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Author: Eugene Machlin Publisher: Elsevier ISBN: 0080459609 Category : Technology & Engineering Languages : en Pages : 275
Book Description
Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship – that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer – determines the ultimate structure of the thin film, and thus its properties. This volume takes into consideration the following potential influencing factors: crystal defects, void structure, grain structure, interface structure in epitaxial films, the structure of amorphous films, and reaction-induced structure.An ideal text or reference work for students and researchers in material science, who need to learn the basics of thin films.
Author: Eugene Machlin Publisher: Elsevier ISBN: 0080459609 Category : Technology & Engineering Languages : en Pages : 275
Book Description
Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship – that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer – determines the ultimate structure of the thin film, and thus its properties. This volume takes into consideration the following potential influencing factors: crystal defects, void structure, grain structure, interface structure in epitaxial films, the structure of amorphous films, and reaction-induced structure.An ideal text or reference work for students and researchers in material science, who need to learn the basics of thin films.
Author: Angus Rockett Publisher: Springer Science & Business Media ISBN: 0387686509 Category : Technology & Engineering Languages : en Pages : 629
Book Description
This book describes semiconductors from a materials science perspective rather than from condensed matter physics or electrical engineering viewpoints. It includes discussion of current approaches to organic materials for electronic devices. It further describes the fundamental aspects of thin film nucleation and growth, and the most common physical and chemical vapor deposition techniques. Examples of the application of the concepts in each chapter to specific problems or situations are included, along with recommended readings and homework problems.
Author: Eugene A. Irene Publisher: John Wiley & Sons ISBN: 9780471711636 Category : Science Languages : en Pages : 400
Book Description
A thorough introduction to fundamental principles andapplications From its beginnings in metallurgy and ceramics, materials sciencenow encompasses such high- tech fields as microelectronics,polymers, biomaterials, and nanotechnology. Electronic MaterialsScience presents the fundamentals of the subject in a detailedfashion for a multidisciplinary audience. Offering a higher-leveltreatment than an undergraduate textbook provides, this textbenefits students and practitioners not only in electronics andoptical materials science, but also in additional cutting-edgefields like polymers and biomaterials. Readers with a basic understanding of physical chemistry or physicswill appreciate the text's sophisticated presentation of today'smaterials science. Instructive derivations of important formulae,usually omitted in an introductory text, are included here. Thisfeature offers a useful glimpse into the foundations of how thediscipline understands such topics as defects, phase equilibria,and mechanical properties. Additionally, concepts such asreciprocal space, electron energy band theory, and thermodynamicsenter the discussion earlier and in a more robust fashion than inother texts. Electronic Materials Science also features: * An orientation towards industry and academia drawn from theauthor's experience in both arenas * Information on applications in semiconductors, optoelectronics,photocells, and nanoelectronics * Problem sets and important references throughout * Flexibility for various pedagogical needs Treating the subject with more depth than any other introductorytext, Electronic Materials Science prepares graduate andupper-level undergraduate students for advanced topics in thediscipline and gives scientists in associated disciplines a clearreview of the field and its leading technologies.
Author: Roland Levy Publisher: Springer Science & Business Media ISBN: 9780792301547 Category : Technology & Engineering Languages : en Pages : 1006
Book Description
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Author: C.R.M. Grovenor Publisher: CRC Press ISBN: 9780852742709 Category : Science Languages : en Pages : 560
Book Description
This practical book shows how an understanding of structure, thermodynamics, and electrical properties can explain some of the choices of materials used in microelectronics, and can assist in the design of new materials for specific applications. It emphasizes the importance of the phase chemistry of semiconductor and metal systems for ensuring the long-term stability of new devices. The book discusses single-crystal and polycrystalline silicon, aluminium- and gold-based metallisation schemes, packaging semiconductor devices, failure analysis, and the suitability of various materials for optoelectronic devices and solar cells. It has been designed for senior undergraduates, graduates, and researchers in physics, electronic engineering, and materials science.
Author: Eugene Machlin Publisher: Elsevier ISBN: 0080460402 Category : Technology & Engineering Languages : en Pages : 268
Book Description
The subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: •Electrical properties•Magnetic properties•Optical properties•Mechanical properties•Mass transport properties•Interface and junction properties•Defects and properties - Captures the importance of thin films to microelectronic development - Examines the cause / effect relationship of structure on thin film properties
Author: Mikhail Baklanov Publisher: John Wiley & Sons ISBN: 0470065419 Category : Technology & Engineering Languages : en Pages : 508
Book Description
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Author: Anupama B. Kaul Publisher: CRC Press ISBN: 1466509554 Category : Science Languages : en Pages : 464
Book Description
Composed of contributions from top experts, Microelectronics to Nanoelectronics: Materials, Devices and Manufacturability offers a detailed overview of important recent scientific and technological developments in the rapidly evolving nanoelectronics arena. Under the editorial guidance and technical expertise of noted materials scientist Anupama B. Kaul of California Institute of Technology’s Jet Propulsion Lab, this book captures the ascent of microelectronics into the nanoscale realm. It addresses a wide variety of important scientific and technological issues in nanoelectronics research and development. The book also showcases some key application areas of micro-electro-mechanical-systems (MEMS) that have reached the commercial realm. Capitalizing on Dr. Kaul’s considerable technical experience with micro- and nanotechnologies and her extensive research in prestigious academic and industrial labs, the book offers a fresh perspective on application-driven research in micro- and nanoelectronics, including MEMS. Chapters explore how rapid developments in this area are transitioning from the lab to the market, where new and exciting materials, devices, and manufacturing technologies are revolutionizing the electronics industry. Although many micro- and nanotechnologies still face major scientific and technological challenges and remain within the realm of academic research labs, rapid advances in this area have led to the recent emergence of new applications and markets. This handbook encapsulates that exciting recent progress by providing high-quality content contributed by international experts from academia, leading industrial institutions—such as Hewlett-Packard—and government laboratories including the U.S. Department of Energy’s Sandia National Laboratory. Offering something for everyone, from students to scientists to entrepreneurs, this book showcases the broad spectrum of cutting-edge technologies that show significant promise for electronics and related applications in which nanotechnology plays a key role.
Author: William S. Wong Publisher: Springer ISBN: 9780387743622 Category : Technology & Engineering Languages : en Pages : 462
Book Description
This excellent volume covers a range of materials used for flexible electronics, including semiconductors, dielectrics, and metals. The functional integration of these different materials is treated as well. Fundamental issues for both organic and inorganic materials systems are included. A corresponding overview of technological applications, based on each materials system, is presented to give both the non-specialist and the researcher in the field relevant information on the status of the flexible electronics area.
Author: Kim S. Siow Publisher: Springer ISBN: 3319992562 Category : Technology & Engineering Languages : en Pages : 292
Book Description
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Author: Eugene Machlin
Author: Eugene Machlin
Author: Angus Rockett
Author: Eugene A. Irene
Author: Roland Levy
Author: C.R.M. Grovenor
Author: Eugene Machlin
Author: Mikhail Baklanov
Author: Anupama B. Kaul
Author: William S. Wong
Author: Kim S. Siow