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Liquid Phase Epitaxy of InAs1-xSb1-x Using Antimony-rich Melt

Liquid Phase Epitaxy of InAs1-xSb1-x Using Antimony-rich Melt PDF Author: Vishal Chatrath
Publisher:
ISBN:
Category : Antimony
Languages : en
Pages : 156

Book Description


Liquid Phase Epitaxy of InAs1-xSb1-x Using Antimony-rich Melt

Liquid Phase Epitaxy of InAs1-xSb1-x Using Antimony-rich Melt PDF Author: Vishal Chatrath
Publisher:
ISBN:
Category : Antimony
Languages : en
Pages : 156

Book Description


Liquid Phase Epitaxial Growth and Characterization of InAs1-xSb1-x and In1-x GaxSb on 111B InSb Substrates for Infra-red Detectors and Heterojunction Lasers

Liquid Phase Epitaxial Growth and Characterization of InAs1-xSb1-x and In1-x GaxSb on 111B InSb Substrates for Infra-red Detectors and Heterojunction Lasers PDF Author: Jonathan Kwadwo Abrokwah
Publisher:
ISBN:
Category : Epitaxy
Languages : en
Pages : 372

Book Description


Compound and Josephson High-Speed Devices

Compound and Josephson High-Speed Devices PDF Author: Takahiko Misugi
Publisher: Springer Science & Business Media
ISBN: 1475797745
Category : Science
Languages : en
Pages : 311

Book Description
In recent years, III-V devices, integrated circuits, and superconducting integrated circuits have emerged as leading contenders for high-frequency and ultrahigh speed applications. GaAs MESFETs have been applied in microwave systems as low-noise and high-power amplifiers since the early 1970s, replacing silicon devices. The heterojunction high-electron-mobility transistor (HEMT), invented in 1980, has become a key component for satellite broadcasting receiver systems, serving as the ultra-low-noise device at 12 GHz. Furthermore, the heterojunction bipolar transistor (HBT) has been considered as having the highest switching speed and cutoff frequency in the semiconductor device field. Initially most of these devices were used for analog high-frequency applications, but there is also a strong need to develop high-speed III-V digital devices for computer, telecom munication, and instrumentation systems, to replace silicon high-speed devices, because of the switching-speed and power-dissipation limitations of silicon. The potential high speed and low power dissipation of digital integrated circuits using GaAs MESFET, HEMT, HBT, and superconducting Josephson junction devices has evoked tremendous competition in the race to develop such technology. A technology review shows that Japanese research institutes and companies have taken the lead in the development of these devices, and some integrated circuits have already been applied to supercomputers in Japan. The activities of Japanese research institutes and companies in the III-V and superconducting device fields have been superior for three reasons. First, bulk crystal growth, epitaxial growth, process, and design technology were developed at the same time.

Semiconductor Alloys

Semiconductor Alloys PDF Author: An-Ben Chen
Publisher: Springer Science & Business Media
ISBN: 1461303176
Category : Science
Languages : en
Pages : 358

Book Description
In the first comprehensive treatment of these technologically important materials, the authors provide theories linking the properties of semiconductor alloys to their constituent compounds. Topics include crystal structures, bonding, elastic properties, phase diagrams, band structures, transport, ab-initio theories, and semi-empirical theories. Each chapter includes extensive tables and figures as well as problem sets.

Semiconductor Materials

Semiconductor Materials PDF Author: B.G. Yacobi
Publisher: Springer Science & Business Media
ISBN: 0306479427
Category : Technology & Engineering
Languages : en
Pages : 233

Book Description
The technological progress is closely related to the developments of various materials and tools made of those materials. Even the different ages have been defined in relation to the materials used. Some of the major attributes of the present-day age (i.e., the electronic materials’ age) are such common tools as computers and fiber-optic telecommunication systems, in which semiconductor materials provide vital components for various mic- electronic and optoelectronic devices in applications such as computing, memory storage, and communication. The field of semiconductors encompasses a variety of disciplines. This book is not intended to provide a comprehensive description of a wide range of semiconductor properties or of a continually increasing number of the semiconductor device applications. Rather, the main purpose of this book is to provide an introductory perspective on the basic principles of semiconductor materials and their applications that are described in a relatively concise format in a single volume. Thus, this book should especially be suitable as an introductory text for a single course on semiconductor materials that may be taken by both undergraduate and graduate engineering students. This book should also be useful, as a concise reference on semiconductor materials, for researchers working in a wide variety of fields in physical and engineering sciences.

