Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging PDF Download

Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471

View

Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Author: Elena R. Dobrovinskaya
Publisher: Springer Science & Business Media
ISBN: 0387856951
Category : Technology & Engineering
Languages : en
Pages : 493

View

Book Description
By the second half of the twentieth century, a new branch of materials science had come into being — crystalline materials research. Its appearance is linked to the emergence of advanced technologies primarily based on single crystals (bulk crystals and films). At the turn of the last century, the impending onset of the “ceramic era” was forecasted. It was believed that ceramics would play a role comparable to that of the Stone or Bronze Ages in the history of civilization. Naturally, such an assumption was hypothetical, but it showed that ceramic materials had evoked keen interest among researchers. Although sapphire traditionally has been considered a gem, it has developed into a material typical of the “ceramic era.” Widening the field of sapphire application necessitated essential improvement of its homogeneity and working characteristics and extension of the range of sapphire products, especially those with stipulated properties including a preset structural defect distribution. In the early 1980s, successful attainment of crystals with predetermined char- teristics was attributed to proper choice of the growth method. At present, in view of the fact that the requirements for crystalline products have become more str- gent, such an approach tends to be insufficient. It is clear that one must take into account the physical–chemical processes that take place during the formation of the real crystal structure, i.e., the growth mechanisms and the nature and causes of crystal imperfections.

Author: Ephraim Suhir
Publisher: John Wiley & Sons
ISBN: 047088679X
Category : Technology & Engineering
Languages : en
Pages : 610

View

Book Description
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

Author: Ephraim Suhir
Publisher: CRC Press
ISBN: 0429863829
Category : Technology & Engineering
Languages : en
Pages : 344

View

Book Description
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.

Author: X.J. Fan
Publisher: Springer Science & Business Media
ISBN: 1441957197
Category : Technology & Engineering
Languages : en
Pages : 573

View

Book Description
Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Author: Aloke Paul
Publisher: Elsevier
ISBN: 0128045787
Category : Science
Languages : en
Pages : 478

View

Book Description
Handbook of Solid State Diffusion, Volume 2: Diffusion Analysis in Material Applications covers the basic fundamentals, techniques, applications, and latest developments in the area of solid-state diffusion, offering a pedagogical understanding for students, academicians, and development engineers. Both experimental techniques and computational methods find equal importance in the second of this two volume set. Volume 2 covers practical issues on diffusion phenomena in bulk, thin film, and in nanomaterials. Diffusion related problems and analysis of methods in industrial applications, such as electronic industry, high temperature materials, nuclear materials, and superconductor materials are discussed. - Presents a handbook with a short mathematical background and detailed examples of concrete applications of the sophisticated methods of analysis - Enables readers to learn the basic concepts of experimental approaches and the computational methods involved in solid-state diffusion - Covers bulk, thin film, and nanomaterials - Introduces the problems and analysis in important materials systems in various applications - Collates contributions from academic and industrial problems from leading scientists involved in developing key concepts across the globe

Author: John Hock Lye Pang
Publisher: Springer Science & Business Media
ISBN: 1461404630
Category : Technology & Engineering
Languages : en
Pages : 184

View

Book Description
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

Author: Vijay Janyani
Publisher: Springer
ISBN: 9811073953
Category : Technology & Engineering
Languages : en
Pages : 706

View

Book Description
This book presents selected papers from 1st International Conference on Optical and Wireless Technologies, providing insights into the analytical, experimental, and developmental aspects of systems, techniques, and devices in these spheres. It explores the combined use of various optical and wireless technologies in next-generation networking applications, and discusses the latest developments in applications such as photonics, high-speed communication systems and networks, visible light communication, nanophotonics, and wireless and multiple-input-multiple-output (MIMO) systems. The book will serve as a valuable reference resource for academics and researchers across the globe.

Author: Fredrick Madaraka Mwema
Publisher: CRC Press
ISBN: 1000597318
Category : Technology & Engineering
Languages : en
Pages : 309

View

Book Description
Thin Film Coatings: Properties, Deposition, and Applications discusses the holistic subject of conventional and emerging thin film technologies without bias to a specific technology based on the existing literature. It covers properties and delves into the various methods of thin film deposition, including the most recent techniques and a direction for future developments. It also discusses the cutting-edge applications of thin film coatings such as self-healing and smart coatings, biomedical, hybrid, and scalable thin films. Finally, the concept of Industry 4.0 in thin film coating technology is examined. This book: Explores a wide range and is not specific to material and method of deposition Demonstrates the application of thin film coatings in nearly all sectors, such as energy and anti-microbial applications Details the preparation and properties of hybrid and scalable (ultra) thin materials for advanced applications Provides detailed bibliometric analyses on applications of thin film coatings Discusses Industry 4.0 and 3D printing in thin film technology With its broad coverage, this comprehensive reference will appeal to a wide audience of materials scientists and engineers and others studying and developing advanced thin film technologies.

Author: Sulaiman Khalifeh
Publisher: Elsevier
ISBN: 192788568X
Category : Technology & Engineering
Languages : en
Pages : 617

View

Book Description
Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components