Jet Impingement Cooling for Space-based Electronics PDF Download

Author: Chris Schaffer
Publisher:
ISBN:
Category :
Languages : en
Pages : 78

View

Book Description

Author: Sarah Elizabeth Styslinger
Publisher:
ISBN:
Category : Electronics
Languages : en
Pages : 142

View

Book Description

Author: Robert Skuriat
Publisher:
ISBN:
Category :
Languages : en
Pages :

View

Book Description
The aim of the work presented in this thesis is to improve the operational reliability of a power module and increase the efficiency of its associated cooling system by integrating the design of the cooler as part of the module. Power modules are increasingly used in a variety of applications ranging from aircraft and mass transport systems, to motor control and power conversion in the home. Reliability of the power module is very important in aerospace applications where the highest levels of safety and robustness are required while keeping the volume and mass of the module as low as possible. Certain parts of the power module such as the solder layer beneath the silicon device and the substrate are prone to failure with thermal cycling. The layer of thermal grease between the baseplate of the module and the heats ink significantly increases the thermal resistance between the electronic devices and the coolant fluid. The power module can be constructed so that some of the interfaces within the module which are prone to failure are improved or completely removed from the assembly greatly reducing the thermal resistance from junction to ambient. The research identified cooling methods which are able to cope with the increasingly high heat fluxes produced by power electronic devices. Jet impingement cooling was selected for testing and further development. An initial series of tests confirmed that liquid jet impingement can be used to generate high heat transfer coefficients for the efficient cooling of power modules. Results from experimental tests showed that directly cooling the substrate tile with jet impingement resulted in the devices being cooled more effectively compared to the commonly used serpentine coldplate and a direct-baseplate cooled jet impingement system. It was postulated that more efficient cooling can be achieved by targeting the hotspots on the substrate beneath each device with a carefully designed impingement array. A test apparatus was constructed to test a variety of jet impingement arrays to confirm the hypothesis. A second test apparatus was constructed to characterise the performance of the jet arrays in more detail using a thermal imaging camera to monitor the surface temperature of a single device. An optimal jet configuration was found for the efficient cooling of a single device. The work concluded that an improvement in efficiency and reliability can be gained by constructing power modules with integrated jet impingement arrays direct-substrate cooling the hotspots beneath the devices.

Author: Tanvir Ahmed Chowdhury
Publisher:
ISBN:
Category :
Languages : en
Pages : 0

View

Book Description
The current trend in microelectronics is to manufacture devices with increased computational powers and reduced size. These devices with increased power densities are consequently subject to extreme thermal loads. Thermal management of these power loads is extremely challenging. The presence of the hotspots can make this challenge even more difficult. Jet impingement cooling is one of the top candidates for removing such extreme heat fluxes in microelectronics. Jet impingement cooling can achieve heat transfer coefficients (HTCs) due to its normal incident flow-field and ability to thin the local thermal boundary layer in the stagnation region. This dissertation presents the hotspot cooling performance for a confined jet impingement cooling configuration. This dissertation is divided into two parts. The first part presents the experimental data attained for single-phase water jet impingement cooling. Also investigated is the spatial dependence of the HTC relative to the offset between the jet/wall stagnation point and the center of the local hotspot. A theoretical model to predict the HTC as a function of jet-to-hotspot offset ratio and heating frequency is also derived. The second part presents hotspot cooling performance for the two-phase confined jet cooling performance. Electrically non-conductive fluids such as Novec 7100, Novec 7200, FC 72, and Ethanol were used as coolants for this part of the study. This study investigates the nucleate boiling regime as a function of the Reynolds number/Jet Velocity for these fluids. Additionally, this dissertation also presents the nucleate boiling regime as a function of the distance between the hotspot center and the jet stagnation point. Finally, a stagnation zone CHF prediction model is derived. Findings from this research will help thermal control engineers write active cooling algorithms to maintain the desired temperature at minimal pumping cost. This research will also help thermal designers to select appropriate coolants and design the device.

Author: I. Rushyendran Isapen
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 268

View

Book Description

Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 0

View

Book Description
Jet impingement has been an attractive cooling option in a number of industries over the past few decades. Over the past 15 years, jet impingement has been explored as a cooling option in microelectronics. Recently, interest has been expressed by the automotive industry in exploring jet impingement for cooling power electronics components. This technical report explores, from a modeling perspective, both single-phase and boiling jet impingement cooling in power electronics, primarily from a heat transfer viewpoint. The discussion is from the viewpoint of the cooling of IGBTs (insulated-gate bipolar transistors), which are found in hybrid automobile inverters.

Author: National Renewable Energy Laboratory (Nr
Publisher: Scholar's Choice
ISBN: 9781297043895
Category :
Languages : en
Pages : 74

View

Book Description
This work has been selected by scholars as being culturally important, and is part of the knowledge base of civilization as we know it. This work was reproduced from the original artifact, and remains as true to the original work as possible. Therefore, you will see the original copyright references, library stamps (as most of these works have been housed in our most important libraries around the world), and other notations in the work. This work is in the public domain in the United States of America, and possibly other nations. Within the United States, you may freely copy and distribute this work, as no entity (individual or corporate) has a copyright on the body of the work.As a reproduction of a historical artifact, this work may contain missing or blurred pages, poor pictures, errant marks, etc. Scholars believe, and we concur, that this work is important enough to be preserved, reproduced, and made generally available to the public. We appreciate your support of the preservation process, and thank you for being an important part of keeping this knowledge alive and relevant.

Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 60

View

Book Description
Jet impingement has been an attractive cooling option in a number of industries over the past few decades. Over the past 15 years, jet impingement has been explored as a cooling option in microelectronics. Recently, interest has been expressed by the automotive industry in exploring jet impingement for cooling power electronics components. This technical report explores, from a modeling perspective, both single-phase and boiling jet impingement cooling in power electronics, primarily from a heat transfer viewpoint. The discussion is from the viewpoint of the cooling of IGBTs (insulated-gate bipolar transistors), which are found in hybrid automobile inverters.

Author: Stephen Michael Walsh (Ensign.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 93

View

Book Description

Author: Xin Feng
Publisher:
ISBN:
Category : Electronic dissertations
Languages : en
Pages :

View

Book Description
Among the thermal management solutions for power electronics, two-phase jet or spray impingement cooling are two promising candidates. In this study, electrohydrodynamic atomization (EHDA) method is used to generate spray and jet from the same capillary. This approach enables us to compare the heat transfer coefficient and critical heat flux (CHF) in consistent conditions. Two nondimensional parameters are first developed to lay out the various EHDA modes of ethanol. The experimental results show that the EHDA cooling could enhance the heat transfer coefficient in most conditions, while it could not benefit CHF because the electric repulsive force causes a wide spray angle and less impinging mass flux on the surface. Single and multi micro jet impingement cooling (MJIC) are investigated. Based on the experimental observation and analytical works, a semi-theoretical CHF correlation is proposed based on force and energy balance. The experimental data of water and ethanol are predicted very well by the new model. It also shows the potential to explain the unique feature on the CHF curves of saturated HFE7000 and subcooled ethanol. By using multi MJIC, heat transfer coefficient and CHF might be improved, which mainly depend on fluids and testing conditions.