Oriented Crystallization on Amorphous Substrates

Oriented Crystallization on Amorphous Substrates PDF Author: E.I. Givargizov
Publisher: Springer Science & Business Media
ISBN: 1489925600
Category : Technology & Engineering
Languages : en
Pages : 377

Book Description
Present-day scienceand technology have become increasingly based on studies and applications of thin films. This is especiallytrue of solid-state physics, semiconduc tor electronics, integrated optics, computer science, and the like. In these fields, it is necessary to use filmswith an ordered structure, especiallysingle-crystallinefilms, because physical phenomena and effects in such films are most reproducible. Also, active parts of semiconductor and other devices and circuits are created, as a rule, in single-crystal bodies. To date, single-crystallinefilms have been mainly epitaxial (or heteroepitaxial); i.e., they have been grown on a single-crystalline substrate, and principal trends, e.g., in the evolution of integrated circuits (lCs), have been based on continuing reduction in feature size and increase in the number of components per chip. However, as the size decreases into the submicrometer range, technological and physical limitations in integrated electronics become more and more severe. It is generally believed that a feature size of about 0.1um will have a crucial character. In other words, the present two-dimensional ICs are anticipated to reach their limit of minimization in the near future, and it is realized that further increase of packing density and/or functions might depend on three-dimensional integration. To solve the problem, techniques for preparation of single-crystalline films on arbitrary (including amorphous) substrates are essential.

Field Emission in Vacuum Microelectronics

Field Emission in Vacuum Microelectronics PDF Author: George N. Fursey
Publisher: Springer Science & Business Media
ISBN: 0387274197
Category : Science
Languages : en
Pages : 216

Book Description
Field emission is a phenomenon described by quantum mechanics. Its emission capability is millions times higher than that of any other known types of electron emission. Nowadays this phenomenon is experiencing a new life due to wonderful applications in the atomic resolution microscopy, in electronic holography, and in the vacuum micro- and nanoelectronics in general. The main field emission properties, and some most remarkable experimental facts and applications, are described in this book.

Rapid Thermal Processing of Semiconductors

Rapid Thermal Processing of Semiconductors PDF Author: Victor E. Borisenko
Publisher: Boom Koninklijke Uitgevers
ISBN: 9780306450549
Category : Science
Languages : en
Pages : 384

Book Description
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.

Semiconductor Device Physics and Simulation

Semiconductor Device Physics and Simulation PDF Author: J.S. Yuan
Publisher: Springer Science & Business Media
ISBN: 9780306457241
Category : Technology & Engineering
Languages : en
Pages : 352

Book Description
The advent of the microelectronics technology has made ever-increasing numbers of small devices on a same chip. The rapid emergence of ultra-large-scaled-integrated (ULSI) technology has moved device dimension into the sub-quarter-micron regime and put more than 10 million transistors on a single chip. While traditional closed-form analytical models furnish useful intuition into how semiconductor devices behave, they no longer provide consistently accurate results for all modes of operation of these very small devices. The reason is that, in such devices, various physical mechanisms affect the device performance in a complex manner, and the conventional assumptions (i. e. , one-dimensional treatment, low-level injection, quasi-static approximation, etc. ) em ployed in developing analytical models become questionable. Thus, the use of numerical device simulation becomes important in device modeling. Researchers and engineers will rely even more on device simulation for device design and analysis in the future. This book provides comprehensive coverage of device simulation and analysis for various modem semiconductor devices. It will serve as a reference for researchers, engineers, and students who require in-depth, up-to-date information and understanding of semiconductor device physics and characteristics. The materials of the book are limited to conventional and mainstream semiconductor devices; photonic devices such as light emitting and laser diodes are not included, nor does the book cover device modeling, device fabrication, and circuit applications.

The Physics of Submicron Lithography

The Physics of Submicron Lithography PDF Author: Kamil A. Valiev
Publisher: Springer Science & Business Media
ISBN: 146153318X
Category : Science
Languages : en
Pages : 502

Book Description
This book is devoted to the physics of electron-beam, ion-beam, optical, and x-ray lithography. The need for this book results from the following considerations. The astonishing achievements in microelectronics are in large part connected with successfully applying the relatively new technology of processing (changing the prop erties of) a material into a device whose component dimensions are submicron, called photolithography. In this method the device is imaged as a pattern on a metal film that has been deposited onto a transparent substrate and by means of a broad stream of light is transferred to a semiconductor wafer within which the physical structure of the devices and the integrated circuit connections are formed layer by layer. The smallest dimensions of the device components are limited by the diffraction of the light when the pattern is transferred and are approximately the same as the wavelength of the light. Photolithography by light having a wavelength of A ~ 0.4 flm has made it possible to serially produce integrated circuits having devices whose minimal size is 2-3 flm in the 4 pattern and having 10-105 transistors per circuit.