Author: International Society for Hybrid MicroelectronicsPublisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 616
Book Description
Microelectronic Processing Technician Course Curriculum
Author: International Society for Hybrid MicroelectronicsPublisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 616
Book Description
Handbook of Thick- and Thin-Film Hybrid Microelectronics
Author: Tapan GuptaPublisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
Book Description
This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Proceedings of the 1991 International Symposium on Microelectronics, October 21-23, 1991, Orange County Convention Center, Orlando, Florida
Author: Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 588
Book Description
Electronic Materials Handbook
Author: Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
The International Journal of Microcircuits and Electronic Packaging
Author: Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 1220
Book Description
Proceedings of the Technical Conference
Author: Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 656
Book Description
The Cumulative Book Index
Author: Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 2152
Book Description
Frontiers in Education 1997
Author: Proceedings of the ... International Symposium on Microelectronics
Author: Publisher:
ISBN:
Category : Hybrid integrated circuits
Languages : en
Pages : 944
Book Description
Frontiers in Education 1997 27th Annual Conference
Author: Publisher:
ISBN: 9780780340879
Category : Engineering
Languages : en
Pages : 626
Book Description