillemot and Bernard Courtois to organise this Workshop because they felt that Microelectronics was 'at a turning point' to become the core of the largest industry in the world and that this warranted a serious (re-)consideration of our educational imperatives. It is now two years since and their feeling has become reality: nobody doubts that by the year 2000 the microelecnonics industry will be the largest industrial sector. It is also obvious that because of that and because of the predicted shortfall of educated engineers we must continuously reconsider the quality of our educational approach.

Author: Gerald Gerlach
Publisher: John Wiley & Sons
ISBN: 0470770929
Category : Technology & Engineering
Languages : en
Pages : 376

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Book Description
Over half a century after the discovery of the piezoresistive effect, microsystem technology has experienced considerable developments. Expanding the opportunities of microelectronics to non-electronic systems, its number of application fields continues to increase. Microsensors are one of the most important fields, used in medical applications and micromechanics. Microfluidic systems are also a significant area, most commonly used in ink-jet printer heads. This textbook focuses on the essentials of microsystems technology, providing a knowledgeable grounding and a clear path through this well-established scientific dicipline. With a methodical, student-orientated approach, Introduction to Microsystem Technology covers the following: microsystem materials (including silicon, polymers and thin films), and the scaling effects of going micro; fabrication techniques based on different material properties, descriptions of their limitations and functional and shape elements produced by these techniques; sensors and actuators based on elements such as mechanical, fluidic, and thermal (yaw rate sensor components are described); the influence of technology parameters on microsystem properties, asking, for example, when is the function of a microsystem device robust and safe? The book presents problems at the end of each chapter so that you may test your understanding of the key concepts (full solutions for these are given on an accompanying website). Practical examples are included also, as well as case studies that enable a better understanding of the technology as a whole. With its extensive treatment on the fundamentals of microsystem technology, this book also serves as a compendium for engineers and technicians working with microsystem technology.

Author: Stephen D. Senturia
Publisher: Springer Science & Business Media
ISBN: 0306476010
Category : Technology & Engineering
Languages : en
Pages : 699

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Book Description
It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.