Author: Muhammad Abdul Khaliq
Publisher:
ISBN:
Category : Metal oxide semiconductors
Languages : en
Pages : 368
Book Description
Memory Quality Silicon Nitride Deposited by Plasma-enhanced Chemical Vapor Deposition
Author: Muhammad Abdul Khaliq
Publisher:
ISBN:
Category : Metal oxide semiconductors
Languages : en
Pages : 368
Book Description
Publisher:
ISBN:
Category : Metal oxide semiconductors
Languages : en
Pages : 368
Book Description
Characteristics of Silicon Nitride Deposited by VHF (162 MHz)-plasma Enhanced Chemical Vapor Deposition Using a Multi-tile Push–pull Plasma Source
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Abstract: To prevent moisture and oxygen permeation into flexible organic electronic devices formed on substrates, the deposition of an inorganic diffusion barrier material such as SiN x is important for thin film encapsulation. In this study, by a very high frequency (162 MHz) plasma-enhanced chemical vapor deposition (VHF-PECVD) using a multi-tile push–pull plasma source, SiN x layers were deposited with a gas mixture of NH3 /SiH4 with/without N2 and the characteristics of the plasma and the deposited SiN x film as the thin film barrier were investigated. Compared to a lower frequency (60 MHz) plasma, the VHF (162 MHz) multi-tile push–pull plasma showed a lower electron temperature, a higher vibrational temperature, and higher N2 dissociation for an N2 plasma. When a SiN x layer was deposited with a mixture of NH3 /SiH4 with N2 at a low temperature of 100 °C, a stoichiometric amorphous Si3 N4 layer with very low Si–H bonding could be deposited. The 300 nm thick SiN x film exhibited a low water vapor transmission rate of 1.18 × 10 −4 g (m 2 · d) −1, in addition to an optical transmittance of higher than 90%.
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Abstract: To prevent moisture and oxygen permeation into flexible organic electronic devices formed on substrates, the deposition of an inorganic diffusion barrier material such as SiN x is important for thin film encapsulation. In this study, by a very high frequency (162 MHz) plasma-enhanced chemical vapor deposition (VHF-PECVD) using a multi-tile push–pull plasma source, SiN x layers were deposited with a gas mixture of NH3 /SiH4 with/without N2 and the characteristics of the plasma and the deposited SiN x film as the thin film barrier were investigated. Compared to a lower frequency (60 MHz) plasma, the VHF (162 MHz) multi-tile push–pull plasma showed a lower electron temperature, a higher vibrational temperature, and higher N2 dissociation for an N2 plasma. When a SiN x layer was deposited with a mixture of NH3 /SiH4 with N2 at a low temperature of 100 °C, a stoichiometric amorphous Si3 N4 layer with very low Si–H bonding could be deposited. The 300 nm thick SiN x film exhibited a low water vapor transmission rate of 1.18 × 10 −4 g (m 2 · d) −1, in addition to an optical transmittance of higher than 90%.
Plasma-enhanced Chemical Vapor Deposition of Silicon Nitride from 1,1,3,3,5,5,-hexamethylcyclotrisilazane
Synthesis and Characterization of Silicon Nitride Films Deposited by Plasma Enhanced Chemical Vapor Deposition Using Diethylsilane
Author: Yanyao Yu
Publisher:
ISBN:
Category : Diethysilane
Languages : en
Pages : 116
Book Description
Publisher:
ISBN:
Category : Diethysilane
Languages : en
Pages : 116
Book Description
Structural, Optical, and Mechanical Properties of Silicon Nitride Films Deposited by Inductively Coupled Plasma Enhanced Chemical Vapor Deposition
Plasma Enhanced Chemical Vapor Depostion of Fluorinated Silicon Nitride
Author: Rhett Eugene Livengood
Publisher:
ISBN:
Category :
Languages : en
Pages : 304
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 304
Book Description
Proceedings of the Symposium on Silicon Nitride and Silicon Dioxide Thin Insulating Films
Author: Vikram J. Kapoor
Publisher:
ISBN:
Category : Electric and insulation
Languages : en
Pages : 570
Book Description
Publisher:
ISBN:
Category : Electric and insulation
Languages : en
Pages : 570
Book Description
Thermal and Plasma Enhanced Chemical Vapor Deposition of Silicon Nitride Films
Author: Sui-Yuan Lynn
Publisher:
ISBN:
Category : Silicon nitride
Languages : en
Pages : 212
Book Description
Publisher:
ISBN:
Category : Silicon nitride
Languages : en
Pages : 212
Book Description
Synthesis and Characterization of Silicon Nitride Film Deposited by Plasma Enhanced Chemical Vapor Deposition from Ditertiary-butyl Silane
Author: Kei-Turng Shih
Publisher:
ISBN:
Category : Ditertiary-butyl silane
Languages : en
Pages : 158
Book Description
Publisher:
ISBN:
Category : Ditertiary-butyl silane
Languages : en
Pages : 158
Book Description
Modeling of Plasma-enhanced Chemical Vapor Deposited Silicon Nitride Thin Films Into Confined Geometries
Author: Ronald James Spence
Publisher:
ISBN:
Category : Plasma-enhanced chemical vapor deposition
Languages : en
Pages : 460
Book Description
Publisher:
ISBN:
Category : Plasma-enhanced chemical vapor deposition
Languages : en
Pages : 460
Book Description